Patents by Inventor Kazumitsu Imahara

Kazumitsu Imahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Defect repair apparatus for an electronic device
    Patent number: 7126232
    Abstract: A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD of other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged. An electronic device is described incorporating a substrate; and a plurality of thin films laminated on the substrate and part of the thin films are formed on a predetermined circuit pattern, wherein a transfer film for repairing a defect is fitted into a recess where the low layers of the thin films are exposed by removing part of a single or multi-layer thin films covering a defective portion included on the thin films and its surrounding portion.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: October 24, 2006
    Assignee: AU Optronics Corporation
    Inventors: Kazumitsu Imahara, Kakehiko Wada
  • Electronic device and defect repair method thereof
    Publication number: 20050032285
    Abstract: A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD of other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged. An electronic device is described incorporating a substrate; and a plurality of thin films laminated on the substrate and part of the thin films are formed on a predetermined circuit pattern, wherein a transfer film for repairing a defect is fitted into a recess where the low layers of the thin films are exposed by removing part of a single or multi-layer thin films covering a defective portion included on the thin films and its surrounding portion.
    Type: Application
    Filed: September 1, 2004
    Publication date: February 10, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kazumitsu Imahara, Kakehiko Wada
  • Electronic device and defect repair method thereof
    Patent number: 6809332
    Abstract: A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD or other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged. An electronic device is described incorporating a substrate; and a plurality of thin films laminated on the substrate and part of the thin films are formed on a predetermined circuit pattern, wherein a transfer film for repairing a defect is fitted into a recess where the low layers of the thin films are exposed by removing part of a single or multi-layer thin films covering a defective portion included on the thin films and its surrounding portion.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: October 26, 2004
    Assignee: International Business Machines Corporation
    Inventors: Kazumitsu Imahara, Kakehiko Wada
  • Electronic device and defect repair method thereof
    Publication number: 20020164537
    Abstract: A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD or other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged.
    Type: Application
    Filed: June 27, 2002
    Publication date: November 7, 2002
    Inventors: Kazumitsu Imahara, Kakehiko Wada
  • Method of repairing a defective portion in an electronic device
    Patent number: 6436602
    Abstract: A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD or other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged. An electronic device is described incorporating a substrate; and a plurality of thin films laminated on the substrate and part of the thin films are formed on a predetermined circuit pattern, wherein a transfer film for repairing a defect is fitted into a recess where the low layers of the thin films are exposed by removing part of a single or multi-layer thin films covering a defective portion included on the thin films and its surrounding portion.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: August 20, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kazumitsu Imahara, Kakehiko Wada