Abstract: A microphone has: a printed circuit board provided with a first sound hole; a microphone element mounted on a first surface of the printed circuit board so as to cover the first sound hole; a microphone casing provided with a second sound hole opposite to the first sound hole, and housing the printed circuit board so that the second sound hole; and a bush provided with a third sound hole, and having a first contact surface and a second contact surface. The third sound hole is disposed between the first and second sound holes to be communicated with the holes. The first contact surface is in contact with a second surface of the printed circuit board at a first end of the third sound hole. The second contact surface is in contact with an inner surface of the microphone casing at a second end of the third sound hole.

Abstract: A microphone structure has a diaphragm; a frame of which an inside is processed in a shape of a semispherical surface, a parabolic surface, or a conical surface; an acoustic transducer that converts sound pressure into an electric signal; and a wire that transmits the electric signal from the acoustic transducer to outside. A sound pressure input surface of the acoustic transducer is disposed on a bottom surface portion of the semispherical surface, the parabolic surface, or the conical surface inside the frame. The diaphragm and the frame, and the frame and the wire include waterproof mechanisms preventing ingress of water.

Abstract: A microphone has: a printed circuit board provided with a first sound hole; a microphone element mounted on a first surface of the printed circuit board so as to cover the first sound hole; a microphone casing provided with a second sound hole opposite to the first sound hole, and housing the printed circuit board so that the second sound hole; and a bush provided with a third sound hole, and having a first contact surface and a second contact surface. The third sound hole is disposed between the first and second sound holes to be communicated with the holes. The first contact surface is in contact with a second surface of the printed circuit board at a first end of the third sound hole. The second contact surface is in contact with an inner surface of the microphone casing at a second end of the third sound hole.

Abstract: A portable unit for smart entry is equipped with one or more holes through which a sound pressure is input and a sound conversion element, disposed behind the hole, for converting the sound pressure into an electrical signal. The portable unit is also equipped with a voice recognition device which processes the electrical signal obtained by the conversion using a predetermined particular spoken voice as a voice key. A vehicle door or the like is opened or closed in response to input of the voice key.

Abstract: A microphone structure has a diaphragm; a frame of which an inside is processed in a shape of a semispherical surface, a parabolic surface, or a conical surface; an acoustic transducer that converts sound pressure into an electric signal; and a wire that transmits the electric signal from the acoustic transducer to outside. A sound pressure input surface of the acoustic transducer is disposed on a bottom surface portion of the semispherical surface, the parabolic surface, or the conical surface inside the frame. The diaphragm and the frame, and the frame and the wire include waterproof mechanisms preventing ingress of water.

Abstract: In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

Abstract: In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

Abstract: In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

Abstract: In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

Abstract: A condenser sensor (10) comprises an electrically conductive case (20) having an opening portion (22a) formed therein and an opposing portion (22b) opposing to and spaced apart from the opening portion (22a); a fixed electrode (30) received in the electrically conductive case (20) through the opening portion (22a); an electrically conductive diaphragm (51) accommodated in the electrically conductive case (20), the electrically conductive diaphragm (51) spaced apart from the fixed electrode (30) and opposing to the opening portion (22a); an electrically conductive diaphragm supporting member (52) disposed in the electrically conductive case (20) to support the diaphragm (51); a circuit packaging board (60) disposed in the electrically conductive case (20) to be held in electrical contact with the fixed electrode (30) and the diaphragm (51) respectively through the electrically conductive case (20) and the diaphragm supporting member (52); and deformation protecting member (32) for protecting the opposing porti

Abstract: A condenser sensor (10) comprises an electrically conductive case (20) having an opening portion (22a) formed therein and an opposing portion (22b) opposing to and spaced apart from the opening portion (22a); a fixed electrode (30) received in the electrically conductive case (20) through the opening portion (22a); an electrically conductive diaphragm (51) accommodated in the electrically conductive case (20), the electrically conductive diaphragm (51) spaced apart from the fixed electrode (30) and opposing to the opening portion (22a); an electrically conductive diaphragm supporting member (52) disposed in the electrically conductive case (20) to support the diaphragm (51); a circuit packaging board (60) disposed in the electrically conductive case (20) to be held in electrical contact with the fixed electrode (30) and the diaphragm (51) respectively through the electrically conductive case (20) and the diaphragm supporting member (52); and deformation protecting member (32) for protecting the opposing porti