Patents by Inventor Kazumoto Fujita

Kazumoto Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die pad structure for solder bonding
    Patent number: 5844306
    Abstract: A lead frame having a die pad of such a shape that prevents scattering of solder to lead when a chip is mounted on the lead frame, and a semiconductor device using such a lead frame are provided. The lead frame includes a die pad having a region surrounded by a first side, a second side opposing to the first side, a third side different from the first and second sides, and a fourth side opposing to the third side, and a lead formed of a conductor and electrically connected to a semiconductor element. The die pad includes a notch extending along the first and the second sides and positioned opposing to a main surface of the semiconductor element, and a through hole extending along the third and fourth sides and positioned opposing to the main surface of the semiconductor element. The semiconductor device employs the die pad.
    Type: Grant
    Filed: January 24, 1996
    Date of Patent: December 1, 1998
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Shikoku Instrumentation Co., Ltd.
    Inventors: Kazumoto Fujita, Takashi Iwata, Tetsuya Kurokawa