Abstract: A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a surface of a wiring board which has a plurality of openings and on which a semiconductor chip is mounted via an elastic material. The second die is disposed on a back surface of the wiring board opposite the surface on which the semiconductor chip is mounted. The mold is used for sealing with an insulating resin the periphery of the semiconductor chip and at least one of the openings of the wiring board, wherein the above-described second die has a protrusion around an area overlapping the opening to be sealed with the insulating resin.

Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.

Abstract: An object of the present invention is to provide a technology that can seal the opening of the interposer by transfer mold with the leak of the insulating resin from the above-described opening prevented.

Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.