Abstract: In one embodiment, a data storage media comprises: a substrate comprising at least one plastic portion, an edge lift height of less than about 8?, and an axial displacement peak of less than about 500? under shock or vibration excitation; and at least one data layer on said substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate. In another embodiment, the data storage media comprises: a substrate comprising at least one plastic portion and an axial displacement peak of less than about 500? under shock or vibration excitation, and an areal density of about 10 Gbit/in2; and at least one data layer on the substrate.

Abstract: In one embodiment, the data storage media can comprise: a substrate, a data layer, and a reflective layer disposed between the data layer and the substrate. The substrate can comprise a substrate material selected from the group consisting of polyphenylene ether, blends comprising polyphenylene ether, copolymers comprising polyphenylene ether, mixtures comprising polyphenylene ether, reaction products of a compostion comprising polyphenylene ether, and composites comprising polyphenylene ether. The data layer can comprise a material selected from the group consisting of organic dye and inorganic phase change materials. The storage media can comprise imprinted features. In another embodiment, the first surface data storage media can comprise: a substrate, a reflective layer on a first side of the substrate, and a protective layer disposed on a side of the substrate opposite the first side. The protective layer can comprise silicon dioxide. The first surface data storage media comprises imprinted features.

Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: Disclosed herein is a method for retrieving data from a storage media. The method comprises: rotating a storage media having a substrate comprising at least one plastic resin portion and at least one data layer disposed on at least one surface of said substrate, wherein said substrate has a surface roughness of less than about 10 Å, and an axial displacement peak of less than about 500&mgr; under shock or vibration excitation; directing an energy field at said storage media such that said energy field is incident upon the data layer before it can be incident upon the substrate; and retrieving information from the data layer via said energy field.

Abstract: In one embodiment, a data storage media comprises: a substrate comprising at least one plastic portion, an edge lift height of less than about 8&mgr;, and an axial displacement peak of less than about 500&mgr; under shock or vibration excitation; and at least one data layer on said substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate.

Abstract: The data storage media comprises, in a preferred embodiment, a homogenous or non-homogenous plastic substrate that can be formed in situ with the desired surface features disposed thereon on one or both sides, a data storage layer such as a magneto-optic material also on one or both sides, and an optional protective, dielectric, and/or reflective layers. The substrate can have a substantially homogenous, tapered, concave, or convex geometry, with various types and geometries of reinforcement employed to increase stiffness without adversely effecting surface integrity and smoothness.

Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.