Patents by Inventor Kazunao Oniki
Kazunao Oniki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10634862Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: GrantFiled: November 26, 2018Date of Patent: April 28, 2020Assignee: Sony CorporationInventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Patent number: 10483413Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.Type: GrantFiled: April 23, 2015Date of Patent: November 19, 2019Assignee: Sony CorporationInventors: Hiizu Ootorii, Kazunao Oniki, Koki Uchino, Hideyuki Suzuki, Hiroshi Ozaki, Kazuki Sano, Eiji Otani, Shinji Rokuhara, Kiwamu Adachi, Shuichi Oka, Shusaku Yanagawa, Hiroshi Morita, Takeshi Ogura
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Publication number: 20190094477Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: ApplicationFiled: November 26, 2018Publication date: March 28, 2019Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Patent number: 10168498Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: GrantFiled: April 3, 2017Date of Patent: January 1, 2019Assignee: Sony CorporationInventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Patent number: 9823426Abstract: There is provided an optical communication device including a lens substrate configured to have a first face on which a plurality of lenses corresponding to a plurality of channels of optical communication are two-dimensionally formed, and a ferrule configured to be disposed facing a second face that is the opposite face of the first face of the lens substrate and to be provided with through holes into which optical fibers are inserted in positions corresponding to each of the plurality of lenses.Type: GrantFiled: October 21, 2014Date of Patent: November 21, 2017Assignee: Sony CorporationInventors: Kazunao Oniki, Hiizu Ootorii, Eiji Otani
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Patent number: 9748707Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.Type: GrantFiled: May 11, 2016Date of Patent: August 29, 2017Assignee: SONY CORPORATIONInventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
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Publication number: 20170205596Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: ApplicationFiled: April 3, 2017Publication date: July 20, 2017Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Publication number: 20170170339Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.Type: ApplicationFiled: April 23, 2015Publication date: June 15, 2017Inventors: Hiizu OOTORII, Kazunao ONIKI, Koki UCHINO, Hideyuki SUZUKI, Hiroshi OZAKI, Kazuki SANO, Eiji OTANI, Shinji ROKUHARA, Kiwamu ADACHI, Shuichi OKA, Shusaku YANAGAWA, Hiroshi MORITA, Takeshi OGURA
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Patent number: 9614347Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: GrantFiled: November 12, 2014Date of Patent: April 4, 2017Assignee: Sony CorporationInventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Patent number: 9553383Abstract: A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.Type: GrantFiled: July 12, 2016Date of Patent: January 24, 2017Assignee: Sony Semiconductor Solutions CorporationInventor: Kazunao Oniki
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Publication number: 20160322725Abstract: A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.Type: ApplicationFiled: July 12, 2016Publication date: November 3, 2016Inventor: Kazunao ONIKI
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Publication number: 20160254622Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.Type: ApplicationFiled: May 11, 2016Publication date: September 1, 2016Inventors: Akira AKIBA, Mitsuo HASHIMOTO, Shinya MORITA, Shun MITARAI, Mikihiro TAKETOMO, Kazunao ONIKI, Koichi IKEDA
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Patent number: 9407023Abstract: A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.Type: GrantFiled: May 23, 2014Date of Patent: August 2, 2016Assignee: Sony CorporationInventor: Kazunao Oniki
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Patent number: 9362683Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.Type: GrantFiled: January 23, 2014Date of Patent: June 7, 2016Assignee: SONY CORPORATIONInventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
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Publication number: 20150145086Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: ApplicationFiled: November 12, 2014Publication date: May 28, 2015Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Publication number: 20150139590Abstract: There is provided an optical communication device including a lens substrate configured to have a first face on which a plurality of lenses corresponding to a plurality of channels of optical communication are two-dimensionally formed, and a ferrule configured to be disposed facing a second face that is the opposite face of the first face of the lens substrate and to be provided with through holes into which optical fibers are inserted in positions corresponding to each of the plurality of lenses.Type: ApplicationFiled: October 21, 2014Publication date: May 21, 2015Inventors: Kazunao Oniki, Hiizu Ootorii, Eiji Otani
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Publication number: 20140364004Abstract: A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.Type: ApplicationFiled: May 23, 2014Publication date: December 11, 2014Applicant: Sony CorporationInventor: Kazunao ONIKI
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Publication number: 20140235102Abstract: A signal transmission cable comprises a cable including a dielectric layer and a metallic layer; and a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.Type: ApplicationFiled: January 23, 2014Publication date: August 21, 2014Applicant: SONY CORPORATIONInventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
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Patent number: 8243449Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.Type: GrantFiled: December 10, 2009Date of Patent: August 14, 2012Assignee: Sony CorporationInventors: Kazunao Oniki, Takashi Yajima
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Publication number: 20110253345Abstract: [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible. [Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G).Type: ApplicationFiled: December 11, 2009Publication date: October 20, 2011Applicants: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, SONY CORPORATIONInventors: Hiroyuki Ryoson, Takashi Yajima, Kazunao Oniki, Hiroto Kasai, Koji Hirata, Mitsuo Hashimoto