Patents by Inventor Kazunao Oniki

Kazunao Oniki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10634862
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: April 28, 2020
    Assignee: Sony Corporation
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Patent number: 10483413
    Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: November 19, 2019
    Assignee: Sony Corporation
    Inventors: Hiizu Ootorii, Kazunao Oniki, Koki Uchino, Hideyuki Suzuki, Hiroshi Ozaki, Kazuki Sano, Eiji Otani, Shinji Rokuhara, Kiwamu Adachi, Shuichi Oka, Shusaku Yanagawa, Hiroshi Morita, Takeshi Ogura
  • Publication number: 20190094477
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Application
    Filed: November 26, 2018
    Publication date: March 28, 2019
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Patent number: 10168498
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: January 1, 2019
    Assignee: Sony Corporation
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Patent number: 9823426
    Abstract: There is provided an optical communication device including a lens substrate configured to have a first face on which a plurality of lenses corresponding to a plurality of channels of optical communication are two-dimensionally formed, and a ferrule configured to be disposed facing a second face that is the opposite face of the first face of the lens substrate and to be provided with through holes into which optical fibers are inserted in positions corresponding to each of the plurality of lenses.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: November 21, 2017
    Assignee: Sony Corporation
    Inventors: Kazunao Oniki, Hiizu Ootorii, Eiji Otani
  • Patent number: 9748707
    Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: August 29, 2017
    Assignee: SONY CORPORATION
    Inventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
  • Publication number: 20170205596
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Application
    Filed: April 3, 2017
    Publication date: July 20, 2017
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Publication number: 20170170339
    Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.
    Type: Application
    Filed: April 23, 2015
    Publication date: June 15, 2017
    Inventors: Hiizu OOTORII, Kazunao ONIKI, Koki UCHINO, Hideyuki SUZUKI, Hiroshi OZAKI, Kazuki SANO, Eiji OTANI, Shinji ROKUHARA, Kiwamu ADACHI, Shuichi OKA, Shusaku YANAGAWA, Hiroshi MORITA, Takeshi OGURA
  • Patent number: 9614347
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: April 4, 2017
    Assignee: Sony Corporation
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Patent number: 9553383
    Abstract: A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: January 24, 2017
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Kazunao Oniki
  • Publication number: 20160322725
    Abstract: A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Inventor: Kazunao ONIKI
  • Publication number: 20160254622
    Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Application
    Filed: May 11, 2016
    Publication date: September 1, 2016
    Inventors: Akira AKIBA, Mitsuo HASHIMOTO, Shinya MORITA, Shun MITARAI, Mikihiro TAKETOMO, Kazunao ONIKI, Koichi IKEDA
  • Patent number: 9407023
    Abstract: A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: August 2, 2016
    Assignee: Sony Corporation
    Inventor: Kazunao Oniki
  • Patent number: 9362683
    Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 7, 2016
    Assignee: SONY CORPORATION
    Inventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
  • Publication number: 20150145086
    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 28, 2015
    Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
  • Publication number: 20150139590
    Abstract: There is provided an optical communication device including a lens substrate configured to have a first face on which a plurality of lenses corresponding to a plurality of channels of optical communication are two-dimensionally formed, and a ferrule configured to be disposed facing a second face that is the opposite face of the first face of the lens substrate and to be provided with through holes into which optical fibers are inserted in positions corresponding to each of the plurality of lenses.
    Type: Application
    Filed: October 21, 2014
    Publication date: May 21, 2015
    Inventors: Kazunao Oniki, Hiizu Ootorii, Eiji Otani
  • Publication number: 20140364004
    Abstract: A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.
    Type: Application
    Filed: May 23, 2014
    Publication date: December 11, 2014
    Applicant: Sony Corporation
    Inventor: Kazunao ONIKI
  • Publication number: 20140235102
    Abstract: A signal transmission cable comprises a cable including a dielectric layer and a metallic layer; and a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Application
    Filed: January 23, 2014
    Publication date: August 21, 2014
    Applicant: SONY CORPORATION
    Inventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
  • Patent number: 8243449
    Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: August 14, 2012
    Assignee: Sony Corporation
    Inventors: Kazunao Oniki, Takashi Yajima
  • Publication number: 20110253345
    Abstract: [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible. [Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G).
    Type: Application
    Filed: December 11, 2009
    Publication date: October 20, 2011
    Applicants: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, SONY CORPORATION
    Inventors: Hiroyuki Ryoson, Takashi Yajima, Kazunao Oniki, Hiroto Kasai, Koji Hirata, Mitsuo Hashimoto