Abstract: Methods are disclosed for making reticles for charged-particle-beam (CPB) microlithography and for using such reticle for making CPB microlithographic exposures using divided-pattern exposure. The reticles are made using data, generated from corresponding LSI design data by a “data generator” (e.g., computer), and stored as a reticle-pattern data file in a memory. Corresponding data for controlling a CPB microlithographic exposure apparatus (using the reticle) are stored in an exposure data file. Of the data stored in these files, the reticle-pattern data is routed to a host computer for a reticle-writing device. The reticle writing device produces a pattern on a segmented reticle according to the data. Exposure data corresponding to the reticle-pattern data are routed to a host computer of a CPB microlithographic exposure apparatus.

Abstract: Methods are disclosed for improving the yield of acceptable product from microlithography using a charged particle beam. According to the methods, exposure defects caused by an unsuitable stage velocity are reduced, and exposure-defect areas can be re-exposed after detection of an exposure defect. In preparation for exposure, pattern data are read. Next, stage position is read, and stage velocity is calculated. A determination is made of whether the stage velocity is greater than a specified value. If the stage velocity is greater than the specified value, the stage velocity is decreased to avoid exceeding a velocity limit at which continuous exposure is impossible. Exposure of the die commences. If exposure of all of the pattern portions of the die are successfully completed, then processing is terminated. If exposure of all the pattern portions were not successfully completed, processing returns to the step at which the error occurred and repeated.

Abstract: Apparatus and methods are disclosed for increasing the throughput and accuracy of a charged-particle-beam (CPB) exposure apparatus. The apparatus comprises a CPB optical system for exposing a pattern onto a sensitive substrate in a vacuum chamber. During exposure, the substrate is placed on a movable stage. If the substrate temperature is not equal to the exposure-environment temperature, calibrated data on a temperature-correction factor of the substrate is obtained and used to convert XY coordinates for an exposure-environment temperature exposure of the substrate into corrected XY coordinates for exposure at the actual substrate temperature. Exposure of the substrate is positionally accurate even if, after exposure, the substrate undergoes expansion or contraction as the substrate equilibrates with the exposure-environment temperature.

Abstract: An apparatus for inspecting a pattern consisting of light and dark areas formed on a planar test specimen according to design information, comprising: an imaging device for viewing the pattern to generate image information; a detector for generating a first signal upon detection that, in response to the image information, a boundary line between the light and dark areas of the pattern is bent in a determined stepping form in the direction of the plane; a memory for generating and storing a second signal, upon detection that the boundary line of the pattern has a bend of stepping form according to the design information, corresponding to the position in the imaging area of the bend in the design information; and an inspecting device for discriminating, upon generation of the first signal, the presence or absence of the second signal in the memory corresponding to the position of the first signal in the image area.

Abstract: Two-dimensional pattern detecting apparatus provided with register for serially receiving binary signals obtained from analog signals of a two-dimensional pattern and adapted to divide the pattern into pixels and to represent the density of bright and dark for pixels by the binary signals. The apparatus further includes a processing circuit adapted to compare with predetermined patterns a pattern composed of 8 peripheral pixels of a partial area of 3.times.3 pixels within the two-dimensional pattern, on the basis of the binary signals stored in the register. The processing circuit outputs a binary signal of a logic value stored in said register corresponding to a central pixel of the partial area when the pattern of the 8 pixels coincides with one of said predetermined patterns, and to outputs a binary signal of a logic value prevailing in 8 binary signals stored in the register corresponding to the 8 pixels when the pattern of the 8 pixels does not coincide with any of the predetermined patterns.

Abstract: A pattern examining in which a pattern on an examined object such as reticle or mask is scanned to produce image binary signals of picture elements; binary information corresponding to a local area on the examined object is serially extracted from the image binary signals; and shape detection is effected for detecting by means of the binary information whether or not the pattern in the local area possesses a determined geometric shape or characteristics. The result of the shape detection is compared with the information on design relating to the geometric shape or characteristics which the pattern on the examined object should possess.

Abstract: A pattern defect testing apparatus comprises a first detection circuit which defines a first detection area on a two-dimensional pattern and produces a first detection signal when all digital signals representative of densities of picture cells in the first detection area have the same logical value, a second detection circuit which defines a second detection area on the two-dimensional pattern and produces a second detection signal when at least one of digital signals representative of densities of picture cells in the second detection area has a logical value different from that of the digital signals to the first detection circuit, and a discriminating circuit for discriminating the presence of a defect in the second detection area when the first and second detection signals are produced.