Patents by Inventor Kazunari Kimura
Kazunari Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10381700Abstract: A dielectric filter includes: a resonator body formed of dielectric material; surrounding dielectric portion present around the resonator body and formed of dielectric material having a relative permittivity lower than the dielectric material used to form the resonator body; and an input/output conductor portion formed of a conductor and configured to perform at least one supply of an electromagnetic wave to the resonator body and reception of an electromagnetic wave from the resonator body. The resonator body has a first end face and a second end face located at opposite ends in a first direction. The input/output conductor portion is located either at least part of the input/output conductor portion is contained in a space formed by shifting a virtual plane corresponding to the first end face in the first direction away from the second end face, or the input/output conductor portion is in contact with the space.Type: GrantFiled: June 12, 2017Date of Patent: August 13, 2019Assignee: TDK CORPORATIONInventors: Yuta Ashida, Kazunari Kimura, Shigemitsu Tomaki
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Patent number: 9966342Abstract: The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.Type: GrantFiled: March 20, 2014Date of Patent: May 8, 2018Assignee: TDK CORPORATIONInventors: Misaki Tabata, Kazunari Kimura
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Publication number: 20170365902Abstract: A dielectric filter includes: a resonator body formed of dielectric material; surrounding dielectric portion present around the resonator body and formed of dielectric material having a relative permittivity lower than the dielectric material used to form the resonator body; and an input/output conductor portion formed of a conductor and configured to perform at least one supply of an electromagnetic wave to the resonator body and reception of an electromagnetic wave from the resonator body. The resonator body has a first end face and a second end face located at opposite ends in a first direction. The input/output conductor portion is located either at least part of the input/output conductor portion is contained in a space formed by shifting a virtual plane corresponding to the first end face in the first direction away from the second end face, or the input/output conductor portion is in contact with the space.Type: ApplicationFiled: June 12, 2017Publication date: December 21, 2017Applicant: TDK CORPORATIONInventors: Yuta ASHIDA, Kazunari KIMURA, Shigemitsu TOMAKI
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Patent number: 8922304Abstract: A laminated electronic device comprises two or more wiring layers including a first wiring layer and a second wiring layer, an insulating layer interposed between the first wiring layer and second wiring layer, and a through conductor extending through the insulating layer for electrically connecting a first conductor disposed on the first wiring layer to a second conductor disposed on the second wiring layer. The through conductor includes divergent sections at both ends, which have a diameter gradually increased toward the first conductor or second conductor.Type: GrantFiled: October 25, 2011Date of Patent: December 30, 2014Assignee: TDK CorporationInventors: Kazunari Kimura, Junichi Nakamura, Takeshi Kijima, Isao Abe, Takahiro Suzuki, Toshiaki Araki
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Patent number: 8864925Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.Type: GrantFiled: July 21, 2011Date of Patent: October 21, 2014Assignee: TDK CorporationInventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
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Publication number: 20140299016Abstract: The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.Type: ApplicationFiled: March 20, 2014Publication date: October 9, 2014Applicant: TDK CORPORATIONInventors: Misaki TABATA, Kazunari KIMURA
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Publication number: 20140075395Abstract: According to an embodiment, in a semiconductor integrated circuit design apparatus for assigning a plurality of wires placed at one wiring layer to a plurality of photomasks, an operation-timing-critical wire is identified from among the plurality of wires placed at a same wiring layer, an adjacent wire which is placed adjacent to the critical wire is extracted, the critical wire and the adjacent wire are laid out such that an interval between the critical wire and the adjacent wire is at least a predetermined distance, and layout patterns of the critical wire and the adjacent wire is assigned to the same photomask.Type: ApplicationFiled: February 6, 2013Publication date: March 13, 2014Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Kazunari KIMURA
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Publication number: 20130266758Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.Type: ApplicationFiled: July 21, 2011Publication date: October 10, 2013Applicant: TDK CorporationInventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
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Publication number: 20130115411Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.Type: ApplicationFiled: July 21, 2011Publication date: May 9, 2013Applicant: TDK CorporationInventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
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Publication number: 20130074027Abstract: A designing device for a semiconductor integrated circuit of an embodiment includes a low-order hierarchy wiring design portion configured to design a first wiring; and a high-order hierarchy wiring design portion configured to design a second wiring. The low-order hierarchy wiring design portion divides the first functional block into a plurality of small regions, calculates a number of wiring layers required for wiring in the functional block for each of the plurality of small regions and sets the number as the number of low-order hierarchy wiring layers, sets wiring layers in the number of the low-order hierarchy wiring layers from the wiring layer located on the lowermost part as a low-order hierarchy wiring region for each of the plurality of small regions, and places the first wiring in the low-order hierarchy wiring region.Type: ApplicationFiled: March 16, 2012Publication date: March 21, 2013Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Kazunari KIMURA
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Publication number: 20120313743Abstract: A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.Type: ApplicationFiled: September 7, 2011Publication date: December 13, 2012Applicant: TDK CorporationInventors: Kazunari Kimura, Shigemitsu Tomaki, Misaki Tabata, Isao Abe
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Publication number: 20120103675Abstract: A laminated electronic device comprises two or more wiring layers including a first wiring layer and a second wiring layer, an insulating layer interposed between the first wiring layer and second wiring layer, and a through conductor extending through the insulating layer for electrically connecting a first conductor disposed on the first wiring layer to a second conductor disposed on the second wiring layer. The through conductor includes divergent sections at both ends, which have a diameter gradually increased toward the first conductor or second conductor.Type: ApplicationFiled: October 25, 2011Publication date: May 3, 2012Applicant: TDK CorporationInventors: Kazunari KIMURA, Junichi NAKAMURA, Takeshi KIJIMA, Isao ABE, Takahiro SUZUKI, Toshiaki ARAKI
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Publication number: 20100229139Abstract: An extraction unit extracts a metal pattern constituting a semiconductor integrated circuit from layout data. A setting unit sets up a region including the metal pattern extracted by the extraction unit. An evaluation unit calculates the metal coverage rate of the region and to evaluate whether the metal coverage rate is equal to or more than a predetermined value. An insertion unit inserts a dummy metal pattern into the region when the metal coverage rate is evaluated as a value smaller than the predetermined value by the evaluation unit.Type: ApplicationFiled: February 8, 2010Publication date: September 9, 2010Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Miyako KITAOKA, Kazunari KIMURA
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Publication number: 20090020850Abstract: According to an aspect of the present invention, there is provided a semiconductor design apparatus including: a determination section that determines a connection position of a capacitor to suppress a noise on a layout data in which a layout of circuit cells are completed; a calculation section that calculates a capacitance value required to suppress the noise; a generation section that generates the capacitor satisfying the capacitance value; and a wiring section that wires the capacitor to a power wiring and a ground wiring at the connection position.Type: ApplicationFiled: July 17, 2008Publication date: January 22, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Hiroshige Orita, Kazunari Kimura, Toshiaki Mori
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Publication number: 20070049178Abstract: In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target flow-rate, the cylinder is stopped and switched to another cylinder 2b and the operation fluid flow rate of the fine aperture is thereafter measured. In a metering process, to be executed next, a necessary processing time is calculated on the basis of the operation fluid flow rate and polishing is carried out for a necessary processing time by another cylinder 2b. Another cylinder is then stopped and switched and the operation fluid flow rate is measured. In this way, the metering process is repeated until the operation fluid flow rate reaches a predetermined value. In each process, the supply of the slurry is not interrupted.Type: ApplicationFiled: August 24, 2006Publication date: March 1, 2007Applicant: DENSO CorporationInventors: Yasuhito Ooka, Shinichi Kato, Kazunari Kimura, Shigeya Kato
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Patent number: 6302694Abstract: A keeper of the dental magnetic attachment and method for removal of the keeper is disclosed wherein the keeper can be attracted by a magnetic assembly embedded in a denture base. The keeper includes a body made of soft magnetic material and a post made of non-magnetic material that is connected together at the bottom of said body of the keeper. The post has a bendable part that is connected to the body of the keeper.Type: GrantFiled: July 13, 2000Date of Patent: October 16, 2001Assignee: Aichi Steel Corporation Ltd.Inventors: Yoshinobu Honkura, Kazuo Arai, Hiroyuki Tanaka, Kazunari Kimura, Hiroshi Mizutani, Kenji Hiranuma, Hisao Takakura
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Patent number: 6299450Abstract: A dental magnetic attachment which has a superior magnetic attractive force with a small nonmagnetic welded part and a flat welded surface to be polished. The dental magnetic attachment including a magnet, a yoke with a pit to hold the magnet, a sealing disk placed on the opening of the pit to cover the magnet and a nonmagnetic welded part between the yoke and the disk. The yoke and the disk are made from soft magnetic material. The nonmagnetic welded part, which joins the yoke and the disk, is formed by welding the yoke, the sealing disk, the sealing ring made from nonmagnetic austenitic stainless steel and a Ni coat between the sealing disk and the sealing ring together. Here, it is preferably that there remains a part of the nonmagnetic sealing ring. The welded surface of the dental magnetic attachment is polished to be flat.Type: GrantFiled: October 27, 1999Date of Patent: October 9, 2001Assignee: Aichi Steel CorporationInventors: Yoshinobu Honkura, Kazuo Arai, Kazunari Kimura, Lei Tian
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Patent number: 6203325Abstract: A dental magnetic attachment having good cushioning properties against a compressing pressure which makes a denture sink appropriately on biting. The dental magnetic attachment embedded in the denture base for holding the denture in the oral cavity by a magnetic attractive force working with the magnetic assembly and a soft magnetic keeper embedded in the top of the root surface includes a magnetic assembly and a cap covering the top of the magnetic assembly. The magnetic assembly has a hollow in the center of its top. The cap with a button is placed on the magnetic assembly, inserting the button into the hollow to contact to its bottom. On biting, the button is compressed, to be deformed with a shorter thickness and at this time a sleeve formed as a body around the core slides down along the side of the magnetic assembly to reduce the thickness of the dental magnetic attachment. This sliding makes the denture sink uniformly and appropriately.Type: GrantFiled: October 5, 1999Date of Patent: March 20, 2001Assignee: Aichi Steel Works, Ltd.Inventors: Yoshinobu Honkura, Kazuo Arai, Kazunari Kimura