Patents by Inventor Kazunari Nagata

Kazunari Nagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing process of semiconductor device
    Patent number: 7384873
    Abstract: A method of manufacturing a semiconductor device, includes: forming a resin layer with a resin containing an aromatic compound on a surface, where an electrode is formed, of a semiconductor substrate, by avoiding at least part of the electrode; removing an oxide film from a surface of the electrode using Ar gas and carbonizing the surface of the resin layer to form a carbonized layer; forming wiring from the electrode to over the carbonized layer; and etching, after forming the wiring, the carbonized layer by O2 plasma using the wiring as a mask so as to remove the carbonized layer partially.
    Type: Grant
    Filed: April 12, 2006
    Date of Patent: June 10, 2008
    Assignee: Seiko Epson Corporation
    Inventor: Kazunari Nagata
  • Manufacturing process of semiconductor device
    Publication number: 20060240589
    Abstract: A method of manufacturing a semiconductor device, includes: forming a resin layer with a resin containing an aromatic compound on a surface, where an electrode is formed, of a semiconductor substrate, by avoiding at least part of the electrode; removing an oxide film from a surface of the electrode using Ar gas and carbonizing the surface of the resin layer to form a carbonized layer; forming wiring from the electrode to over the carbonized layer; and etching, after forming the wiring, the carbonized layer by O2 plasma using the wiring as a mask so as to remove the carbonized layer partially.
    Type: Application
    Filed: April 12, 2006
    Publication date: October 26, 2006
    Inventor: Kazunari Nagata