Abstract: A sensor test apparatus capable of efficiently testing a sensor is provided. A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: A sensor test apparatus having excellent versatility is provided. The sensor test apparatus includes a first application unit 40 including a first application device including a socket to which the sensor is electrically connected, and a pressure chamber 43 which applies pressure to the sensor, a test unit which tests the sensor 90 via the socket, a conveying robot which conveys the sensor into and out of the first application unit 40, and an apparatus main body which houses the first application unit 40, the test unit 35 and the conveying robot, and the apparatus main body has an opening which allows the first application unit 40 to be inserted into the apparatus main body and removed from the apparatus main body to an outside.

Abstract: A sensor test system having excellent throughput is provided. The sensor test system 1 includes a test apparatus group 20 including a plurality of sensor test apparatuses 30A to 30D coupled to each other so that the sensor 90 can be transferred, and each of the sensor test apparatuses 30A to 30D includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies a pressure to the sensor 90, a test unit 35 which tests the sensor 90 via the socket 445, and a conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: A sensor test system having excellent throughput is provided. The sensor test system 1 includes a test apparatus group 20 including a plurality of sensor test apparatuses 30A to 30D coupled to each other so that the sensor 90 can be transferred, and each of the sensor test apparatuses 30A to 30D includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies a pressure to the sensor 90, a test unit 35 which tests the sensor 90 via the socket 445, and a conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: A sensor test apparatus capable of efficiently testing a sensor is provided. A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: A sensor test apparatus having excellent versatility is provided. The sensor test apparatus 30 includes a first application unit 40 including a first application device 42 including a socket 445 to which the sensor 90 is electrically connected, and a pressure chamber 43 which applies pressure to the sensor 90, a test unit 35 which tests the sensor 90 via the socket 445, a conveying robot 33 which conveys the sensor 90 into and out of the first application unit 40, and an apparatus main body 301 which houses the first application unit 40, the test unit 35 and the conveying robot 33, and the apparatus main body 301 has an opening 306d which allows the first application unit 40 to be inserted into the apparatus main body 301 and removed from the apparatus main body 301 to an outside.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A probe card 2 for an IC testing apparatus electrically connected to a test head board 11 of the IC testing apparatus and having a plurality of needle contacts 211 provided on a main surface for electrical contact with a device under test, wherein a plurality of zero insertion force connectors electrically connected to the needle contacts are provided at substantially radial positions from the position where the needle contacts are provided.

Abstract: A main frame of an IC testing apparatus is formed in the shape of a horizontally elongated box with its height close to the height of wafer probers. Two wafer probers are arranged side by side transversely of the main frame on the front said thereof. One rotary drive is equipped with two output shafts which are connected via respective clutches with the rotary drive, and the testing heads are connected to the associated output shafts. The rotary drive is disposed on the top of the main frame with an extension of the upper portion of the rotary drive, and is adapted to rotatively drive the testing heads connected to the output shifts between a fist position opposing the contact section of the associated wafer prober and a second position over the top of the main frame. This construction reduces the installation areas for each of the wafer probers as well as narrowing the space between the wafer probers and the main frame.

Abstract: A main frame of an IC testing apparatus is formed in the shape of a horizontally elongated box with its height close to the height of wafer probers. Two wafer probers are arranged side by side transversely of the main frame on the front said thereof. One rotary drive is equipped with two output shafts which are connected via respective clutches with the rotary drive, and the testing heads are connected to the associated output shafts. The rotary drive is disposed on the top of the main frame with an extension of the upper portion of the rotary drive, and is adapted to rotatively drive the testing heads connected to the output shifts between a fist position opposing the contact section of the associated wafer prober and a second position over the top of the main frame. This construction reduces the installation areas for each of the wafer probers as well as narrowing the space between the wafer probers and the main frame.

Abstract: A cooler-equipped printed circuit board, in which electronic devices arranged in a matrix form on the printed circuit board are covered with a sealed case held in liquidtight contact with the board and having a coolant channel from an inlet port and an outlet port made in the case. Barriers are provided in the coolant channel to change the direction of flow of the coolant to stir it and make its temperature uniform throughout it.

Abstract: A semiconductor test system having a test head connection apparatus for connecting and disconnecting a test head of the test system with a wafer prober or a test handler includes a housing formed outside of the semiconductor test system wherein the housing is integral with a body of the test system, a pair of arms provide on the housing for holding the test head wherein the test head rotates about 180 degrees in the arms so that a performance board on the test head faces with a corresponding member on the wafer prober or the test handler, at least one rail built on a floor in a direction which accurately positioning the test head right over the wafer prober or the test handler, a guide mechanism provided on the housing to guide an up-down movement of the arms, a plurality of free casters provided at the bottom of the housing to transfer the test system and the test head toward the wafer prober or the test handler along the rail, and a balancing mechanism for offsetting the weight of the test head so that the

Abstract: A contact mechanism is for a test head of a semiconductor test system for connecting the test head to a wafer prober or a test handler having a semiconductor device to be tested. The contact mechanism includes, a performance board mounted between the test head the wafer prober wherein the performance board has a guide hole, an insert ring mounted on a frame of the wafer prober, a probe card mounted on a central portion of the insert ring for contacting the semiconductor device to be tested, a contactor having a plurality of contact pins to achieve electric contact between the performance board and the probe card when pressed in downward by the performance board, a performance board shaft extending from a bottom of the test head and penetrating the guide hole of the performance board, a shaft clamp provided on the insert ring having a shaft guide hole to receive the performance board shaft therethrough wherein a bottom of the shaft guide hole is lower than a surface of the insert ring.

Abstract: A board exchange mechanism for a self-diagnosis process excludes the need of disconnecting a test head from a wafer prober for installing a self-diagnosis board.