Abstract: According to the present invention, a panel-shaped first metal body (2) comprises a space-forming part (2a) and an overlap part (2b) that is continuous with the space-forming part (2a). A panel-shaped second metal body (4) comprises a space-forming part (4a) and an overlap part (4b) that is continuous with space-forming part (4a). When the first metal body (2) and the second metal body (4) have been assembled, a housing space layer (S1) that is for housing a sheet-shaped glass wool material 3 is formed between the space-forming parts (2a, 4a), and the overlap parts (2b, 4b) overlap. A solid joining part (W1) that connects the overlap parts (2b, 4b) is formed between the overlap parts (2b, 4b).

Abstract: Two aluminum alloy plates are sandwiched between an anvil and a chip of a horn which is being vibrated by a vibration unit, to perform ultrasonic bonding. A deposit removing unit is provided above the horn. When the horn is vibrated by the vibration unit and raised by an elevator, the chip positioned on the top of the horn comes into contact with a removal section, with the chip being vibrated, to allow the removal section to remove a deposit adhering to the chip.

Abstract: According to the present invention, a panel-shaped first metal body (2) comprises a space-forming part (2a) and an overlap part (2b) that is continuous with the space-forming part (2a). A panel-shaped second metal body (4) comprises a space-forming part (4a) and an overlap part (4b) that is continuous with space-forming part (4a). When the first metal body (2) and the second metal body (4) have been assembled, a housing space layer (S1) that is for housing a sheet-shaped glass wool material 3 is formed between the space-forming parts (2a, 4a), and the overlap parts (2b, 4b) overlap. A solid joining part (W1) that connects the overlap parts (2b, 4b) is formed between the overlap parts (2b, 4b).

Abstract: Two aluminum alloy plates are sandwiched between an anvil and a chip of a horn which is being vibrated by a vibration unit, to perform ultrasonic bonding. A deposit removing unit is provided above the horn. When the horn is vibrated by the vibration unit and raised by an elevator, the chip positioned on the top of the horn comes into contact with a removal section, with the chip being vibrated, to allow the removal section to remove a deposit adhering to the chip.