Abstract: A dipping apparatus includes a squeegee device and a plate for forming a flux film out of flux. A surface of the plate has a rough surface with a nano-level arithmetically average roughness. The dipping apparatus is configured in such a way that the squeegee device and the plate are moved relatively to each other, and the flux is fed from the squeegee device to the rough surface of the plate.

Abstract: A nozzle holder that detachably holds a nozzle in a lower end portion of a main shaft is configured to have a tubular shape having an insertion hole into which an installed portion of the nozzle is inserted, and to include a holder tube portion in which an opening portion leading to the insertion hole is formed on one side surface of the holder tube portion, a clamp lever which has an engaging portion engaged via the opening portion with the installed portion of the nozzle inserted into the insertion hole, and a clamp spring which biases the engaging portion to the installed portion of the nozzle inserted into the insertion hole.

Abstract: A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.

Abstract: A nozzle holder is configured to include an insertion hole for inserting and storing a cartridge from an entrance thereof, a tubular holder tube portion having a vent hole for introducing a negative pressure into the insertion hole, and a clamp lever in which an engaging portion engaged with an engaged portion of the nozzle inserted into the insertion hole in a state where the entrance of the insertion hole is blocked, is formed. Accordingly, when the nozzle is detached from the nozzle holder, the clamp lever prevents the cartridge from coming off the insertion hole by being displaced toward the insertion hole.

Abstract: A nozzle holder that detachably holds a nozzle in a lower end portion of a main shaft is configured to have a tubular shape having an insertion hole into which an installed portion of the nozzle is inserted, and to include a holder tube portion in which an opening portion leading to the insertion hole is formed on one side surface of the holder tube portion, a clamp lever which has an engaging portion engaged via the opening portion with the installed portion of the nozzle inserted into the insertion hole, and a clamp spring which biases the engaging portion to the installed portion of the nozzle inserted into the insertion hole.

Abstract: A nozzle holder is configured to include an insertion hole for inserting and storing a cartridge from an entrance thereof, a tubular holder tube portion having a vent hole for introducing a negative pressure into the insertion hole, and a clamp lever in which an engaging portion engaged with an engaged portion of the nozzle inserted into the insertion hole in a state where the entrance of the insertion hole is blocked, is formed. Accordingly, when the nozzle is detached from the nozzle holder, the clamp lever prevents the cartridge from coming off the insertion hole by being displaced toward the insertion hole.

Abstract: A component is placed by a nozzle of a placing head, which holds the component by means of a negative pressure. A flow path switcher that selectively connects a suction path of the nozzle to a negative pressure source and a positive pressure source is included. During component placement, the flow path switcher switches the nozzle to a positive pressure flow path from a negative pressure flow path to put the nozzle under a positive pressure and detaches the component from the nozzle. Before detection of the component is performed by a component detector, the flow path switcher connects the suction path of the nozzle to the negative pressure flow path to put the suction path under a negative pressure. The component detector that detects the component at a tip of the nozzle is included.

Abstract: A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.

Abstract: A component is mounted in a component mounting position on a component mounting-side surface of an inspection-use board which is formed from a light transmitting material and which has a reflecting surface disposed on a surface opposed to the component mounting side-surface and facing the component mounting side-surface. Light is applied to the component mounting-side surface of the inspection-use board. The applied light is transmitted through the component mounting-side surface and reflected on the reflecting surface so that an image of an outline of the component formed by reflected light coming from around the component through the component mounting-side surface is picked up. A component mounting accuracy is calculated based on the image.

Abstract: A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.

Abstract: A component is mounted in a component mounting position on a component mounting-side surface of an inspection-use board which is formed from a light transmitting material and which has a reflecting surface disposed on a surface opposed to the component mounting side-surface in a state of facing the component mounting side-surface, light is applied to the component mounting-side surface of the inspection-use board, the applied light is transmitted through the component mounting-side surface and reflected on the reflecting surface so that an image of an outline of the component formed by reflected light coming from around the component through the component mounting-side surface is picked up, and a component mounting accuracy is calculated based on the image.

Abstract: A component mounting apparatus and a component mounting method which improve an accuracy and a rate of placement of components on a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation ?L of the component from a normal suction status is determined on the basis of component recognition information obtained from the recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding the placement of the component is controlled on basis of a magnitude of the deviation. By the control, the accuracy and rate of placement of the components on the circuit-formed member can be improved.