Abstract: An electronic component having a core including a winding base extending in an axial direction. A first flange is located at an end in the axial direction and having at least one first protruded side surface, which is protruded from the winding base, at least at an end in a first direction, which is one of perpendicular directions that are perpendicular to the axial direction. A wire is wound around the winding base. A first external electrode is connected to the wire and is provided on a side surface of the first flange located at an end in one of the perpendicular directions. A first outer edge of the first flange crosses the wire when viewed from the first direction has a vector having a component in the axial direction.

Abstract: A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one IDT disposed on the piezoelectric substrate, and an input end and an output end connected to the IDT. At least one of the input end and the output end includes a pair of balanced signal terminals, and a delay line or a reactance component connected to one of the pair of balanced signal terminals.

Abstract: An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm2/g.

Abstract: A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.

Abstract: A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one IDT disposed on the piezoelectric substrate, and an input end and an output end connected to the IDT. At least one of the input end and the output end includes a pair of balanced signal terminals, and a delay line or a reactance component connected to one of the pair of balanced signal terminals.

Abstract: A mounting method for an electronic device element, includes the steps of providing an electronic device element having metal bumps formed on a surface thereof, providing a bonding tool having a pressing surface, providing a mounting substrate, keeping the pressing surface of the bonding tool in contact with a reverse surface of the electronic device element and applying an ultrasonic wave to the bonding tool, thereby mounting the electronic device element on the mounting substrate. The maximum length of the pressing surface of the bonding tool in the ultrasonic-wave-oscillation direction is greater than about 0.5 times the maximum length of the reverse surface of the electronic device element in the ultrasonic-wave-oscillation direction.

Abstract: A surface acoustic wave filter device has a balance-unbalance conversion function and substantially equal input impedance and output impedance so as to increase out-of-passband attenuation. The surface acoustic wave filter device includes an unbalanced signal terminal, first and second balanced signal terminals, and first and second surface acoustic wave filters having input and output impedances. In each filter, one of the input and output impedances is approximately four times the other impedance. Additionally, 2n−1 first surface acoustic wave filters are connected between the unbalanced signal terminal and the first balanced signal terminal, and 2n−1 second surface acoustic wave filters are connected between the unbalanced signal terminal and the second balanced signal terminal, where n is an integer of 1 or more. The second surface acoustic wave filters are 180 degrees out-of-phase with respect to the first surface acoustic wave filters.

Abstract: An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.

Abstract: An electronic part is provided (1) containing an electronic element (2) and a substrate (3) to which the electronic element (2) is mounted, the electronic element (2) and the substrate (3) being electrically or mechanically connected to each other by means of at least three bumps (4). Both the value obtained by dividing the total bonding-area of the bumps (4) bonded to the electronic element (2) by the mass of the electronic element (2) and the value obtained by dividing the total bonding-area of the bumps (4) bonded to the substrate (3) by the mass of the electronic element (2) are at least 8.8 mm2/g.

Abstract: A surface acoustic wave device includes a surface acoustic wave substrate having two IDT electrodes including wiring electrode portions made of aluminum disposed thereon. First, second and third metal films are laminated on each of the wiring electrode portions. The first metal film has superior bondability to aluminum, and the third metal film has superior bondability to bumps. In addition, the second metal film has an ability to suppress the diffusion of the metal defining the first metal film.

Abstract: An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bumps located along the peripheral portion of the electronic component element have a greater height than that of the bumps located at the central portion of the electronic component element.

Abstract: An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is-located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.

Abstract: An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.

Abstract: A method for manufacturing a surface acoustic wave apparatus to be mounted via bumps by a flip chip bonding system prevents peeling of electrode pads from the piezoelectric substrate and cracks in the piezoelectric substrate from occurring during the formation of the bumps or at other times during the manufacturing process. In the method of manufacturing a surface acoustic wave apparatus, a first electrode layer of the electrode pad is formed on a piezoelectric substrate by etching, an electrode for a surface acoustic wave element is formed by a lift-off method after the first electrode layer is formed, and thereafter, an electrode film including a second electrode layer of the electrode pad and a wiring electrode is formed.

Abstract: An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bumps located along the peripheral portion of the electronic component element have a greater height than that of the bumps located at the central portion of the electronic component element.

Abstract: An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bumps located along the peripheral portion of the electronic component element have a greater height than that of the bumps located at the central portion of the electronic component element.

Abstract: A surface acoustic wave filter device has a balance-unbalance conversion function and substantially equal input impedance and output impedance so as to increase out-of-passband attenuation. The surface acoustic wave filter device includes an unbalanced signal terminal, first and second balanced signal terminals, and first and second surface acoustic wave filters having input and output impedances. In each filter, one of the input and output impedances is approximately four times the other impedance. Additionally, 2n−1 first surface acoustic wave filters are connected between the unbalanced signal terminal and the first balanced signal terminal, and 2n−1 second surface acoustic wave filters are connected between the unbalanced signal terminal and the second balanced signal terminal, where n is an integer of 1 or more. The second surface acoustic wave filters are 180 degrees out-of-phase with respect to the first surface acoustic wave filters.

Abstract: A package for electronic components includes a base substrate having at least one recess on a side surface thereof, the base substrate having electrodes on an upper surface and a bottom surface thereof and a conductive pattern arranged in the recess such that the electrode on the upper surface is electrically connected to the electrode on the bottom surface through the conductive pattern. A side wall of the package has a through-hole which provides a space for receiving an electronic element. The side wall has at least one recess on a side surface thereof and is provided on the base substrate such that the recess of the side wall is connected to the recess of the base substrate so as to provide a communicating recess. The recess of the base substrate has a cross-sectional area that is substantially larger than the recess of the side wall in a direction that is substantially perpendicular to the base substrate.