Patents by Inventor Kazunori Ishizaka

Kazunori Ishizaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8891799
    Abstract: An earphone includes a cylindrical portion having an opening in one end and an audio output unit which outputs sound from one face. The audio output unit is fixed to the cylindrical portion such that another face is in contact with an end face of the one end of the cylindrical portion. The audio output unit and the cylindrical portion are insertable at least partially in the external auditory canal of a human being. The earphone further includes a thin-wall part provided in the cylindrical portion and a ring, made of a material of a greater specific gravity than the cylindrical portion, which is fixed to the inner surface. The ring is fixed in a position such that the ring overlaps in the axial direction of the cylindrical portion with respect to the thin-wall part.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: November 18, 2014
    Assignee: JVC Kenwood Corporation
    Inventors: Takashi Fujikura, Kazunori Ishizaka
  • Patent number: 8265327
    Abstract: An ear piece to be detachably attached to a sound tube protruding from a housing of an earphone has a base portion with a through hole. The through hole has an inner wall with a first, a second, and a third portion continuously provided in order when viewed from the housing. The first portion protrudes inwardly and has a first distance from a protruding inner surface of the first portion to an axis line passing through the cross section of the base portion and the through hole. The second portion has a circumferential inner surface having a second distance longer than the first distance to the axis line. The third portion is formed continuously with the second portion, having a circumferential inner surface with a third distance longer than the second distance to the axis line.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: September 11, 2012
    Assignee: Victor Company of Japan, Ltd.
    Inventor: Kazunori Ishizaka
  • Publication number: 20110249855
    Abstract: An earphone has a main body, a first tube portion that protrudes from the main body in a first direction, a speaker unit provided at a protruding top of the first tube portion, and a second tube portion that protrudes from the main body in a second direction that is different from the first direction. The second tube portion communicates with the first tube portion through the main body. The speaker unit is provided with a space at one side thereof. The space is formed in the first and second tube portions and extends from the protruding top of the first tube portion to a protruding top of the second tube portion through the main body.
    Type: Application
    Filed: April 1, 2011
    Publication date: October 13, 2011
    Applicant: Victor Company of Japan, Ltd. a corporation of Japan
    Inventors: Shinji Tamura, Kazunori Ishizaka, Makoto Gondo
  • Publication number: 20110158457
    Abstract: An ear piece to be detachably attached to a sound tube protruding from a housing of an earphone has a base portion with a through hole. The through hole has an inner wall with a first, a second, and a third portion continuously provided in order when viewed from the housing. The first portion protrudes inwardly and has a first distance from a protruding inner surface of the first portion to an axis line passing through the cross section of the base portion and the through hole. The second portion has a circumferential inner surface having a second distance longer than the first distance to the axis line. The third portion is formed continuously with the second portion, having a circumferential inner surface with a third distance longer than the second distance to the axis line.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 30, 2011
    Applicant: VICTOR COMPANY OF JAPAN, LTD.
    Inventor: Kazunori Ishizaka
  • Publication number: 20110110543
    Abstract: A headphone housing has a first and a second summit in cross section. A sound emitter protrudes from the housing in side section. In the cross section, the first summit protrudes as being away from a point of intersection of an axis line of the sound emitter, that is horizontal and vertical to the side and cross sections, respectively, and a first straight line going through a cord guide located in an outer edge of the cross section, in a first side with respect to the first line and in a second side far from the cord guide with respect to a second straight line going through the point and intersecting with the first line. The second summit protrudes as being away from the point in the second side and in a third side, the opposite of the first side with respect to the first line.
    Type: Application
    Filed: November 3, 2010
    Publication date: May 12, 2011
    Applicant: Victor Company of Japan, Ltd.
    Inventors: Kazunori Ishizaka, Takuya Arimoto
  • Publication number: 20090304220
    Abstract: An earphone includes a cylindrical portion having an opening in one end and an audio output unit which outputs sound from one face. The audio output unit is fixed to the cylindrical portion such that another face is in contact with an end face of the one end of the cylindrical portion. The audio output unit and the cylindrical portion are insertable at least partially in the external auditory canal of a human being. The earphone further includes a thin-wall part provided in the cylindrical portion and a ring, made of a material of a greater specific gravity than the cylindrical portion, which is fixed to the inner surface. The ring is fixed in a position such that the ring overlaps in the axial direction of the cylindrical portion with respect to the thin-wall part.
    Type: Application
    Filed: June 4, 2009
    Publication date: December 10, 2009
    Inventors: Takashi FUJIKURA, Kazunori ISHIZAKA
  • Patent number: 5189508
    Abstract: A silicon wafer comprising a substrate of single crystal silicon, a silicon oxide film 1 to 8 .ANG. in thickness formed on one surface of said substrate, and a polysilicon layer formed on said silicon oxide film and possessing an excellent gettering ability, is prepared by oxidizing single crystal silicon, thereby forming a silicon oxide film 1 to 8 .ANG. in thickness on said surface, and exposing said silicon oxide film to a gaseous silane at an elevated temperature, thereby forming a polysilicon layer on said silicon oxide film.
    Type: Grant
    Filed: October 31, 1991
    Date of Patent: February 23, 1993
    Assignees: Nippon Steel Corporation, NSC Electron Corp.
    Inventors: Masaharu Tachimori, Kazunori Ishizaka, Hideo Araki