Abstract: [Object] To provide a control device which enables a flight vehicle device to obtain a highly precise image. [Solution] Provided is the control device including an illuminating control unit configured to adjust a light amount of an illuminating device according to an inclination of a fuselage of a flight vehicle device that has an imaging device configured to photograph a photographing target and the illuminating device configured to illuminate the photographing target.

Abstract: A semiconductor device includes first and second chips in a package. A first pad is on the first chip and electrically connected to a node between a power supply pad and a ground pad on the first chip. Second and third pads are on the second chip. An internal wiring connects the first pad to the second pad within the package. A power circuit on the semiconductor chip configured to supply a current to the second pad. A switch is on the second chip between the second pad and the power supply circuit to connect or disconnect the second pad from the power circuit. A control circuit is on the second chip and configured to output a first signal for the switch in response to a test signal supplied to the third pad and a second signal to the power circuit to cause the power circuit to output current.

Abstract: A semiconductor device includes first and second chips in a package. A first pad is on the first chip and electrically connected to a node between a power supply pad and a ground pad on the first chip. Second and third pads are on the second chip. An internal wiring connects the first pad to the second pad within the package. A power circuit on the semiconductor chip configured to supply a current to the second pad. A switch is on the second chip between the second pad and the power supply circuit to connect or disconnect the second pad from the power circuit. A control circuit is on the second chip and configured to output a first signal for the switch in response to a test signal supplied to the third pad and a second signal to the power circuit to cause the power circuit to output current.

Abstract: An image pickup apparatus includes an image sensor, a lens, and an electric module disposed outside the lens when viewed in a first direction. The electric module includes a first inductor, a first transformer, a second inductor, and a second transformer. A second terminal of the first inductor is connected to a third terminal of the first primary winding. A fifth terminal of the second inductor is connected to a seventh terminal of the second primary winding. The first inductor is wound clockwise from a first terminal toward the second terminal. The second inductor is wound counterclockwise from a sixth terminal toward the fifth terminal. The first primary winding is wound counterclockwise from the third terminal toward a fourth terminal. The second primary winding is wound clockwise from the seventh terminal toward the eighth terminal.

Abstract: An image capturing apparatus includes a printed wiring board and an inductor. The inductor includes a winding wire portion, a pair of wire portions drawn out from the winding wire portion to a first side in a first direction, and a pair of electrodes connected to the pair of wire portions. The printed wiring board includes a pair of pads connected to the pair of electrodes, and a pair of wiring patterns extending from the pair of pads. Each of the pair of wiring patterns extends from a first portion of corresponding one of the pair of pads. The first portion is a portion extending from an end of the corresponding one of the pair of pads on a second side in the first direction to a length that is two thirds of a length of the corresponding one of the pair of pads in the first direction.

Abstract: An image capturing apparatus includes a printed wiring board and an inductor. The inductor includes a winding wire portion, a pair of wire portions drawn out from the winding wire portion to a first side in a first direction, and a pair of electrodes connected to the pair of wire portions. The printed wiring board includes a pair of pads connected to the pair of electrodes, and a pair of wiring patterns extending from the pair of pads. Each of the pair of wiring patterns extends from a first portion of corresponding one of the pair of pads. The first portion is a portion extending from an end of the corresponding one of the pair of pads on a second side in the first direction to a length that is two thirds of a length of the corresponding one of the pair of pads in the first direction.

Abstract: According to one embodiment, the insulating layer is provided on the terrace portions. The plurality of contact portions extend through the insulating layer in the stacking direction and contact the terrace portions. The second columnar portion extends through the insulating layer and through the second stacked portion in the stacking direction, and includes a second semiconductor body contacting the first semiconductor region. The first insulating portion divides the first semiconductor region in the first direction. The first insulating portion is provided under a boundary portion between the first stacked portion and the second stacked portion.

Abstract: According to one embodiment, the insulating layer is provided on the terrace portions. The plurality of contact portions extend through the insulating layer in the stacking direction and contact the terrace portions. The second columnar portion extends through the insulating layer and through the second stacked portion in the stacking direction, and includes a second semiconductor body contacting the first semiconductor region. The first insulating portion divides the first semiconductor region in the first direction. The first insulating portion is provided under a boundary portion between the first stacked portion and the second stacked portion.

Abstract: A semiconductor device according to an embodiment, includes a plurality of wires, a first dielectric film, and a second dielectric film. The plurality of wires are arranged above a semiconductor substrate so as to extend in a first direction and aligned via a first cavity. The first dielectric film has a plurality of portions arranged above the plurality of wires so as to extend in a second direction substantially perpendicular to the plurality of wires and aligned along the first direction via a second cavity leading to the first cavity. The second dielectric film is formed above the first dielectric film so as to cover the second cavity.

Abstract: According to one embodiment, a semiconductor device includes: a semiconductor layer of a first conductivity type, and the semiconductor layer having a first and a second surfaces; a first conductive layer penetrating from the first surface side to the second surface side of the semiconductor layer; a first semiconductor region of a first conductivity type surrounding part of the first conductive layer on the second surface side of the semiconductor layer, a portion other than a front surface of the first semiconductor region being surrounded by the semiconductor layer; and a first insulating film provided between the first conductive layer and the semiconductor layer and between the first conductive layer and the first semiconductor region, a concentration of an impurity element contained in the first semiconductor region being higher than a concentration of an impurity element contained in the semiconductor layer.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes first word lines equipped with flag-like portions on one side of the block in the row direction and equipped with no flag-like portions on the other side of the block in the row direction, and second word lines equipped with no flag-like portions on the one side of the block in the row direction and equipped with flag-like portions on the other side of the block in the row direction.

Abstract: A semiconductor device according to an embodiment, includes a plurality of wires, a first dielectric film, and a second dielectric film. The plurality of wires are arranged above a semiconductor substrate so as to extend in a first direction and aligned via a first cavity. The first dielectric film has a plurality of portions arranged above the plurality of wires so as to extend in a second direction substantially perpendicular to the plurality of wires and aligned along the first direction via a second cavity leading to the first cavity. The second dielectric film is formed above the first dielectric film so as to cover the second cavity.

Abstract: According to one embodiment, a semiconductor device includes: a semiconductor layer of a first conductivity type, and the semiconductor layer having a first and a second surfaces; a first conductive layer penetrating from the first surface side to the second surface side of the semiconductor layer; a first semiconductor region of a first conductivity type surrounding part of the first conductive layer on the second surface side of the semiconductor layer, a portion other than a front surface of the first semiconductor region being surrounded by the semiconductor layer; and a first insulating film provided between the first conductive layer and the semiconductor layer and between the first conductive layer and the first semiconductor region, a concentration of an impurity element contained in the first semiconductor region being higher than a concentration of an impurity element contained in the semiconductor layer.

Abstract: According to one embodiment, a semiconductor device includes at least one semiconductor region provided in a semiconductor substrate, and a capacitor group including a plurality of capacitors provided in the semiconductor region, each capacitor including a capacitor insulating film provided on the semiconductor region, a capacitor electrode provided on the capacitor insulating film, and at least one diffusion layer provided in the semiconductor region adjacent to the capacitor electrode.

Abstract: A printing apparatus includes a printhead incorporating a temperature sensor, a control unit which controls the printhead, and a flexible cable which connects the printhead and the control unit. The flexible cable includes a first signal line and second signal line which generate voltages corresponding to the temperature of the printhead, and are connected to the temperature sensor. A differential amplifier circuit which is incorporated in the control unit amplifies the voltage difference between the first signal line and the second signal line to output the amplified voltage difference as temperature information of the printhead. A matching circuit makes the wiring resistances of the first signal line and second signal line match each other by grounding either the first signal line or the second signal line via a resistor in the printhead.

Abstract: A liquid discharge head includes a heat generating element which generates heat energy used to discharge a liquid; a temperature detecting element which changes in output voltage in response to a change in the temperature of the heat generating element; an electrical power source line and a grounding line electrically connected to each other through the heat generating element to apply a current to the heat generating element; and a pair of lines for temperature detection electrically connected to each other through the temperature detecting element to apply a current to the temperature detecting element. Here, each of the pair of lines for temperature detection is arranged adjacent to the other.

Abstract: According to one embodiment, a semiconductor device includes at least one semiconductor region provided in a semiconductor substrate, and a capacitor group including a plurality of capacitors provided in the semiconductor region, each capacitor including a capacitor insulating film provided on the semiconductor region, a capacitor electrode provided on the capacitor insulating film, and at least one diffusion layer provided in the semiconductor region adjacent to the capacitor electrode.

Abstract: A printing apparatus includes a printhead incorporating a temperature sensor, a control unit which controls the printhead, and a flexible cable which connects the printhead and the control unit. The flexible cable includes a first signal line and second signal line which generate voltages corresponding to the temperature of the printhead, and are connected to the temperature sensor. A differential amplifier circuit which is incorporated in the control unit amplifies the voltage difference between the first signal line and the second signal line to output the amplified voltage difference as temperature information of the printhead. A matching circuit makes the wiring resistances of the first signal line and second signal line match each other by grounding either the first signal line or the second signal line via a resistor in the printhead.

Abstract: A liquid discharge head includes a recording element substrate having an energy generating element generating energy used to discharge liquid, a temperature detecting element changing in output voltage upon temperature change of the energy generating element, and line connection pads electrically connected to the energy generating element and the temperature detecting element; external connection pads electrically connected to the outside of the head; and an electrical wiring substrate having electrical power source line for connecting a first external connection pad connected to an external electrical power source, with the energy generating element, grounding line for connecting a second external connection pad connected to an external grounding terminal, with the energy generating element, and electrode for connecting a third external connection pad connected to an external circuit, with the temperature detecting element.

Abstract: A liquid discharge head includes a heat generating element which generates heat energy used to discharge a liquid; a temperature detecting element which changes in output voltage in response to a change in the temperature of the heat generating element; an electrical power source line and a grounding line electrically connected to each other through the heat generating element to apply a current to the heat generating element; and a pair of lines for temperature detection electrically connected to each other through the temperature detecting element to apply a current to the temperature detecting element. Here, each of the pair of lines for temperature detection is arranged adjacent to the other.