Abstract: A plurality of regions for a plurality of optical waveguides are defined on a substrate. Then, optical waveguide under-cladding layers are formed on the respective regions, and dummy under-cladding layers are formed between adjacent ones of the optical waveguide under-cladding layers in a spaced relationship to the optical waveguide under-cladding layers. After cores are formed on the optical waveguide under-cladding layers and the dummy under-cladding layers, an over-cladding layer formation photosensitive resin is applied on the resulting substrate. Subsequently, portions of the resulting photosensitive resin layer for the respective optical waveguides are selectively exposed, and the exposed portions are defined as over-cladding layers. Thus, the optical waveguides are produced as each including the optical waveguide under-cladding layer, the core and the over-cladding layer, and separated from the substrate.

Abstract: An optical waveguide device which is free from interference with an optical path between a light emitting element and an optical waveguide thereof, and to provide a method of manufacturing the optical waveguide device. A light emitting element (5) is provided on an upper surface of a first under-cladding layer (21), and a second under-cladding layer (22) is provided on the upper surface of the first under-cladding layer (21), covering the light emitting element (5). A core 3 which receives light emitted from the light emitting element (5) through the second under-cladding layer (22) is provided on an upper surface of the second under-cladding layer (22). The core (3) is located in a position such that the light emitted from the light emitting element (5) is incident on the core (3).

Abstract: An optical waveguide device which is free from interference with an optical path between a light emitting element and an optical waveguide thereof, and to provide a method of manufacturing the optical waveguide device. A light emitting element (5) is provided on an upper surface of a first under-cladding layer (21), and a second under-cladding layer (22) is provided on the upper surface of the first under-cladding layer (21), covering the light emitting element (5). A core 3 which receives light emitted from the light emitting element (5) through the second under-cladding layer (22) is provided on an upper surface of the second under-cladding layer (22). The core (3) is located in a position such that the light emitted from the light emitting element (5) is incident on the core (3).

Abstract: An optical connection structure which permits easy and automatic alignment between the optical axes of optical fibers and the optical axes of cores of an optical waveguide, and a production method which ensures that an optical waveguide for the optical connection structure can be efficiently produced with higher dimensional accuracy are provided. An over-cladding layer of the optical waveguide includes an extension portion provided in a longitudinal end portion thereof, and optical fiber fixing grooves are provided in the extension portion as extending along extension lines of cores coaxially with the cores and each having opposite ends, one of which is open in an end face of the extension portion and the other of which is closed. Optical fibers are fitted and fixed in the respective optical fiber fixing grooves. The over-cladding layer further includes a boundary portion (6) provided between the other closed ends of the optical fiber fixing grooves and the cores.

Abstract: Disclosed is inexpensive optical waveguide for an optical connector which is accurately positioned across the width of cores when inserted in and fixed in an optical waveguide fixing through hole of a ferrule to provide low optical coupling loss when connected, an optical connector using the same, and a method of manufacturing the same. An optical waveguide for an optical connector includes cores, an under cladding layer, and an over cladding layer. The strip-shaped optical waveguide has a longitudinal end portion configured to be fixed in a predetermined through hole provided in a ferrule of an optical connector. The cores are formed on the under cladding layer by a photolithographic method. The over cladding layer is formed with respect to the positions of the cores or positioning alignment marks by a photolithographic method. The over cladding layer covers the cores, and the under cladding layer including crosswise end surfaces thereof.

Abstract: A production method of an optical waveguide for a connector is provided, which reduces an optical coupling loss. Cores are formed in a crossing pattern, a branched pattern or a linear pattern, and then an over-cladding layer formation photosensitive resin layer is formed over the cores. In turn, a heat treatment is performed at a temperature of 70° C. to 130° C. to properly form mixed layers in interfaces between the cores and the photosensitive resin layer. By thus forming the mixed layers, the connector optical waveguide can be produced as having a reduced optical coupling loss.

Abstract: A plurality of regions for a plurality of optical waveguides are defined on a substrate. Then, optical waveguide under-cladding layers are formed on the respective regions, and dummy under-cladding layers are formed between adjacent ones of the optical waveguide under-cladding layers in a spaced relationship to the optical waveguide under-cladding layers. After cores are formed on the optical waveguide under-cladding layers and the dummy under-cladding layers, an over-cladding layer formation photosensitive resin is applied on the resulting substrate. Subsequently, portions of the resulting photosensitive resin layer for the respective optical waveguides are selectively exposed, and the exposed portions are defined as over-cladding layers. Thus, the optical waveguides are produced as each including the optical waveguide under-cladding layer, the core and the over-cladding layer, and separated from the substrate.

Abstract: A production method of an optical waveguide for a connector is provided, which reduces an optical coupling loss. Cores are formed in a crossing pattern, a branched pattern or a linear pattern, and then an over-cladding layer formation photosensitive resin layer is formed over the cores. In turn, a heat treatment is performed at a temperature of 70° C. to 130° C. to properly form mixed layers in interfaces between the cores and the photosensitive resin layer. By thus forming the mixed layers, the connector optical waveguide can be produced as having a reduced optical coupling loss.

Abstract: An optical connection structure which permits easy and automatic alignment between the optical axes of optical fibers and the optical axes of cores of an optical waveguide, and a production method which ensures that an optical waveguide for the optical connection structure can be efficiently produced with higher dimensional accuracy are provided. An over-cladding layer of the optical waveguide includes an extension portion provided in a longitudinal end portion thereof, and optical fiber fixing grooves are provided in the extension portion as extending along extension lines of cores coaxially with the cores and each having opposite ends, one of which is open in an end face of the extension portion and the other of which is closed. Optical fibers are fitted and fixed in the respective optical fiber fixing grooves. The over-cladding layer further includes a boundary portion (6) provided between the other closed ends of the optical fiber fixing grooves and the cores.

Abstract: Disclosed is inexpensive optical waveguide for an optical connector which is accurately positioned across the width of cores when inserted in and fixed in an optical waveguide fixing through hole of a ferrule to provide low optical coupling loss when connected, an optical connector using the same, and a method of manufacturing the same. An optical waveguide for an optical connector includes cores, an under cladding layer, and an over cladding layer. The strip-shaped optical waveguide has a longitudinal end portion configured to be fixed in a predetermined through hole provided in a ferrule of an optical connector. The cores are formed on the under cladding layer by a photolithographic method. The over cladding layer is formed with respect to the positions of the cores or positioning alignment marks by a photolithographic method. The over cladding layer covers the cores, and the under cladding layer including crosswise end surfaces thereof.

Abstract: An optical waveguide device which is free from interference with an optical path between a light emitting element and an optical waveguide thereof, and to provide a method of manufacturing the optical waveguide device. A light emitting element (5) is provided on an upper surface of a first under-cladding layer (21), and a second under-cladding layer (22) is provided on the upper surface of the first under-cladding layer (21), covering the light emitting element (5). A core 3 which receives light emitted from the light emitting element (5) through the second under-cladding layer (22) is provided on an upper surface of the second under-cladding layer (22). The core (3) is located in a position such that the light emitted from the light emitting element (5) is incident on the core (3).

Abstract: The present invention relates to a trisoxetane compound represented by the following formula (1): wherein each of R1 and R3's represents a hydrogen atom or an alkyl group having 1 to 6 carbon atom(s); R2 represents a divalent aliphatic chained organic group having 0 to 16 carbon atom(s); and A represents a carbon atom or a trivalent organic group derived from a cycloalkane having 3 to 12 carbon atoms; a process for producing the same; and an optical waveguide including the same.

Abstract: A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines) 3. Next, a thin metal film 5 is formed on the under cladding layer 2 so as to cover the resist layer and the cores 3. Thereafter, the resist layer is removed together with portions of the thin metal film 5 lying on the surface of the resist layer. Electroplating is performed on the remaining portions of the thin metal film 5 to fill grooves 6 defined between adjacent ones of the cores 3 with electroplated layers 7a obtained by the electroplating.

Abstract: The invention provides a process of manufacturing an optical waveguide for optically connecting a plurality of optical devices, comprising the steps of: disposing a resin composition between two or more optical devices, the resin composition comprising a resin and a 1,4-dihydropyridine derivative, forming an optical path through the resin composition between the optical devices by light having a wavelength capable of inducing a structural change in the 1,4-dihydropyridine derivative, and removing the 1,4-dihydropyridine derivative from the resulting resin composition. Also disclosed is a connection structure obtained by the process.

Abstract: A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines) 3 are formed in a predetermined pattern. Thereafter, a thin metal film 4 is formed in grooves defined between adjacent ones of the cores 3. Via-filling plating is performed on the thin metal film 4 to fill the above-mentioned grooves with a via-filling plated layer 6a. The plated layer 6a serves as electrical interconnect lines 6.

Abstract: An optical waveguide device comprises a first under-cladding layer, a light emitting element provided on an upper surface of the first under-cladding layer and having a light emitting portion which emits light, and a core provided on the upper surface of the first under-cladding layer and having a light receiving portion which receives the light emitted from the light emitting portion of the light emitting element. The light receiving portion of the core has a generally U-shape as seen in plan, and the emitted light is projected into an opening of the generally U-shaped light receiving portion.

Abstract: A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines) 3 are formed in a predetermined pattern. Thereafter, a thin metal film 4 is formed in grooves defined between adjacent ones of the cores 3. Via-filling plating is performed on the thin metal film 4 to fill the above-mentioned grooves with a via-filling plated layer 6a. The plated layer 6a serves as electrical interconnect lines 6.

Abstract: A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines) 3. Next, a thin metal film 5 is formed on the under cladding layer 2 so as to cover the resist layer and the cores 3. Thereafter, the resist layer is removed together with portions of the thin metal film 5 lying on the surface of the resist layer. Electroplating is performed on the remaining portions of the thin metal film 5 to fill grooves 6 defined between adjacent ones of the cores 3 with electroplated layers 7a obtained by the electroplating.

Abstract: A subject for the invention is to provide a method of refractive index regulation by which the refractive index of an optical polymer molding can be efficiently changed without necessitating a complicated step, such as the step of oxidizing beforehand, and which when used for producing an optical device, imparts excellent transparency thereto. Another subject is to provide a photochemically refractive-index-changing polymer or photochemically refractive-index-changing polymer composition for use in the method.

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide.