Abstract: A multilayer core molding method includes: an upstream process of obtaining an intermediate molded body 33; and a downstream process of performing molding using a downstream process molding apparatus 2, and wherein the downstream process includes: an intermediate molded body arrangement step of arranging the intermediate molded body on the intermediate plate cavity surface or the first downstream process mold cavity surface; and a first vulcanization step, performed after the intermediate molded body arrangement step, of vulcanization-molding the intermediate molded body until it is substantially or completely vulcanized, in a state in which at least the first downstream process mold and the intermediate plate are closed against each other.

Abstract: A multilayer core molding method for molding a multilayer core of a golf ball includes an upstream process; and a downstream process, wherein the intermediate molded body includes: an inner core; and an unvulcanized or semi-vulcanized first outer core material, and the downstream process molding apparatus includes: a first downstream process mold including a substantially hemispherical first downstream process mold cavity surface; a second downstream process mold including a substantially hemispherical second downstream process mold cavity surface; and an intermediate plate including a substantially hemispherical intermediate plate cavity surface, and a substantially hemispherical intermediate plate projecting surface, and wherein the downstream process includes: a second outer core arrangement step; an intermediate molded body arrangement; and a preparatory molding step.

Abstract: A multilayer core molding method includes an upstream process of molding using an upstream process molding apparatus, which includes a first upstream process mold including a first upstream process mold cavity surface, and a second upstream process mold including a second upstream process mold cavity surface. The upstream process includes an inner core arrangement step and a covering step to obtain an intermediate molded body, which includes the inner core, and the unvulcanized or semi-vulcanized first outer core material covering only part of a surface of the inner core and integrated with the inner core.

Abstract: A multilayer core molding method for molding a multilayer core of a golf ball includes an upstream process; and a downstream process, wherein the intermediate molded body includes: an inner core; and an unvulcanized or semi-vulcanized first outer core material, and the downstream process molding apparatus includes: a first downstream process mold including a substantially hemispherical first downstream process mold cavity surface; a second downstream process mold including a substantially hemispherical second downstream process mold cavity surface; and an intermediate plate including a substantially hemispherical intermediate plate cavity surface, and a substantially hemispherical intermediate plate projecting surface, and wherein the downstream process includes: a second outer core arrangement step; an intermediate molded body arrangement; and a preparatory molding step.

Abstract: A multilayer core molding method includes an upstream process of molding using an upstream process molding apparatus, which includes a first upstream process mold including a first upstream process mold cavity surface, and a second upstream process mold including a second upstream process mold cavity surface. The upstream process includes an inner core arrangement step and a covering step to obtain an intermediate molded body, which includes the inner core, and the unvulcanized or semi-vulcanized first outer core material covering only part of a surface of the inner core and integrated with the inner core.

Abstract: A conveying apparatus for conveying a holding portion that includes a holding surface where the holding portion holds a substrate, the conveying apparatus including a conveying portion configured to convey the holding portion, and a cover member that covers a first surface on an opposite side of the holding surface of the holding portion, and an attaching and detaching portion configured to attach and detach the holding portion to and from the cover member, wherein the cover member comprises a first removing member configured to remove a foreign substance attached to the first surface, wherein the cover member is configured to be fixed to the holding portion while the first surface and the first removing member are in contact with each other, wherein the conveying portion conveys the holding portion and the cover member to a movable moving unit configured to hold the holding portion while having the first surface and the first removing member of the cover member be in contact with each other, wherein the conv

Abstract: A cover member that covers a first surface on an opposite side with respect to a holding surface of a holding portion that holds a substrate, the cover member including a first removing member that removes a foreign substance attached to the first surface, in which the cover member is capable of being fixed to the holding portion while the first surface and the first removing member are in contact with each other covering the first surface.

Abstract: A cover member that covers a first surface on an opposite side with respect to a holding surface of a holding portion that holds a substrate, the cover member including a first removing member that removes a foreign substance attached to the first surface, in which the cover member is capable of being fixed to the holding portion while the first surface and the first removing member are in contact with each other covering the first surface.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: A cover member that covers a first surface on an opposite side with respect to a holding surface of a holding portion that holds a substrate, the cover member including a first removing member that removes a foreign substance attached to the first surface, in which the cover member is capable of being fixed to the holding portion while the first surface and the first removing member are in contact with each other covering the first surface.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.

Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the SMP virtual connecting unit is provided within the firmware.

Abstract: The invention provides, in a golf ball having a core, an intermediate layer and a cover, a golf ball which combines an intermediate layer formed of an ionomer resin material having a high degree of neutralization with a cover formed of a material that includes a first ionomer resin having a high unsaturated carboxylic acid content and a second ionomer resin having a low unsaturated carboxylic acid content. The golf ball is able to achieve a lower spin rate on full shots with a driver (W#1) without reducing the spin performance on approach shots in the short game, provides high levels of both flight performance and controllability, and also has a good feel at impact.

Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the virtual connecting unit is provided within the firmware.

Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.

Abstract: This invention prevents a deterioration of efficiency of a power supply apparatus due to a semiconductor power supply voltage drop, prevents an increase in wasted power, and prevents erroneous operations due to feeder wire voltage drop. In the mounting structure of electronic circuits having a plurality of busbars as current paths on a printed circuit board, the plurality of busbars have almost parallel portions spaced a predetermined distance apart; a span of the parallel portions of the plurality of busbars is greater than the predetermined distance; and in the parallel portions of the plurality of busbars, the plurality of busbars are connected by a wiring pattern. In the switching power supply apparatus built on a printed circuit board, with its output voltage of less than 2 V and its output current of more than 100 A, a means is provided for making the power efficiency higher than 70%.

Abstract: This invention prevents a deterioration of efficiency of a power supply apparatus due to a semiconductor power supply voltage drop, prevents an increase in wasted power, and prevents erroneous operations due to feeder wire voltage drop. In the mounting structure of electronic circuits having a plurality of busbars as current paths on a printed circuit board, the plurality of busbars have almost parallel portions spaced a predetermined distance apart; a span of the parallel portions of the plurality of busbars is greater than the predetermined distance; and in the parallel portions of the plurality of busbars, the plurality of busbars are connected by a wiring pattern. In the switching power supply apparatus built on a printed circuit board, with its output voltage of less than 2 V and its output current of more than 100 A, a means is provided for making the power efficiency higher than 70%.

Abstract: This invention prevents a deterioration of efficiency of a power supply apparatus due to a semiconductor power supply voltage drop, prevents an increase in wasted power, and prevents erroneous operations due to feeder wire voltage drop. In the mounting structure of electronic circuits having a plurality of busbars as current paths on a printed circuit board, the plurality of busbars have almost parallel portions spaced a predetermined distance apart; a span of the parallel portions of the plurality of busbars is greater than the predetermined distance; and in the parallel portions of the plurality of busbars, the plurality of busbars are connected by a wiring pattern. In the switching power supply apparatus built on a printed circuit board, with its output voltage of less than 2 V and its output current of more than 100 A, a means is provided for making the power efficiency higher than 70%.

Abstract: According to the present invention, variations in characteristic impedance and transmission loss of a signal wiring in a glass cloth wiring substrate can be reduced. There is provided a glass cloth wiring substrate in which signal wirings, plural glass cloth layers, and conductor faces are laminated, and spaces between the signal wirings, the plural glass cloth layers, and the conductor faces are impregnated with resin, wherein the glass cloth layers are formed by weaving bundles of glass fibers in a lattice shape, and the adjacent glass cloth layers are laminated on each other while rotating the warp-weft directions of the glass fibers by a predetermined angle with respect to each other. It is preferable that the rotation angle of the warp-weft directions of the glass fibers of the adjacent glass cloth layers falls within a range from 30 to 60 degrees.