Patents by Inventor Kazunori Nitta

Kazunori Nitta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding apparatus
    Publication number: 20060021710
    Abstract: A die bonding apparatus includes a pre-press and fix unit and a bonding unit each having an imager and a holder that can move independently and simultaneously. This allows the imager and the holder to simultaneously exhibit their respective functions. Consequently the die bonding apparatus can mount an electronic component on a substrate rapidly and with high precision.
    Type: Application
    Filed: July 28, 2005
    Publication date: February 2, 2006
    Inventor: Kazunori Nitta