Abstract: A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.

Abstract: The present invention includes a threshold value calculation unit that calculates a normal range that is a range of values that are taken when a steam trap is in a normal state, by using a predetermined calculation reference, based at least on state values with normal determination results, from among state values that have been stored in the storage unit during a predetermined period. A determination unit can perform predictive determination to determine whether the steam trap is in a normal state or a state that indicates an inclination toward a bad state and is highly likely to change to a bad state, by determining whether or not the state values are in the normal range, and the threshold value calculation unit performs accuracy determination to determine the accuracy of the predictive determination based on the results of the predictive determination regarding the state values stored in the storage unit, and adjusts the calculation reference based on the result of accuracy determination.

Abstract: A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.

Abstract: A method for optimizing a fluid utilization facility. The method includes monitoring an operating state of a fluid utilization device and an operating state of a drain trap in a fluid utilization facility based on detection information obtained by detectors installed in various places in the fluid utilization facility. A running state of the fluid utilization facility is optimized based on a monitoring result.

Abstract: Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.

Abstract: A method for optimizing a fluid utilization facility. The method includes monitoring an operating state of a fluid utilization device and an operating state of a drain trap in a fluid utilization facility based on detection information obtained by detectors installed in various places in the fluid utilization facility. A running state of the fluid utilization facility is optimized based on a monitoring result.

Abstract: A method for optimizing a fluid utilization facility. The method includes monitoring an operating state of a fluid utilization device and an operating state of a drain trap in a fluid utilization facility based on detection information obtained by detectors installed in various places in the fluid utilization facility. A running state of the fluid utilization facility is optimized based on a monitoring result.

Abstract: A maintenance support system for a plurality of maintenance-target apparatus in a plant includes a maintenance information delivery unit that delivers maintenance information Im that indicates an operational status of each maintenance-target apparatus to maintenance personnel every preset time T, wherein the maintenance information delivery unit delivers predictive information If to the maintenance personnel at a specified time Tf between the previous delivery of the maintenance information Im and the next delivery of the maintenance information Im, the predictive information If providing predictions regarding the operational status of each maintenance-target apparatus at the next delivery of the maintenance information Im.

Abstract: The present invention includes a threshold value calculation unit that calculates a normal range that is a range of values that are taken when a steam trap is in a normal state, by using a predetermined calculation reference, based at least on state values with normal determination results, from among state values that have been stored in the storage unit during a predetermined period. A determination unit can perform predictive determination to determine whether the steam trap is in a normal state or a state that indicates an inclination toward a bad state and is highly likely to change to a bad state, by determining whether or not the state values are in the normal range, and the threshold value calculation unit performs accuracy determination to determine the accuracy of the predictive determination based on the results of the predictive determination regarding the state values stored in the storage unit, and adjusts the calculation reference based on the result of accuracy determination.

Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

Abstract: A resin-attached lead frame and a semiconductor device including the resin-attached lead frame. The resin-attached lead frame includes a lead frame main body having a die pad (LED element resting portion) and a lead portion disposed apart from the die pad. The lead frame main body further includes an LED element resting region formed over an area including an upper surface of the die pad and an upper surface of the lead portion. A reflecting resin section surrounds the LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A method for optimizing a fluid utilization facility. The method includes monitoring an operating state of a fluid utilization device and an operating state of a drain trap in a fluid utilization facility based on detection information obtained by detectors installed in various places in the fluid utilization facility. A running state of the fluid utilization facility is optimized based on a monitoring result.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A resin-attached lead frame and a semiconductor device including the resin-attached lead frame. The resin-attached lead frame includes a lead frame main body having a die pad (LED element resting portion) and a lead portion disposed apart from the die pad. The lead frame main body further includes an LED element resting region formed over an area including an upper surface of the die pad and an upper surface of the lead portion. A reflecting resin section surrounds the LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.