Patents by Inventor Kazunori Ohmizo
Kazunori Ohmizo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8066891Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: GrantFiled: October 6, 2006Date of Patent: November 29, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Patent number: 7338716Abstract: This invention relates to a laminate comprising an insulating polyimide resin layer etchable by an aqueous alkaline solution and a metal foil. The laminate has an insulating resin layer composed of a plurality of polyimide resin layers on the metal foil and the insulating resin layer has at least one polyimide resin layer (A) with a coefficient of linear thermal expansion (CTE) of 30×10?6/° C. or less and at least one polyimide resin layer (B) with a glass transition temperature (Tg) of 300° C. or below, the layer in contact with the metal foil is the polyimide resin layer (B), the bonding strength between the metal foil and the polyimide resin layer (B) in contact therewith is 0.5 kN/m or more, and the average rate of etching of the insulating resin layer by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is 0.5 ?m/min or more. The laminate is useful for flexible printed circuits and the like.Type: GrantFiled: February 25, 2002Date of Patent: March 4, 2008Assignee: Nippon Steel Chemical Co., Ltd.Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Publication number: 20070026678Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: ApplicationFiled: October 6, 2006Publication date: February 1, 2007Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Publication number: 20060073316Abstract: This invention relates to an HDD suspension and a process for its manufacture with high productivity and reliability. The HDD suspension of this invention is manufactured from a laminate composed of a stainless steel substrate, an insulating resin layer and a metal foil by wet-etching the laminate by the use of a basic fluid. The insulating layer of the laminate is composed of plural layers of polyimide, every constituent layer exhibits a mean etching rate of 0.5 ?M/min or more by a 50 wt % aqueous solution of KOH at 80° C., the layers in contact with the stainless steel substrate and the metal foil are those of polyimide (B) exhibiting a glass transition temperature of 300° C. or less and the adhesive strength between the layer of polyimide (B) and either the stainless steel substrate or the metal foil is 0.5 kN/m or more.Type: ApplicationFiled: October 20, 2005Publication date: April 6, 2006Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose, Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Michiaki Uchiyama, Shigeki Kawano
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Publication number: 20060037674Abstract: The invention relates to a substrate for HDD suspension. A laminate for HDD suspension comprises a stainless steel layer, a polyimide resin layer, and a conductor layer. The conductor layer is composed of a copper or copper alloy foil having a thickness of 14 ?m or less, a tensile strength of 400 MPa, and a conductance of 65% or more. A suspension formed of such a laminate facilitates the control of the flying height of the slider of the suspension essential to great progress of the technology for higher capacity of HDDs, facilitates the impedance control improves the tension rate, reduces the loss of electric signal, facilitates machining of the shape of the flying lead, and provides durability.Type: ApplicationFiled: November 25, 2003Publication date: February 23, 2006Inventors: Kazuto Okamura, Kazunori Ohmizo, Takaki Suzuki
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Publication number: 20040096676Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: ApplicationFiled: August 15, 2003Publication date: May 20, 2004Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Publication number: 20040067349Abstract: This invention relates to a laminate comprising an insulating polyimide resin layer etchable by an aqueous alkaline solution and a metal foil. The laminate has an insulating resin layer composed of a plurality of polyimide resin layers on the metal foil and the insulating resin layer has at least one polyimide resin layer (A) with a coefficient of linear thermal expansion (CTE) of 30×10−6/° C. or less and at least one polyimide resin layer (B) with a glass transition temperature (Tg) of 300° C. or below, the layer in contact with the metal foil is the polyimide resin layer (B), the bonding strength between the metal foil and the polyimide resin layer (B) in contact therewith is 0.5 kN/m or more, and the average rate of etching of the insulating resin layer by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is 0.5 &mgr;m/min or more. The laminate is useful for flexible printed circuits and the like.Type: ApplicationFiled: November 17, 2003Publication date: April 8, 2004Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Patent number: 6713480Abstract: Methods of using a compound, its pharmaceutically acceptable salts, and/or its pro-drug esters, in isolated form, to treat cancer, and methods for isolating, for formulating, and for administering the compound, salt, and/or pro-drug ester as an antitumor agent, wherein the compound, salt, or pro-drug ester has the following generic structure: wherein R1, R2, R3, R4, R5, R6, R7, R8, X1 and X2 are selected from specified residues, as described, and the dashed bond represents either a carbon-carbon single bond or a carbon-carbon double bond.Type: GrantFiled: November 27, 2001Date of Patent: March 30, 2004Assignee: Nereus Pharmaceuticals Inc.Inventors: Kenji Fukumoto, Shinkichi Kohno, Kaneo Kanoh, Tohru Asari, Hiroshi Kawashima, Hirokatsu Sekiya, Kazunori Ohmizo, Takeo Harada
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Publication number: 20020155710Abstract: This invention relates to an HDD suspension and a process for its manufacture with high productivity and reliability. The HDD suspension of this invention is manufactured from a laminate composed of a stainless steel substrate, an insulating resin layer and a metal foil by wet etching the laminate by the use of a basic fluid. The insulating layer of the laminate is composed of plural layers of polyimide, every constituent layer exhibits a mean etching rate of 0.5 &mgr;m/min or more by a 50 wt % aqueous solution of KOH at 80° C., the layers in contact with the stainless steel substrate and the metal foil are those of polyimide (B) exhibiting a glass transition temperature of 300° C. or less and the adhesive strength between the layer of polyimide (B) and either the stainless steel substrate or the metal foil is 0.5 kN/m or more.Type: ApplicationFiled: February 15, 2002Publication date: October 24, 2002Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose, Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Michiaki Uchiyama, Shigeki Kawano
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Publication number: 20020143021Abstract: Methods of using a compound, its pharmaceutically acceptable salts, and/or its pro-drug esters, in isolated form, to treat cancer, and methods for isolating, for formulating, and for administering the compound, salt, and/or pro-drug ester as an antitumor agent, wherein the compound, salt, or pro-drug ester has the following structure: 1Type: ApplicationFiled: November 27, 2001Publication date: October 3, 2002Inventors: Kenji Fukumoto, Shinkichi Kohno, Kaneo Kanoh, Tohru Asari, Hiroshi Kawashima, Hirokatsu Sekiya, Kazunori Ohmizo, Takeo Harada
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Patent number: 6358957Abstract: A compound, its pharmaceutically acceptable salts, and/or its pro-drug esters, in isolated form, and methods for isolating, for formulating, and for administering the compound, salt, and/or pro-drug ester as an antitumor agent, wherein the compound, salt, or pro-drug ester has the following structure: wherein: R1, R2, R5, R7,and R8 are each separately selected from the group consisting of a hydrogen atom, a halogen atom, and saturated C1-C24 alkyl, unsaturated C1-C24 alkenyl, cycloalkyl, cycloalkenyl, alkoxy, cycloalkoxy, aryl, substituted aryl, heteroaryl, substituted heteroaryl, amino, substituted amino, nitro, substituted nitro, phenyl, and substituted phenyl groups, R3, R4, and R6 are each separately selected from the group consisting of a hydrogen atom, a halogen atom, and saturated C1-C12 alkyl, unsaturated C1-C12 alkenyl, cycloalkyl, alkoxy, cycloalkoxy, aryl, substituted aryl, heteroaryl, substituted heteroaryl, amino, substituted amino, nitro, and substituted nitro groups, X1 andType: GrantFiled: November 12, 1999Date of Patent: March 19, 2002Assignee: Nereus Pharmaceuticals, Inc.Inventors: Kenji Fukumoto, Shinkichi Kohno, Kaneo Kanoh, Tohru Asari, Hiroshi Kawashima, Hirokatsu Sekiya, Kazunori Ohmizo, Takeo Harada