Abstract: There is disclosed a conductive ball- or pin-mounted semiconductor packaging substrate having a conductive ball or a conductive pin mounted on a conductive land or through-hole of the semiconductor packaging substrate, wherein the conductive ball or the conductive pin is electrically connected with the conductive land or through-hole through a reflow of a conductive bonding material comprising, at least, a low-melting point lead-free SnBi-based solder and a thermosetting adhesive resin exhibiting fluxing effects.