Patents by Inventor Kazunori Shimazaki

Kazunori Shimazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Position difference detecting device and method thereof
    Patent number: 5917601
    Abstract: An R-.theta. robot moves a wafer between chambers according to an instruction issued by a robot controller. An optical sensor detects two edge positions of the wafer which stands still in a hand of the R-.theta. robot when the R-.theta. robot is in a predetermined stationary state. The robot controller obtains the length and the middle position of a chord of the wafer based on the two edge positions. This data is compared with the data of the length and the middle position of the chord which should be obtained when the wafer is placed in a reference position in the hand of the R-.theta. robot, so that a position difference of the wafer to be moved from the reference position is detected. The robot controller controls the operations of the R-.theta. robot in order to correct the detected position difference.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: June 29, 1999
    Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
    Inventors: Kazunori Shimazaki, Kiyoshi Yoshida
  • Substrate of a hybrid IC, method of forming a circuit pattern and apparatus of forming the same
    Patent number: 5064711
    Abstract: A hybrid IC substrate has a substrate body and a retaining film which is formed on a surface of the substrate body. The retaining film enables a solution containing a circuit-element-forming material to permeate therethrough and retains the solution on the substrate body. The solution, which is expelled onto the hybrid IC substrate in the form of liquid drops, permeates the above-mentioned retaining film and becomes attached to the surface of the substrate body. Then, the hybrid IC substrate is baked. The retaining film is thus backed off, thereby forming a film of the circuit-element-forming material as a circuit pattern on the substrate body.
    Type: Grant
    Filed: October 17, 1989
    Date of Patent: November 12, 1991
    Assignees: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho, Shuzo Hattori
    Inventors: Takatoshi Ito, Akihiro Yoshida, Kazunori Shimazaki, Shuzo Hattori
  • Substrate of a hybrid ic, method of forming a circuit pattern and apparatus of forming the same
    Patent number: 4891242
    Abstract: A hybrid IC substrate has a substrate body and a retaining film which is formed on a surface of the substrate body. The retaining film enables a solution containing a circuit-element-forming material to permeate therethrough and retains the solution on the substrate body. The solution, which is expelled onto the hybrid IC substrate in the form of liquid drops, permeates the above-mentioned retaining film and becomes attached to the surface of the substrate body. Then, the hybrid IC substrate is baked. The retaining film is thus baked off, thereby forming a film of the circuit-element-forming material as a circuit pattern on the substrate body.
    Type: Grant
    Filed: July 1, 1987
    Date of Patent: January 2, 1990
    Assignees: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho, Shuzo Hattori
    Inventors: Takatoshi Ito, Akihiro Yoshida, Kazunori Shimazaki, Shuzo Hattori