Patents by Inventor Kazunori Tajima

Kazunori Tajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
    Publication number: 20100186991
    Abstract: A method of forming a conductive bump using a wire-bonding machine is provided. The method includes (a) depositing a free air ball bump on a contact pad of a semiconductor element, (b) forming a first fold of wire on the deposited free air ball bump, and (c) forming a second fold of wire on the first fold of wire.
    Type: Application
    Filed: October 18, 2006
    Publication date: July 29, 2010
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Kazunori Tajima, Wei Qin, Stephen E. Babinetz