Abstract: A fishing line guide member is formed in a ring shape, and has a curve surface curved from an inner circumferential side toward an outer circumferential side in a cross-sectional view with respect to a cross-section of the fishing line guide member taken along a cut plane including an axis line of the fishing line guide member. In an inner circumferential side part of the curve surface, R1 is larger than R2, in which R1 denotes a curvature radius of an axial center side part of the curve surface and R2 denotes a curvature radius of an axial end side part of the curve surface.

Abstract: A fishing line guide member is formed in a ring shape, and has a curve surface curved from an inner circumferential side toward an outer circumferential side in a cross-sectional view with respect to a cross-section of the fishing line guide member taken along a cut plane including an axis line of the fishing line guide member. In an inner circumferential side part of the curve surface, R1 is larger than R2, in which R1 denotes a curvature radius of an axial center side part of the curve surface and R2 denotes a curvature radius of an axial end side part of the curve surface.

Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.

Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.

Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.

Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.

Abstract: An ornamental article comprises a base at least a surface portion of which comprises a transition metal selected from Group 4a, 5a and 6a elements in the periodic table or its alloy; a hard carbon film covering a surface of the base; and an intermediate layer interposed between the base and the hard carbon film and containing a carbide of the transition metal. The hard carbon film has a high adhesion strength to its base, and is superior in corrosion resistance and abrasion resistance.

Abstract: There is Provided a decorative member having a coat of a hard carbon layer on a surface of a ceramic base, wherein the hard carbon layer has peaks in the ranges of wave numbers 1160.+-.40 cm.sup.-1, 1340.+-.40 cm.sup.-1 and 1500.+-.60 cm.sup.-1 of Raman spectra, and maximum intensity H.sub.1 of the peak residing in the range of 1160.+-.40 cm.sup.-1, maximum intensity H.sub.2 residing of 1340.+-.40 cm.sup.-1 cm.sup.-1 and maximum intensity H.sub.3 residing 1500.+-.60 cm.sup.-1 satisfy the following relations: 0.02.ltoreq.H.sub.1 /H.sub.2 .ltoreq.1.0 and H.sub.2 <H.sub.3, said member showing an excellent corrosion resistance, having no oozing out of a solution of a metal causing allergy on a human body and having a required mechanical properties.