Patents by Inventor Kazunori Umeoka

Kazunori Umeoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7735219
    Abstract: A method for machining a board includes forming a backup board, supporting the board by the backup board and machining the board while the board is supported by the backup board. The backup board has a fibrous layer and a surface layer formed on one side of the fibrous layer, the surface layer being in contact with the board during said supporting machining the board. The backup board is formed by: forming an impregnated fibrous mat by impregnating a thermosetting adhesive into a fibrous mat of the kenaf fibers, the kenaf fibers; forming the fibrous layer having a density of about 600-900 kg/m3 by curing the impregnated fibrous mat; forming a resin paper by impregnating a thermosetting resin into a paper; and forming the surface layer on said one side of the fibrous layer by curing the resin paper.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: June 15, 2010
    Assignee: Panasonic Corporation
    Inventors: Kazunori Umeoka, Toru Fujioka, Hideyuki Andou, Yuzo Okudaira
  • Publication number: 20070193680
    Abstract: A backup board for use in a machining process includes a fibrous layer, at least one side of the fibrous layer being provided with a surface layer adhered and laminated thereon, wherein the surface layer is made of a cured paper impregnated with a thermosetting resin. The fibrous layer has a density of about 600˜900 kg/m3 and includes kenaf fibers adhered together by impregnating a thermosetting adhesive into a fibrous mat of the kenaf fibers, the kenaf fibers having an average length of about 10˜200 mm and an average diameter of about 10˜300 ?m.
    Type: Application
    Filed: April 19, 2007
    Publication date: August 23, 2007
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Kazunori Umeoka, Toru Fujioka, Hideuki Andou, Yuzo Okudaira
  • Patent number: 7157138
    Abstract: A fiber board, comprising: kenaf fibers having an average length of 10 to 200 mm and an average diameter of 10 to 300 ?m, and a thermosetting adhesive agent, the fiber board having a density of 600 to 900 kg/m3, being excellent in strength and moisture permeability.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: January 2, 2007
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Kenji Ohnishi, Masayuki Okuzawa, Yuzo Okudaira, Hideyuki Ando, Kazunori Umeoka, Ryo Sugawara, Bunkai Ryu
  • Patent number: 7045027
    Abstract: The present invention relates to a method of producing a fiber board characterized in that it comprises the following processes (a)–(f): (a) a separating process of a bast portion, (b) a fiberizing process by defibrating the bast portion of the kenaf, (c) a preparing process of a mat comprising the kenaf fibers having an average length of 10–200 mm and an average diameter of 10–300 ?m, (d) a supplying process of an adhesive agent into the fiber mat, (e) a drying process of the adhesive agent, and (f) a molding process by heating said fiber mat under pressure to form a fiber board having a density of 600–900 kg/m3.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: May 16, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Masayuki Okuzawa, Kenji Ohnishi, Yuzo Okudaira, Hideyuki Ando, Kazunori Umeoka, Bunkai Ryu, Shigeki Naito, Ryo Sugawara
  • Publication number: 20050176328
    Abstract: A backup board for use in a machining process includes a fibrous layer, at least one side of the fibrous layer being provided with a surface layer adhered and laminated thereon, wherein the surface layer is made of a cured paper impregnated with a thermosetting resin. The fibrous layer has a density of about 600˜900 kg/m3 and includes kenaf fibers adhered together by impregnating a thermosetting adhesive into a fibrous mat of the kenaf fibers, the kenaf fibers having an average length of about 10˜200 mm and an average diameter of about 10˜300 ?m.
    Type: Application
    Filed: October 8, 2004
    Publication date: August 11, 2005
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Kazunori Umeoka, Toru Fujioka, Hideyuki Andou, Yuzo Okudaira
  • Publication number: 20040224140
    Abstract: A fiber board, comprising:
    Type: Application
    Filed: January 15, 2004
    Publication date: November 11, 2004
    Inventors: Kenji Ohnishi, Masayuki Okuzawa, Yuzo Okudaira, Hideyuki Ando, Kazunori Umeoka, Ryo Sugawara, Bunkai Ryu
  • Publication number: 20040187998
    Abstract: The present invention relates to a method of producing a fiber board characterized in that it comprises the following processes (a)-(f):
    Type: Application
    Filed: January 15, 2004
    Publication date: September 30, 2004
    Inventors: Masayuki Okuzawa, Kenji Ohnishi, Yuzo Okudaira, Hideyuki Ando, Kazunori Umeoka, Bunkai Ryu, Shigeki Naito, Ryo Sugawara
  • Patent number: 5304415
    Abstract: A sound absorptive material has powder particles having a sound absorption characteristics at a low frequency and generally supported in a vibratable state by a porous support, whereby the sound absorptive material can be increased in the sound absorption coefficient in the low frequency range while maintaining the absorptive material to be thin.
    Type: Grant
    Filed: April 14, 1992
    Date of Patent: April 19, 1994
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Yoshitaka Kurihara, Yuzo Okudaira, Hideyuki Ando, Wakio Yamada, Kazunori Umeoka, Takashi Nakai