Patents by Inventor Kazuo Arisue

Kazuo Arisue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6864574
    Abstract: Electrodes of one face of a semiconductor, which has electrodes formed on both faces, and a heat radiating plate are directly joined to quickly absorb and diffuse heat of the semiconductor, thereby improving a heat radiation effect. At the same time, electrodes on an opposite face of the semiconductor are connected to pillared electrodes that are thicker than a wire for wire bonding and larger in current capacity. These pillared electrodes can accordingly be utilized as connecting terminals to a circuit board. Ceramic is used for the heat radiating plate, so that semiconductors of different functions can be mounted simultaneously.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: March 8, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Nobori, Yosinori Sakai, Kazuo Arisue
  • Patent number: 6603154
    Abstract: A lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, thereby allowing the semiconductor to have a reduced temperature.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: August 5, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshinori Sakai, Kazuhiro Nobori, Kazuo Arisue
  • Publication number: 20020019078
    Abstract: The lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, allowing the semiconductor to have a reduced temperature.
    Type: Application
    Filed: March 23, 2001
    Publication date: February 14, 2002
    Inventors: Yoshinori Sakai, Kazuhiro Nobori, Kazuo Arisue