Patents by Inventor Kazuo Fujinami

Kazuo Fujinami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5378428
    Abstract: A method of preserving an article which includes enclosing the article and an oxygen absorbent parcel in a container having gas-barrier properties and sealing the container. The parcel is formed by packing an oxygen absorbent composition with a gas permeable packing material, the oxygen absorbent composition containing an linear hydrocarbon polymer having one or more unsaturated groups or a mixture of the polymer with an unsaturated fatty acid compound, an oxidation promoter, a basic substance and an adsorption substance.
    Type: Grant
    Filed: November 19, 1993
    Date of Patent: January 3, 1995
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshiaki Inoue, Shigeru Murabayashi, Kazuo Fujinami, Isamu Yoshino, Takamasa Kawakami, Satoru Makinose, Akira Naito
  • Patent number: 5305948
    Abstract: The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: April 26, 1994
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshio Yoshikawa, Yoshiaki Inoue, Teruo Takeuchi, Kazuo Fujinami
  • Patent number: 5286407
    Abstract: An oxygen absorbent composition containing a linear hydrocarbon polymer having one or more unsaturated groups or a mixture of a linear hydrocarbon polymer having one or more unsaturated groups with an unsaturated fatty acid compound and an oxidation promoter as essential components and optionally containing a basic substance and/or an adsorption substance; an oxygen absorbent parcel formed by packing the oxygen absorbent composition with a gas-permeable packing material; and a method of preserving an article by means of same.
    Type: Grant
    Filed: April 24, 1991
    Date of Patent: February 15, 1994
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshiaki Inoue, Shigeru Murabayashi, Kazuo Fujinami, Isamu Yoshino, Akira Naito