Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract: A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a tensile elastic modulus of 50 MPa or lower and a thermal conductivity of 0.5 W/mK or higher; and (E) a thermally non-conductive layer with a thermal conductivity of lower than 0.5 W/mK, the heat-generating element (B) being placed on the printed circuit board (A), the heat-generating element (B) and the thermally conductive resin layer (D) being in contact with each other, the thermally non-conductive layer (E) being provided between the heat-generating element (B) and the electromagnetic shielding case (C).

Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

Abstract: The invention provides a primer composition excellent in adhesion to porous substrates and a method of bonding.

Abstract: A curable resin composition containing (A) a saturated hydrocarbon polymer having at least one reactive silicon-containing group in a molecule, and (B) a hydrogenated oligomer of an &agr;-olefin, or a curable resin composition containing (A) a saturated hydrocarbon polymer having at least one reactive silicon-containing group in a molecule, (C) a saturated hydrocarbon oligomer, and (D) an ester plasticizer, both of which have good workability, in particular, at low temperature.

Abstract: A method for producing an adhered or sealed anodized aluminum product or a glass product surface-treated by metal or a metal compound, by using as adhesive or sealant a curable composition, in an adhering treatment or sealing treatment of an adhesion substrate composed of anodized aluminum or glass surface-treated by metal or a metal compound, wherein the curable composition comprising (A) a saturated hydrocarbon polymer having at least one silicon-containing group crosslinkable by forming a siloxane bond and having a hydroxyl group or a hydrolyzable group bonded to the silicon atom, and (B) a silane coupling agent selected from a group comprising an epoxy group-containing silane coupling agent and an isocyanate group-containing silane coupling agent.

Abstract: The present invention provides a toner composition mainly comprising a binder resin (D) which contains at least 20% by weight of an urethane-modified polyester resin (C) obtained by reacting a polyester resin (A) with an isocyanate compound (B) and whose gel fraction ranges from 2 to 75% by weight. The toner composition exhibits good melting properties upon heating suitable for fast reproduction such as a low lower limit of the fixing temperature and a wide range for permitted fixing temperature and is further excellent in resistance to blocking, resistance to carrier contamination and image-forming properties. The binder resin as the main component of the toner composition can be prepared according to a method comprising the step of continuously adding an isocyanate compound (B) to a polyester resin (A) in an equivalent ratio, NCO/OH, of the amount of the NCO groups of the isocyanate compound (B) to that of OH groups of the polyester resin (A) ranging from 0.3 to 1.

Abstract: Disclosed is a toner composition for electrophotography which comprises, as a principal component, a urethane-modified polyester resin whose loss tangent (tan .delta.) has a maximum and a minimum both falling within the range of from 0.7 to 2.5, the loss tangent being determined at 150.degree. C. and a frequency ranging from 10.sup.-2 to 10 Hz. The toner composition has excellent low temperature fixing ability and offset resistance as well as a wide range of permitted fixing temperature.

Abstract: A toner composition for electrophotography comprises, as a principal component, a reaction product of a mixture which comprises 20 to 80% by weight of a polyester resin (A) whose number average molecular weight ranges from 1,000 to 5,000, whose glass transition point ranges from 0.degree. to 50.degree. C. , whose OH value ranges from 20 to 60 KOHmg/g and which is prepared by using at least one trifunctional alcohol in an amount of from 2 to 10 mole % on the basis of the total amount of starting raw alcohols consisting of at least one diol and at least one trifunctional alcohol; and 80 to 20% by weight of a polyester resin (B) whose number average molecular weight ranges from 1,000 to 5,000, whose glass transition point ranges from 50.degree. to 90.degree. C. and whose OH value is not more than 5 KOH mg/g, with a diisocyanate.

Abstract: In accordance with the present invention, there is provided a process for producing polytetrafluoroethylene (PTFE) resin molded articles, wherein an unsintered PTFE resin paste extrusion molded article as extruded from an extrusion machine and inserted into a sintering mold having an inside diameter slightly larger than an outside diameter of said unsintered PTFE resin molded article is sintered at a temperature higher than a melting point of the PTFE resin. In another aspect of the invention, PTFE resin molded articles are produced by a process wherein an unsintered PTFE resin paste extrusion molded article immediately after being extruded from an extrusion machine is sized by means of a sizing die, and the unsintered PTFE molded article thus sized is inserted into a sintering mold having an inside diameter slightly larger than an outside diameter of said unsintered molded article, followed by sintering at a temperature higher than a melting point of the PTFE resin.

Abstract: A resin for toner of electrophotography comprises a urethane-modified polyester resin (D) having a glass transition temperature ranging from 40.degree. to 75.degree. C., which is obtained by reacting a resin mixture composed of a polyester resin (A) having a number-averaging molecular weight of 1,000 to 15,000 and a hydroxyl value of 10 to 100 and a polyester resin (B) having a number-average molecular weight ranging from 1,000 to 5,000 and a sum of acid value and hydroxyl value of less than 10, in a weight ratio of (A)/(B) ranging from 20:80 to 60:40, with 0.3 to 0.99 molar equivalent of an isocyanate compound (C) per one molar equivalent of hydroxyl group of the polyester resin (A).The resin for toner is excellent in grindability and storage stability and it provides toners for electrophotography having good anti-blocking properties and good fixing properties whereby good images free of fogging can be obtained.

Abstract: A resin for toner of electrophotography comprises a urethane-modified polyester resin (D) having a glass transition temperature ranging from 40.degree. to 75.degree. C., which is obtained by reacting a resin mixture composed of a polyester resin (A) having a number-average molecular weight of 1,000 to 15,000 and a hydroxyl value of 10 to 100 and a polyester resin (B) having a number-average molecular weight ranging from 1,000 to 5,000 and a sum of acid value and hydroxyl value of less than 10, in a weight ratio of (A)/(B) ranging from 20:80 to 60:40, with 0.3 to 0.99 molar equivalent of an isocyanate compound (C) per one molar equivalent of hydroxyl group of the polyester resin (A).The resin for toner is excellent in grindability and storage stability and it provides toners for electrophotography having good anti-blocking properties and good fixing properties whereby good images free of fogging can be obtained.

Abstract: A solution containing atactic polypropylene by-produced during the preparation of a propylene-containing polymer is passed through a tubular, elongated heating zone having a pressure difference of at least 3 kg/cm.sup.2 between its inlet and outlet so that the calculated flow velocity at the outlet is at least 40 m/sec, whereby sticky fine particles of molten atactic polypropylene substantially free of the solvent are formed in suspension in the vaporized solvent. Then, the sticky fine particles are separated from the vaporized solvent.