Patents by Inventor Kazuo Hayakawa
Kazuo Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7596604Abstract: The objective of the present invention is to easily acquire necessary information at arbitrary times.Type: GrantFiled: September 30, 2005Date of Patent: September 29, 2009Assignee: Dwango Co., Ltd.Inventors: Nobuo Kawakami, Masato Horinouchi, Kazuo Hayakawa
-
Patent number: 7513967Abstract: A raw material including a mixture of a natural fiber and a thermoplastic fiber is supplied to a surface of a rotating rotary body. The natural and thermoplastic fibers are scattered toward a carrying surface of a conveyor belt by the rotational force of the rotary body. An air blower may direct pressurized air to the scattered raw material in order to further effect separation of the natural and thermoplastic fibers. Consequently, the natural fibers and the thermoplastic fibers are deposited such that the relative concentration of the natural fibers and the thermoplastic fibers gradually and seamlessly changes or varies across the thickness of depth of the resulting molded fiber material.Type: GrantFiled: September 27, 2001Date of Patent: April 7, 2009Assignees: Toyota Boshoku Kabushiki Kaisha, Kabushiki Kaisha OtsukaInventors: Takehiro Kato, Kumiko Sango, Masato Nomura, Kazuo Hayakawa
-
Publication number: 20070083598Abstract: The objective of the present invention is to easily acquire necessary information at arbitrary times.Type: ApplicationFiled: September 30, 2005Publication date: April 12, 2007Applicant: Dwango Co., Ltd.Inventors: Nobuo Kawakami, Masato Horinouchi, Kazuo Hayakawa
-
Publication number: 20070073714Abstract: The objective of the present invention is to distribute a variety of information to a user without the user being forced to perform an unnecessary operation, so that the effects produced by information distribution can be improved. An email, which serves as a search trigger, is received from a portable phone and a search query is extracted from the email, multiple predesignated searches of different types are then performed, in accordance with the search query, and based on multiple search results obtained by the searches, multiple reply email messages are generated, for which the transmission source address of the received email is regarded as the reply destination, and the reply email messages are transmitted to the reply destination.Type: ApplicationFiled: September 30, 2005Publication date: March 29, 2007Applicant: Dwango Co., Ltd.Inventors: Nobuo Kawakami, Masato Horinouchi, Kazuo Hayakawa
-
Publication number: 20070027918Abstract: There are provided a mail processing server, a mail processing method, and a mail processing program, which can more efficiently utilize server resources and construct a system at low cost. First, desired information is retrieved from any one of a dictionary DB, a story DB, and a game contents DB of a database in which information on information retrieval request is registered on the basis of state information corresponding to a current information retrieval request from a mobile phone. Then, a mail in which retrieval result information and state information relating to the retrieval result information are described is transmitted to the mobile phone. In response to a reply mail from the mobile phone, next information retrieval is executed based on the state information described in the reply mail.Type: ApplicationFiled: September 30, 2005Publication date: February 1, 2007Applicant: Dwango Co., Ltd.Inventors: Nobuo Kawakami, Masato Horinouchi, Kazuo Hayakawa
-
Publication number: 20040026012Abstract: A raw material (12) comprising a mixture of a natural fiber and a thermoplastic fiber is supplied to the surface of the rotating rotary body (11). The natural and thermoplastic fibers are scattered toward the carrying surface of the conveyor belt (15) by the rotational force of the rotary body (11). An air blower (14) may direct pressurized air to the scattered raw material (14) in order to further effect separation of the natural and thermoplastic fibers. Consequently, the natural fibers and the thermoplastic fibers are deposited such that the relative concentration of the natural fibers and the thermoplastic fibers gradually and seamlessly changes or varies across the thickness or depth of the resulting molded fiber material (50).Type: ApplicationFiled: August 8, 2003Publication date: February 12, 2004Inventors: Takehiro Kato, Kumiko Sango, Masato Nomura, Kazuo Hayakawa
-
Patent number: 6001265Abstract: A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurry waste fluid, and making a contribution to a reduction of a total slicing cost by reusing abrasive grains and water soluble coolant.Type: GrantFiled: February 14, 1997Date of Patent: December 14, 1999Assignees: Shin-Etsu Handotai Co., Ltd., Mimasu Semiconductor Industry Co., Ltd., Ohtomo Chemical Ind., Corp., Hitachi Zosen Metal Works Co., Ltd.Inventors: Kohei Toyama, Etsuo Kiuchi, Kazuo Hayakawa, Shingo Kaburagi, Akio Ashida, Takara Ito, Kuniaki Noami
-
Patent number: 5937844Abstract: In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.Type: GrantFiled: March 24, 1997Date of Patent: August 17, 1999Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Etsuo Kiuchi, Kazuo Hayakawa, Kohei Toyama
-
Patent number: 5927131Abstract: A method of manufacturing wire for use in a wire saw used for slicing a semiconductor ingot into wafers is disclosed. A starting wire, which is an iron or iron alloy wire plated with copper or copper alloy, is drawn into a fine wire in a finish drawing step. Subsequently, copper or copper alloy plating is removed from the fine wire surface through chemical polishing with an acid treatment solution or a like solution, physical polishing with polishing cloth or the like, or electropolishing, or through combined polishing thereof. The method makes it possible to manufacture wire having excellent quality characteristics without raising a problem such as metal contamination of product wafers sliced from the ingot.Type: GrantFiled: March 20, 1997Date of Patent: July 27, 1999Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Etsuo Kiuchi, Kazuo Hayakawa, Kohei Toyama
-
Patent number: 5907988Abstract: A wire saw apparatus which is less susceptible to loosening of the wire and to breakage thereof, includes a wire supply spool, a cutting head having a plurality of main rollers around which a wire from the wire supply spool is wrapped, a wire take-up spool for taking-up the wire from the cutting head, and a plurality of guide rollers for guiding the wire which are arranged between the wire supply spool and the cutting head and between the cutting head and the wire take-up spool, wherein each of the guide rollers has a peripheral groove having a square-shaped section with a width of 2-20 times the diameter of the wire, and the number of turns of the wire which is wrapped around each guide roller in the groove having a square-shaped section is not less than 1 and not more than 5.Type: GrantFiled: July 31, 1997Date of Patent: June 1, 1999Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Etsuo Kiuchi, Kazuo Hayakawa, Kouhei Toyama
-
Patent number: 5875769Abstract: A method of slicing a semiconductor single crystal ingot by a wire saw slicing apparatus and a semiconductor wafer produced by the method, in which the running direction of the wire is not corresponding with the cleavage directions of the semiconductor single crystal ingot so that occurrence of cracks or breakage in the semiconductor wafer produced by the method can be suppressed significantly without any additional processes or an increase in cost.Type: GrantFiled: March 21, 1997Date of Patent: March 2, 1999Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Kohei Toyama, Etsuo Kiuchi, Kazuo Hayakawa
-
Patent number: 5839425Abstract: A wire saw for slicing a semiconductor single crystal ingot with which alignment of the crystallographic orientation of the ingot is simple and easy in a slicing process and a method for slicing the ingot by means of the wire saw. Main rollers are three-dimensionally arranged with a predetermined distance between each other, and a wire runs over the main rollers to form arrays of wire portions parallel to each other, with said wire saw an ingot being sliced into rods by pressing it to an array of wire portions between a pair of main rollers that are used to slice the ingot, while the wire is being driven and slurry is fed to the array of wire portions between the pair of main rollers, wherein the wire runs over the pair of main rollers used for slicing in a ratio of one turn over the pair of main rollers to more than one turn over the other main roller or rollers so that the array of wire portions running over the pair of main rollers used for slicing can be arranged at a desired pitch.Type: GrantFiled: September 30, 1997Date of Patent: November 24, 1998Assignees: Shin-Etsu Handotai Co., Ltd., Mimasu Semiconductor Industry Co., Ltd.Inventors: Kouhei Toyama, Etsuo Kiuchi, Kazuo Hayakawa
-
Patent number: 5715807Abstract: A wire saw for slicing a semiconductor single crystal ingot with which alignment of the crystallographic orientation of the ingot is simple and easy in a slicing process and a method for slicing the ingot by means of the wire saw. Main rollers are three-dimensionally arranged with a predetermined distance between each other, and a wire runs over the main rollers to form arrays of wire portions parallel to each other, with said wire saw an ingot being sliced into rods by pressing it to an array of wire portions between a pair of main rollers that are used to slice the ingot, while the wire is being driven and slurry is fed to the array of wire portions between the pair of main rollers, wherein the wire runs over the pair of main rollers used for slicing in a ratio of one turn over the pair of main rollers to more than one turn over the other main roller or rollers so that the array of wire portions running over the pair of main rollers used for slicing can be arranged at a desired pitch.Type: GrantFiled: April 4, 1996Date of Patent: February 10, 1998Assignees: Shin-Etsu Handotai Co., Ltd., Mimasu Semiconductor Industry Co., Ltd.Inventors: Kouhei Toyama, Etsuo Kiuchi, Kazuo Hayakawa
-
Patent number: 5693596Abstract: A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity), Na salt of ethylenediamine tetraacetic acid (metallic ion adsorbent), benzotriazole (rust-preventing auxiliary agent), and a silicone type defoaming agent to the main component.Type: GrantFiled: October 23, 1995Date of Patent: December 2, 1997Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Shingo Kaburagi, Akio Ashida, Etsuo Kiuchi, Kazuo Hayakawa, Kohei Toyama
-
Patent number: 5660650Abstract: In a method and an apparatus for correcting a hardening deformation of an annular element made out of steel, during the cooling stage of hardening, the annular element which still has an austenitic structure is subjected to working on either the outside or inside diameter, with the degree of working being 0.05-1.0% if it is on the outside diameter with the annular element being pressed into a mold, and 0.5-3.0% if the working is on the inside diameter. Thus the deformation that develops in annular steel elements due to heat treatments is effectively corrected to yield completely round, strain-free or deformation-free annular elements.Type: GrantFiled: December 20, 1995Date of Patent: August 26, 1997Assignee: NSK Ltd.Inventors: Shigeru Okita, Shizuo Mitsuhashi, Kazuo Hayakawa, Akihiro Kiuchi
-
Patent number: 5575189Abstract: A roller with grooves for a wire saw around which a cutting wire is wrapped. The roller comprises a core member having an inside divided into two areas which have a boundary at the center in the longitudinal direction of the core member, wherein each of the areas has a passage for circulation of a coolant and the inlet and the outlet of each passage are provided in the vicinity of the outer end of one area side in which the passage belongs.Type: GrantFiled: May 30, 1995Date of Patent: November 19, 1996Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Etsuo Kiuchi, Kazuo Hayakawa, Kouhei Toyama
-
Patent number: 5269285Abstract: To keep, with a simple structure, roller bearing devices, rotatably supporting the end sections of two rollers, at the same and substantially constant temperature, working fluid is applied not only to the slicing sections, but also to roller bearing devices 14b, 14c, 16b, 16c, 18b and 18c. The flow rate of the working-fluid supply to nozzles 20, 22 for slicing-section is controlled in such a way that the temperature of the working fluid coming down from the slicing sections becomes a first preset temperature; and the flow rate of the working-fluid supply to nozzles 24-29 for bearing-section is controlled in such a way that the temperature of the working fluid coming down from the bearing sections becomes a second preset temperature.Type: GrantFiled: November 27, 1992Date of Patent: December 14, 1993Assignee: Shin-Etsu Handotai Company, Ltd.Inventors: Kohei Toyama, Etsuo Kiuchi, Kazuo Hayakawa
-
Patent number: 4259456Abstract: An improved odorless polyolefin resin composition is proposed which is free from the problem of the generation of unpleasant odors unavoidable in the conventional polyolefin resin compositions filled with an inorganic filler due to the oxidative degradation of the ingredients. The deodorant effect in the inventive compositions is obtained by formulating limited amounts of a secondary alkane sulfonate having 12 to 20 carbon atoms per molecule and an organic nitrogen compound having at least one skeletal structure expressed by the formula ##STR1## in a molecule as exemplified by melamine and the like into a polyolefin resin-inorganic filler blend.Type: GrantFiled: April 2, 1979Date of Patent: March 31, 1981Assignee: The Lion Fat & Oil Co., Ltd.Inventors: Hisashi Yamada, Kazuo Hayakawa, Masayuki Makise