Abstract: The present invention relates to a process for purifying dimeric to pentameric proanthocyanidin oligomers which comprises extracting the proanthocyanidin oligomers from raw materials containing the proanthocyanidin oligomers or crude purification products therefrom by solid-liquid extraction using methyl acetate as a liquid phase; a process for purifying dimeric to pentameric proanthocyanidin oligomers which comprises pretreating with an enzyme for hydrolysis raw materials containing the proanthocyanidin oligomers, crude purification products therefrom, or a solution containing one of these; and a process for purifying dimeric to pentameric proanthocyanidin oligomers with a uniform polymerization degree which comprises separating and purifying the proanthocyanidin oligomers by polymerization degree from raw materials containing the proanthocyanidin oligomers or crude purification products there from by normal phase silica gel liquid chromatography using as a mobile phase a single solvent or a mixed solvent of

Abstract: A molded article of a thermoplastic resin with good apperance which may have a skin material is produced by providing upper and lower molds having a product part-molding section and a non-product part-molding section, supplying a melt of a thermoplastic resin in a cavity of the molds or a space between the skin material and either one of the upper and lower molds through a resin melt passage which is formed in a wall of one of the molds and has an opening for supplying the melt in the non-product part-molding section when a clearance of the cavity is larger than a thickness of a finally produced article, closing the molds to effect press molding, cooling the molds.

Abstract: The aromatic polysulfone resin composition of the present invention can be produced by mixing 100 parts by weight of an aromatic polysulfone resin and 0.1 to 5 parts by weight of a hydrotalcites and/or a zeolite. Molded articles formed of said composition have a mechanical strength and heat resistance inherent to its constituent resin, and generate low-boiling gases and corrosive gases very little. Therefore, the composition of the present invention is best suited for relay parts.

Abstract: A process for producing an aromatic polysulfone molding compound improved in mold-release characteristics by adding a predetermined amount of metal soap to aromatic polysulfone resin, wherein pellets composed of an aromatic polysulfone resin and a specific amount of metal soap, and otherwise similar pellets but containing no metal soap are prepared separately by melt-mixing, and these two kinds of pellets are dry-blended together so as to satisfy a predetermined condition.

Abstract: A resin composition for printed circuit board comprising:(A) 30-90% by weight of a liquid crystal polyester,(B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 .mu.m or below and an average length of 200 .mu.m or below, and(C) 3-30% by weight of an alkaline earth metal carbonate.

Abstract: An aromatic polysulfone resin composition with excellent plating characteristics comprising:(A) 50 to 90% by weight of an aromatic polysulfone,(B) 3 to 40% by weight of wollastonite of which 90% by weight or more of the total amount have a particle size smaller than 300 meshes, and(C) 3 to 30% by weight of an alkaline earth metal carbonate is disclosed.This aromatic polysulfone resin composition has excellent mechanical properties, thermal properties (in terms of thermal deformation temperature and linear thermal expansion coefficient), dimensional stability, thermal stability during processing and surface smoothness and also shows excellent plating characteristics in a wide range of plating conditions (etching conditions). By using this aromatic polysulfone resin composition, it is possible to easily obtain a printed circuit board having a desired configuration by means of injection molding, and it becomes possible to form the circuits with a fine line width.

Abstract: An aromatic polysulfone resin composition comprising 20 to 80% by weight of an aromatic polysulfone, 10 to 70% by weight of wallastonite and 0.5 to 20% by weight of a fluororesin. The aromatic polysulfone resin composition is superior in heat resistance, strength, stiffness, flame resistance, processability, etc. as engineering plastics.

Abstract: A polyetherketone resin composition improved in heat stability when melted, which comprises 30 to 95% by weight of polyetherketone and 70 to 5% by weight of potassium titanate fibers which do not contain more than 0.25% by weight of free potassium.

Abstract: An aromatic polysulfone resin composition comprising from 30% to 95% by weight of an aromatic polysulfone and from 5% to 70% by weight of a potassium titanate fiber having not more than 0.25% by weight of a free potassium content is disclosed. The composition has improved heat resistance, strength, rigidity and, in particular, does not undergo gelation during melting.

Abstract: A coating resin composition is described, comprising from 50 to 99% by weight of a thermoplastic aromatic polyether ketone resin and from 50 to 1% by weight of a perfluoroalkoxy resin or a tetrafluoroethylene/hexafluoropropylene copolymer resin having hexafluoropropylene content of from 18 to 25% by weight. The composition, when applied to a steel plate, for example, produces a coating film which is greatly improved in water repellency while retaining the desirable properties of the polyether ketone, such as high heat resistance, good mechanical and electrical properties, and high chemical resistance.