Patents by Inventor Kazuo Hirai
Kazuo Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9464211Abstract: The present invention relates to a curable silicone composition which is a hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element, and includes at least one type of compound selected from triazole-based compounds with the exception of benzotriazole. The curable silicone composition, for example, includes (A) an organopolysiloxane having at least 2 aliphatic unsaturated hydrocarbon groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) at least one type of compound selected from among triazole-based compounds with the exception of non-substituted benzotriazole, and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having excellent transparency and thermal shock resistance, and the optical semiconductor device utilizing the composition has excellent reliability.Type: GrantFiled: September 6, 2013Date of Patent: October 11, 2016Assignee: DOW CORNING TORAY CO., LTD.Inventors: Yusuke Miyamoto, Makoto Yoshitake, Hiroaki Yoshida, Toshiki Nakata, Kazuo Hirai
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Publication number: 20150218417Abstract: The present invention relates to a curable silicone composition which is a hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element, and includes at least one type of compound selected from triazole-based compounds with the exception of benzotriazole. The curable silicone composition, for example, includes (A) an organopolysiloxane having at least 2 aliphatic unsaturated hydrocarbon groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) at least one type of compound selected from among triazole-based compounds with the exception of non-substituted benzotriazole, and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having excellent transparency and thermal shock resistance, and the optical semiconductor device utilizing the composition has excellent reliability.Type: ApplicationFiled: September 6, 2013Publication date: August 6, 2015Inventors: Yusuke Miyamoto, Makoto Yoshitake, Hiroaki Yoshida, Toshiki Nakata, Kazuo Hirai
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Patent number: 9068049Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —R1R2SiO)m—, wherein R1 is a C1-6 alkyl group or the phenyl group, R2 is a C2-10 alkenyl group, and m is a positive number from 5 to 50; (B) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —(R3HSiO)n—, wherein R3 is a C1-6 alkyl group or the phenyl group and n is a positive number from 10 to 100; and (C) a hydrosilylation reaction catalyst, cures to form a cured product that has a small thermal expansion coefficient.Type: GrantFiled: September 27, 2012Date of Patent: June 30, 2015Assignee: DOW CORNING TORAY CO., LTD.Inventors: Kazuo Hirai, Makoto Yoshitake
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Patent number: 9045667Abstract: A curable silicone composition which comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane that has not more than 10 silicon atoms wherein from 30 to 60 mole % of all silicon-bonded organic groups therein are C2-6191 alkenyl groups; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane that has at least two silicon-bonded hydrogen atoms in one molecule wherein from 20 to 70 mole % of all silicon-bonded organic groups therein are phenyl groups; (E) a hydrosilylation reaction catalyst; (F) a white pigment; (G) a nonspherical silica or a glass fiber; and (H) a spherical silica, exhibits an excellent moldability and forms a cured product that exhibits little heat- and/or light-induced discoloration, little heat- and/or light-induced decline in mechanical strength, a high light reflectance, and an excellent dimensional stability.Type: GrantFiled: September 13, 2012Date of Patent: June 2, 2015Assignee: DOW CORNING TORAY CO., LTD.Inventors: Kazuo Hirai, Makoto Yoshitake
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Publication number: 20140377570Abstract: A curable silicone composition which comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane that has not more than 10 silicon atoms wherein from 30 to 60 mole % of all silicon-bonded organic groups therein are C2-6191 alkenyl groups; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane that has at least two silicon-bonded hydrogen atoms in one molecule wherein from 20 to 70 mole % of all silicon-bonded organic groups therein are phenyl groups; (E) a hydrosilylation reaction catalyst; (F) a white pigment; (G) a nonspherical silica or a glass fiber; and (H) a spherical silica, exhibits an excellent moldability and forms a cured product that exhibits little heat- and/or light-induced discoloration, little heat- and/or light-induced decline in mechanical strength, a high light reflectance, and an excellent dimensional stability.Type: ApplicationFiled: September 13, 2012Publication date: December 25, 2014Applicant: Dow Corning Toray Co., Ltd.Inventors: Kazuo Hirai, Makoto Yoshitake
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Publication number: 20140288235Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —R1R2SiO)m—, wherein R1 is a C1-6 alkyl group or the phenyl group, R2 is a C2-10 alkenyl group, and m is a positive number from 5 to 50; (B) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: —(R3HSiO)n—, wherein R3 is a C1-6 alkyl group or the phenyl group and n is a positive number from 10 to 100; and (C) a hydrosilylation reaction catalyst, cures to form a cured product that has a small thermal expansion coefficient.Type: ApplicationFiled: September 27, 2012Publication date: September 25, 2014Inventors: Kazuo Hirai, Makoto Yoshitake
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Patent number: 7939475Abstract: A resin composition for sliding members which comprises 1 to 10 wt. % hydrocarbon wax, 0.1 to 3 wt. % at least one member selected from the group consisting of phosphates, sulfates, and carbonates, 1 to 20 wt. % phenoxy resin, 0.1 to 5 wt. % compatibilizing agent, and a polybutylene terephthalate resin as the remainder; and a sliding member obtained by molding the resin composition. The resin composition for sliding members and the sliding member obtained by molding the resin composition have excellent frictional and wearing properties even when a soft metal, e.g., an aluminum alloy, is used as a mating material.Type: GrantFiled: August 2, 2010Date of Patent: May 10, 2011Assignee: Oiles CorporationInventor: Kazuo Hirai
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Publication number: 20100298179Abstract: A resin composition for sliding members which comprises 1 to 10 wt. % hydrocarbon wax, 0.1 to 3 wt. % at least one member selected from the group consisting of phosphates, sulfates, and carbonates, 1 to 20 wt. % phenoxy resin, 0.1 to 5 wt. % compatibilizing agent, and a polybutylene terephthalate resin as the remainder; and a sliding member obtained by molding the resin composition. The resin composition for sliding members and the sliding member obtained by molding the resin composition have excellent frictional and wearing properties even when a soft metal, e.g., an aluminum alloy, is used as a mating material.Type: ApplicationFiled: August 2, 2010Publication date: November 25, 2010Applicant: OILES CORPORATIONInventor: Kazuo Hirai
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Patent number: 7582697Abstract: A silicone rubber adhesive film comprising a composition formed from; (A) organopolysiloxane gum that has at least two alkenyl groups in each molecule; (B) wet-method hydrophobic reinforcing silica that has a specific surface area of at least 200 m2/g; (C) organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule; (D) mixture or reaction mixture from: (a) organopolysiloxane that has a branched molecular chain structure and that contains at least one silicon-bonded alkenyl group in each molecule and at least one silicon-bonded hydrolyzable group in each molecule, and (b) a silicon-containing compound that contains at least one silicon-bonded epoxy-functional hydrocarbon group and at least one silicon-bonded hydrolyzable group; and (E) curing accelerator.Type: GrantFiled: December 19, 2005Date of Patent: September 1, 2009Assignee: Dow Corning Toray Company, Ltd.Inventors: Kazuo Hirai, Hideo Miyazaki, Hiroaki Yoshida, Noriyuki Suganuma
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Publication number: 20070142538Abstract: A resin composition for sliding members which comprises 1 to 10 wt. % hydrocarbon wax, 0.1 to 3 wt. % at least one member selected from the group consisting of phosphates, sulfates, and carbonates, 1 to 20 wt. % phenoxy resin, 0.1 to 5 wt. % compatibilizing agent, and a polybutylene terephthalate resin as the remainder; and a sliding member obtained by molding the resin composition. The resin composition for sliding members and the sliding member obtained by molding the resin composition have excellent frictional and wearing properties even when a soft metal, e.g., an aluminum alloy, is used as a mating material.Type: ApplicationFiled: August 5, 2004Publication date: June 21, 2007Inventor: Kazuo Hirai
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Patent number: 7096983Abstract: The height from floor surface contact ends of leg linkages 2 to shoulder joints of a biped robot 1 when the biped robot is in an upright posture is defined to be a value falling within a range (Havg±½?) set based on an averaged value Havg obtained by averaging the heights of a group of objects (subject to operation) from the floor surface and the standard deviation ? thereof, specifically a value in a range of from approximately 700 mm to 1000 mm. By this, the installation height of shoulder joints from the floor surface can be optimally determined in accordance with the heights of the objects, thereby improving operating efficiency in an existing operating space.Type: GrantFiled: November 16, 2001Date of Patent: August 29, 2006Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Kazuo Hirai, Kenji Morii, Masato Hirose
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Publication number: 20060142472Abstract: A silicone rubber adhesive film comprising a composition formed from; (A) organopolysiloxane gum that has at least two alkenyl groups in each molecule; (B) wet-method hydrophobic reinforcing silica that has a specific surface area of at least 200 m2/g; (C) organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule; (D) mixture or reaction mixture from: (a) organopolysiloxane that has a branched molecular chain structure and that contains at least one silicon-bonded alkenyl group in each molecule and at least one silicon-bonded hydrolyzable group in each molecule, and (b) a silicon-containing compound that contains at least one silicon-bonded epoxy-functional hydrocarbon group and at least one silicon-bonded hydrolyzable group; and (E) curing accelerator.Type: ApplicationFiled: December 19, 2005Publication date: June 29, 2006Inventors: Kazuo Hirai, Hideo Miyazaki, Hiroaki Yoshida, Noriyuki Suganuma
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Publication number: 20040030455Abstract: The height from floor surface contact ends of leg linkages 2 to shoulder joints of a biped robot 1 when the biped robot is in an upright posture is defined to be a value falling within a range (Havg±½&sgr;) set based on an averaged value Havg obtained by averaging the heights of a group of objects (subject to operation) from the floor surface and the standard deviation a thereof, specifically a value in a range of from approximately 700 mm to 1000 mm.Type: ApplicationFiled: May 16, 2003Publication date: February 12, 2004Inventors: Kazuo Hirai, Kenji Morii, Masato Hirose
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Patent number: 6642292Abstract: A resin composition for a sliding member, comprises from 0.1 to less than 1.0% by weight of a fatty acid, 0.1 to 2.0% by weight of a metallic soap, 0.1 to 2.0% by weight of a phosphate, 0.3 to 2.0% by weight of a lubricating oil, and a polyester-based elastomer as the balance. A sliding member produced from such resin composition exhibits excellent friction and wear characteristics even at a low sliding speed under a high load.Type: GrantFiled: July 18, 2001Date of Patent: November 4, 2003Assignee: Oiles CorporationInventor: Kazuo Hirai
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Publication number: 20020077440Abstract: An extrudable silicone rubber composition comprising a silicone rubber base compound comprising a diorganopolysiloxane gum, a treated or untreated reinforcing silica, an organic peroxide represented by the following general formula R—COOOCOO—R1—OOCOOOC—R and a alkyl-type organic peroxide. The composition provides an extrudable silicone rubber composition suitable for rapid curing, the resulting extruded articles are substantially free from of blooming and surface tackiness.Type: ApplicationFiled: October 25, 2001Publication date: June 20, 2002Inventors: Katsuya Baba, Kazuo Hirai, Hiroshi Honma
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Publication number: 20020032261Abstract: A resin composition for a sliding member, comprises from 0.1 to less than 1.0% by weight of a fatty acid, 0.1 to 2.0% by weight of a metallic soap, 0.1 to 2.0% by weight of a phosphate, 0.3 to 2.0% by weight of a lubricating oil, and a polyester-based elastomer as the balance.Type: ApplicationFiled: July 18, 2001Publication date: March 14, 2002Inventor: Kazuo Hirai
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Publication number: 20020016412Abstract: A silicone rubber composition for extrusion molding applications having a high cure rate and providing silicone rubber extrusion moldings that post-cure and are either free of bubbles or contain bubbles to limited extent. The silicone rubber composition includes (A) 100 weight parts of a silicone rubber base compound containing (a-1) a diorganopolysiloxane gum, (a-2) reinforcing silica, and (a-3)a silanol-endblocked organosiloxane oligomer or hexaorganodisilazane; and (B) 0.1 to 10 weight parts of an organoperoxide with the formula R—COOOCOO—R1—OOCOOOC—R where R is an alkyl group, an alkoxy group, the group —SiR23, the group —CH2SiR23, or the group -Ph-R3c where R2 is an alkyl or alkoxy group, Ph is phenyl when c is 0, and phenylene when c is 1, 2 or 3, R3 is an alkyl group, an alkoxy group, the group —SiR23, or the group —CH2SiR23; c is 0 to 3, and R1 is a C1 to C10 alkylene group.Type: ApplicationFiled: April 18, 2001Publication date: February 7, 2002Inventors: Kazuo Hirai, Katsuya Baba, Hiroshi Honma
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Publication number: 20010056168Abstract: A silicone rubber composition for extrusion molding applications has a high cure rate and provides silicone rubber extrusion moldings that post-cure and are either free of bubbles or contain bubbles to an extremely limited extent. It contains (A) an organopolysiloxane gum, (B) reinforcing silica, (C) diatomaceous earth powder or quartz powder, and (D) an organoperoxide with the formula R-COOOCOO-R1-OOCOOOC-R, wherein R is a group selected from alkyl, alkoxy, —SiR23, —CH2SiR23, and -Ph-R3c (R2 is alkyl or alkoxy; Ph is phenyl when c is 0, and phenylene when c is 1,2 or 3; R3 is alkyl, alkoxy, SiR23, or —CH2SiR23; and c is 0 to 3) and R1 is C1 to C10 alkylene. A method is described for fabricating silicone rubber extrusion moldings by curing the silicone rubber composition in a hot gas.Type: ApplicationFiled: April 18, 2001Publication date: December 27, 2001Inventors: Hiroshi Honma, Kazuo Hirai, Katsuya Baba
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Patent number: 6294636Abstract: A silicone rubber composition, comprising: (A) an polyorganosiloxane gum represented by the following average structural formula: RaSiO(4−a)/2 (where R is a substituted or non-substituted monovalent hydrocarbon, and a is a number between 1.8 and 2.3); (B) microparticulate silica; and (C) a methyl-substituted benzoyl peroxide having the maximum grain diameter not exceeding 50 &mgr;m and an average grain diameter of 30 &mgr;m. When cured, the silicone rubber composition has reduced nonuniformity in the physical properties because of fewer voids, resulting in decreased frequency of spark-outs in the insulated wires.Type: GrantFiled: February 26, 1999Date of Patent: September 25, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Kazuo Hirai, Takao Matsushita
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Publication number: 20010015258Abstract: A colored silicone rubber adhesive film and methods of adhesion by means of the silicone rubber adhesive film are disclosed. The silicone rubber adhesive film comprises (A) an organopolysiloxane; (B) a wet method hydrophobized reinforcing silica; (C) an organohydridopolysiloxane; (D) an azo or anthroquinone pigment, and (E) a curing accelerator. The colored silicone rubber adhesive film is easily handled, possesses excellent workability, and most important, makes it possible to verify the degree and the point of completion of the curing due to the presence of the pigment.Type: ApplicationFiled: April 30, 2001Publication date: August 23, 2001Inventor: Kazuo Hirai