Patents by Inventor Kazuo Hirota
Kazuo Hirota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5385942Abstract: A quinone derivative useful in the treatment of hepatic diseases defined by the general formula: ##STR1## where X and Y may be the same or different from each other and are each a hydroxyl group, a group represented by the formula --(--OCH.sub.2 --).sub.n --OR.sup.6, wherein n is 0 or 1 and R.sup.6 is a lower alkyl group, or an acyl group.Type: GrantFiled: March 1, 1993Date of Patent: January 31, 1995Assignee: Eisai Co., Ltd.Inventors: Shinya Abe, Yasushi Okamoto, Katsuya Tagami, Shigeki Hibi, Junichi Nagakawa, Kazuo Hirota, Ieharu Hishinuma, Kaname Miyamoto, Takashi Yamanaka, Hiromitsu Yokohama, Tsutomu Yoshimura, Tohru Horie, Yasunori Akita, Koichi Katayama, Isao Yamatsu
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Patent number: 5292901Abstract: A new benzodioxole derivative has a substituent in the phenyl ring which is a carboxyalkylthioalkyl or the like and is effective to treat a liver disease.Type: GrantFiled: February 6, 1992Date of Patent: March 8, 1994Assignee: Eisai Co., Ltd.Inventors: Yoshitake Ogata, Makoto Ikeda, Seiichiro Nomoto, Makoto Okita, Naoyuki Shimomura, Toshihiko Kaneko, Takashi Yamanaka, Ieharu Hishinuma, Junichi Nagakawa, Kazuo Hirota, Kaname Miyamoto, Toru Horie, Tsuneo Wakabayashi
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Patent number: 5249100Abstract: Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356.degree. C. to 450.degree. C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.Type: GrantFiled: May 11, 1990Date of Patent: September 28, 1993Assignee: Hitachi, Ltd.Inventors: Ryohei Satoh, Kazuo Hirota, Takaji Takenaka, Hideki Watanabe, Toshinori Ameya, Toshihiko Ohta
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Patent number: 5210239Abstract: A quinone derivative useful in the treatment of hepatic diseases defined by the general formula: ##STR1## where R1 is selected from the group consisting of alkyl, alkenly, alkynyl or heterocycle, R2 is a substituted nitrogen containing radical wherein the substituents on said nitrogen are selected from the group consisting of hydrogen, substituted or unsubstituted lower alkyl or heterocycles, and where said nitrogen may be a ring heteroatom, and R3, R4 and R5, may be the same or different and each are hydrogen, lower alkyl or lower alkoxy groups.Type: GrantFiled: August 31, 1990Date of Patent: May 11, 1993Assignee: Eisai Co., Ltd.Inventors: Shinya Abe, Yasushi Okamoto, Katsuya Tagami, Shigeki Hibi, Junichi Nagakawa, Kazuo Hirota, Ieharu Hishinuma, Kaname Miyamoto, Takashi Yamanaka, Hiromitsu Yokohama, Tsutomu Yoshimura, Tohru Horie, Yasunori Akita, Koichi Katayama, Isao Yamatsu
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Patent number: 5173120Abstract: A coating apparatus for applying coating liquid onto a web which is being transported as wrapped around a backing roller includes a chamber from which the liquid is applied to the web and a blade for scraping the applied coating liquid into a film having a constant thickness. A partition plate divides the inside of the chamber into upstream and downstream sections with respect to the direction of travel of the web. A plate-like body resiliently held in contact with the web is mounted to an upper portion of the partition plate, and a plurality of holes are formed in a lower portion of the partition plate.Type: GrantFiled: January 7, 1991Date of Patent: December 22, 1992Assignee: Mitsubishi Jukogyo Kabushiki KaishaInventors: Hiroshi Suzumura, Kazuo Hirota, Mitsuo Yamamoto, Hiroto Jakunen
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Patent number: 5110956Abstract: A new benzodioxole derivative has a substituent in the phenyl ring which is a carboxyalkylthioalkyl or the like and is effective to treat a liver disease.Type: GrantFiled: April 23, 1990Date of Patent: May 5, 1992Assignee: Eisai Co., Ltd.Inventors: Yoshitake Ogata, Makoto Ikeda, Seiichiro Nomoto, Makoto Okita, Naoyuki Shimomura, Toshihiko Kaneko, Takashi Yamanaka, Ieharu Hishinuma, Junichi Nagakawa, Kazuo Hirota, Kaname Miyamoto, Toru Horie, Tsuneo Wakabayashi
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Patent number: 5063257Abstract: A dental glass ionomer cement composition comprises:(a) 5 to 100 parts by weight of a polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000,(b) 5 to 100 parts by weight of a fluoroaluminosilicate glass powder having an average particle size of 0.02 to 10 .mu.m and a specific gravity of 2.4 to 4.0 and capable of reacting with said "polymer of an .alpha.-.beta. unsaturated carboxylic acid having a weight average molecular weight of 5,000 to 40,000",(c) 5 to 100 parts by weight of a polymerizable unsaturated organic compound having at least one CH.sub.2 .dbd.C(R1)--COO--group wherein R1=H or CH.sub.3,(d) 0.01 to 5 parts by weight of a polymerization catalyst,(e) 2 to 50 parts by weight of water,(f) 0.01 to 20 parts by weight of a surface active agent, and(g) 0.01 to 5 parts by weight of a reducing agent, and optionally h. 0 to 50 parts by weight of an inorganic filler having an average particle size of 0.02 to 10 .mu.Type: GrantFiled: December 11, 1989Date of Patent: November 5, 1991Assignee: G-C Dental Industrial Corp.Inventors: Shoji Akahane, Satoshi Tosaki, Yukiharu Kusayanagi, Shigenobu Kusakai, Kazuo Hirota, Kentaro Tomioka
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Patent number: 4975871Abstract: According to one embodiment of the present invention, a magnetic bubble memory module comprising a flexible printed circuits substrate (FPC3), on which a magnetic bubble memory chip (CHI) is mounted and electrically connected, with interconnecting patterns (9a) electrically connecting the chip (CHI) with external connecting leads, terminals or pins as well as bias coil winding (BIC2) for applying bias field to the chip (CHI), thereby reducing the number of components as well as fabricating steps because of the formation of the bias coil (BIC2) with the printed circuits substrate (FPC3).Type: GrantFiled: July 7, 1988Date of Patent: December 4, 1990Assignee: Hitachi, Ltd.Inventors: Yutaka Akiba, Kazuo Hirota, Nobuo Kishiro, Toshio Futami, Tatsuo Hamamoto
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Patent number: 4972369Abstract: According to one embodiment of the present invention, a magnetic bubble memory module comprising a flexible printed circuits substrate (FPC3), on which a magnetic bubble memory chip (CHI) is mounted and electrically connected, with interconnecting patterns(9a) electrically connecting the chip (CHI) with external connecting leads, terminals or pins as well as bias coil winding (BIC2) for applying bias field to the chip (CHI), thereby reducing the number of components as well as fabricating steps because of the formation of the bias coil (BIC2) with the printed circuits substrate (FPC3).Type: GrantFiled: November 6, 1989Date of Patent: November 20, 1990Assignee: Hitachi, Ltd.Inventors: Yutaka Akiba, Kazuo Hirota, Nobuo Kishiro, Toshio Futami, Tatsuo Hamamoto
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Patent number: 4952272Abstract: A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.Type: GrantFiled: May 30, 1989Date of Patent: August 28, 1990Assignee: Hitachi, Ltd.Inventors: Hironobu Okino, Akio Fujiwara, Yutaka Akiba, Susumu Kasukabe, Tsuyoshi Fujita, Masao Mitani, Kazuo Hirota
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Patent number: 4900697Abstract: A fluoroaluminosilicate glass powder for dental glass ionomer cements has a specific gravity of 2.4 to 3.5 and a mean particle size of 0.02 to 10 .mu.m, contains in its components 20 to 50% by weight of SiO.sub.2, 20 to 40% by weight of Al.sub.2 O.sub.3, 15 to 40% by weight of SrO, 1 to 20% by weight of F.sub.2 and 0 to 15% by weight of P.sub.2 O.sub.5 on the converted oxide basis, and is substantially free from alkali metal ions such as Li, Na, K, Rb and Cs ions, and Be, Mg (and Ca) and Ba ions of alkali earth metal ions. For further improvements in physical properties, 100 parts by weight of the glass powder are surface-treated with 0.01 to 5 parts by weight of an acid and/or a fluoride.Type: GrantFiled: January 29, 1988Date of Patent: February 13, 1990Assignee: G-C Dental Industrial CorporationInventors: Shoji Akahane, Satoshi Tosaki, Kazuo Hirota, Kentaro Tomioka
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Patent number: 4775592Abstract: A fluoroaluminosilicate glass powder for dental glass ionomer cement, a surface of which is treated with a fluoride in an amount of from 0.01 to 5 parts by weight based on 100 parts by weight of the glass powder, is disclosed. The fluoroaluminosilicate glass powder of the invention is improved in not only physical properties such as crushing strength but also mixing workability without impairing the inherent characteristics thereof for the dental use.Type: GrantFiled: August 21, 1986Date of Patent: October 4, 1988Assignee: G-C Dental Industrial Corp.Inventors: Shoji Akahane, Kazuo Hirota, Kentaro Tomioka
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Patent number: 4730271Abstract: A magnetic bubble memory chip is disposed at a position surrounded by a rectangular annular core having two pairs of opposite sides wound by a pair of wires, respectively, and is covered by a case for confining revolving magnetic field, thereby providing a revolving magnetic field to said chip. A bubble memory includes a permament magnet used as a holding magnetic field source, lying at a predetermined angle to the chip. An inclination between the chip and the magnet is provided on the revolving-magnetic-field confining case to be inserted between the chip and the magnet by having the case changed in plate thickness.Type: GrantFiled: April 24, 1986Date of Patent: March 8, 1988Assignee: Hitachi, Ltd.Inventors: Yutaka Akiba, Kazuo Hirota, Nobuo Kishiro, Toshio Futami, Tatsuo Hamamoto
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Patent number: 4725925Abstract: A circuit board including resistors on one surface of a board or substrate having through hole conductors arranged in a lattice like fashion. At least one electrode is formed on a surface of the resistors, at least one electrode being formed by removing a portion of a surface of the board or substrate coaxially with the through hole conductors thereby forming substantially disk-shaped resistors.Type: GrantFiled: December 24, 1984Date of Patent: February 16, 1988Assignee: Hitachi, Ltd.Inventors: Minoru Tanaka, Kazuo Hirota, Akira Murata, Fumiuki Kobayashi, Takaji Takenaka
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Patent number: 4694423Abstract: A magnetic bubble memory module having a rectangular core shaped like a picture frame providing windings on respective two pairs of opposite sides, at least one magnetic bubble memory chip disposed in an area surrounded by the core, a flexible substrate having a chip-loading section for loading the magnetic bubble memory chip thereon and having four corners for leading out lead wires connecting signal lines and driving lines of the chip. A revolving magnetic field-confining case accommodates the core, the chip and the flexible substrate and enables the lead wires of the flexible substrate at the corners of the chip-loading section to be drawn out therethrough.Type: GrantFiled: January 29, 1986Date of Patent: September 15, 1987Assignee: Hitachi, Ltd.Inventors: Yutaka Akiba, Kazuo Hirota, Nobuo Kishiro, Toshio Futami, Tatsuo Hamamoto
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Patent number: 4685622Abstract: A piece gun for spraying includes a base body. A trunk portion is provided with a storage area for containing a coating liquid. The trunk portion is positioned within the base body. A head portion is connected to the trunk portion. The head portion is provided with a writing member for discharging the coating liquid. A first air passage surrounds at least the head portion of the trunk portion. A second air passage is operatively connected to a source of high pressure fluid. A switching valve includes an operational member for manual actuation and a working member operatively connected to the operational member. The working member initially operates the switching valve to connect the second air passage to the atmosphere during an early stage of operation of the operational member. The working chamber communicates the second air passage with the first air passage during a latter stage of operation.Type: GrantFiled: July 12, 1985Date of Patent: August 11, 1987Assignee: Meiji Kikai Seisakusyo Co., Ltd.Inventors: Shigeru Shimohira, Yasuyuki Kimoto, Kazuo Hirota
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Patent number: 4673772Abstract: In connecting an electronic circuit part such as a semiconductor or other part to a substrate for mounting the part with solder, the solder is composed of a high-melting-point solder portion which is subjected to working such as rolling and heat treatment in order to break the cast structure thereof, and a smaller volume of low-melting-point solder portions. The high-melting-point solder portion is connected to both the electronic circuit substrate and the electronic circuit part through the low-point-melting solder portions.This method enables interconnection between objects to be connected without impairing the high ductility and toughness of the high-melting-point solder which is subjected to working and heat treatment. This soldering method ensures highly reliable manufacture of miniaturized high density circuits, such as LSI.Type: GrantFiled: October 4, 1985Date of Patent: June 16, 1987Assignee: Hitachi, Ltd.Inventors: Ryohei Satoh, Muneo Oshima, Minoru Tanaka, Suguru Sakaguchi, Akira Murata, Kazuo Hirota
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Patent number: 4663737Abstract: In a magnetic bubble memory unit comprising two pairs of windings confronting in parallel each other, a printed circuit board having a magnetic bubble memory chip thereon surrounded by the windings for providing the rotating magnetic field, and a conductive shield case for covering the magnetic bubble memory chip on the printed circuit board, slitlike openings are provided on the side face of the conductive shield case so as to present connection between the printed circuit board and an external device.Type: GrantFiled: April 3, 1984Date of Patent: May 5, 1987Assignee: Hitachi, Ltd.Inventors: Yutaka Akiba, Kazuo Hirota
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Patent number: 4652593Abstract: A dental cement composition consisting of a composition A and a composition B,said composition A comprising (a) 100 parts by weight of a powder containing 20 to 70% by weight of calcium oxide and 30 to less than 80% by weight of aluminum oxide, said powder being coated on the surface with a water-soluble high-molecular substance, and (b) 2 to 70 parts by weight of a calcium hydroxide powder, andsaid composition B comprising an aqueous solution containing 0.01 to 70% by weight of a water-soluble high-molecular substance.Type: GrantFiled: February 12, 1986Date of Patent: March 24, 1987Assignees: G-C Dental Industrial Corp., Haruyuki KawaharaInventors: Haruyuki Kawahara, Shoji Takeda, Hiroshi Oshima, Kentaro Tomioka, Shoji Akahane, Eiichi Yoshii, Kazuo Hirota
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Patent number: 4647600Abstract: A dental cement composition consisting of a composition A and a composition B,said composition A comprising at least two powders, (a) 100 parts by weight of a powder containing more than 20% by weight to 70% by weight of calcium oxide and 30% by weight to less than 80% by weight of aluminium oxide and treated on the surface with 0.01 to 5% by weight of at least one selected from the group consisting organic acids and/or inorganic acids, and (b) 2 to 70 parts by weight of a calcium hydroxide powder, andsaid composition B comprising of an aqueous solution containing 0.01 to 70% by weight of a water-soluble high-molecular substance.Type: GrantFiled: February 12, 1986Date of Patent: March 3, 1987Assignees: G-C Dental Industrial Corp., Haruyuki KawaharaInventors: Haruyuki Kawahara, Shoji Takeda, Hiroshi Oshima, Kentaro Tomioka, Shoji Akahane, Eiichi Yoshii, Kazuo Hirota