Patents by Inventor Kazuo Ikushima

Kazuo Ikushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4696704
    Abstract: An excellent material for lead frames is provided which is economical and easily punched out to produce lead frames without bending or breakage, and has both superior tensile strength and high electrical conductivity, as well as splendid heat dissipation properties and good soldering properties.
    Type: Grant
    Filed: May 28, 1986
    Date of Patent: September 29, 1987
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Takeuchi, Takaharu Iwadachi, Kazuo Ikushima
  • Patent number: 4692192
    Abstract: A low cost electroconductive spring material excellent in electroconductivity and spring performance, has from 1.8 to 3.0% by weight of Ni, from 0.15 to 0.35% by weight of Be, from 0.2 to 1.2% by weight of Si and the balance being copper. This low cost electroconductive spring material can be used in electric devices. As preferred embodiments, the electroconductive spring material may further contain from 0.05 to 3.0% by weight in a total amount of at least one component selected from Sn, Al and Zn provided that each of Sn, Al and Zn does not exceed 1.5% by weight, or from 0.01 to 1.5% by weight in a total amount of at least one component selected from Co, Fe, Zr, Ti and Mg, provided that each of Co, Fe, Zr, Ti and Mg does not exceed 1.0% by weight. Moreover, the electroconductive spring material is subjected to a final solidification heat treatment at a temperature of 880.degree.-950.degree. C., a cold processing of not greater than 80%, and an aging treatment at a temperature of 380.degree.-530.degree. C.
    Type: Grant
    Filed: September 16, 1985
    Date of Patent: September 8, 1987
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazuo Ikushima, Takaharu Iwadachi, Syuhei Ishikawa
  • Patent number: 4599119
    Abstract: An age-hardening copper titanium alloy containing 2 to 6% by weight of titanium, and composed of a substantially fully solution heat-treated structure having an average crystal grain size not exceeding 25 microns. When the alloy is cold-rolled after its solution heat treatment, its elongation in the rolling direction and that in a direction perpendicular thereto have a difference of within 20% therebetween, and its bend radius to thickness ratios in those two directions are substantially equal to each other.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: July 8, 1986
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazuo Ikushima, Yoshio Itoh, Toshiaki Ishihara
  • Patent number: 4566915
    Abstract: A process for producing an age-hardened copper titanium alloy strip includes preparing a copper titanium alloy melt, casting it, hot-working the cast alloy, cold-working the hot-worked alloy as required, annealing the hot-worked or cold-worked alloy, solution heat-treating the annealed alloy, and then the solution heat-treated alloy is age-hardened. The alloy is annealed at a temperature of 500.degree. C. to 700.degree. C. for one to 20 hours. Its solution heat treatment is terminated before or approximately as soon as a precipitated secondary phase has formed a complete solid solution in a master phase, so that the master phase may have an average crystal grain size not exceeding 25 microns. It is preferably terminated within three minutes. The alloy has a titanium content of 2 to 6% by weight.
    Type: Grant
    Filed: November 13, 1984
    Date of Patent: January 28, 1986
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazuo Ikushima, Yoshio Itoh, Toshiaki Ishihara