Patents by Inventor Kazuo Inomata

Kazuo Inomata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932770
    Abstract: A method for producing a resin sintered body 1 by applying an ink 3 to thermoplastic resin powder 2 and sintering the powder, the method including the step of immersing an intermediate resin sintered body 1m, which has an unevenly colored region on the surface thereof and the whole of which has been already sintered, in a surface treatment liquid containing sulfuric acid and chromic anhydride, in which the concentration of chromic anhydride is 300 g/L or more, for 5 minutes or longer. When producing a resin sintered body by sintering thermoplastic resin powder, the surface of the resin sintered body can be evenly and sufficiently colored to an extent required without an unevenly colored region on the surface thereof, and also the surface of the resin sintered body can have a good appearance and smoothness.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: March 19, 2024
    Assignees: SANKEI GIKEN KOGYO CO., LTD., HONDA MOTOR CO., LTD., SOLIZE CORPORATION
    Inventors: Daisuke Sato, Kazuo Igarashi, Hiroyuki Ikeno, Satoru Nishimoto, Takashi Inomata, Ryota Masuda, Kohei Mutai
  • Patent number: 7625262
    Abstract: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: December 1, 2009
    Assignee: Nomura Micro Science Co., Ltd.
    Inventors: Mitsugu Abe, Nobuyoshi Nambu, Osamu Ito, Masaaki Ogitsu, Kazuo Inomata
  • Publication number: 20060205325
    Abstract: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.
    Type: Application
    Filed: March 18, 2004
    Publication date: September 14, 2006
    Applicant: Nomura Micro Science Co., Ltd.
    Inventors: Mitsugu Abe, Nobuyoshi Nambu, Osamu Ito, Masaaki Ogitsu, Kazuo Inomata
  • Patent number: 5401557
    Abstract: A thread-reinforced paper sheet comprises upper and lower paper layers and a reinforcing thread interposed therebetween. A thread-reinforced gummed tape comprises a tape base material which consists of upper and lower paper layers and a reinforcing thread interposed between the upper and lower paper layers, and a moisture activated adhesive layer formed on one of surfaces of the tape base material. In each of the thread-reinforced paper sheet and the thread-reinforced gummed tape, a water-soluble or water-dispersible adhesive is used to laminate the upper and lower paper layers, and a water-soluble thread is used as the reinforcing thread. Each of such thread-reinforced paper sheet and such thread-reinforced gummed tape exhibits a strength equivalent to that of the prior art article and moreover, has a complete disintegratability. Thus, a regeneratable thread-reinforced paper sheet as well as a regeneratable thread-reinforced gummed tape is provided.
    Type: Grant
    Filed: August 17, 1993
    Date of Patent: March 28, 1995
    Assignees: Nitivy Co., Ltd., TEC Electronics Corporation, Lintec Corporation
    Inventors: Kazuo Inomata, Kenichi Imabori, Masao Kogure