Abstract: An apparatus for processing semiconductor substrates (i.e., wafers) or the like by rotation of the same. The apparatus includes: a housing which defines a processing chamber therein; and an exhaust duct connected to the lower side portion of the chamber. A rotary member is rotatably mounted in the chamber, on which a plurality of wafers to be processed are held. At the upper side portion within the chamber an auxiliary chamber is provided. Undesired objects, such as water remaining on the wafers and vapor and dirts sprung from the wafers, are effectively expelled from the chamber, through both the exhaust duct and the auxiliary chamber.

Abstract: There is disclosed a rotary apparatus for treating boards such as printed circuit boards at various treating stations circumferentially disposed around the apparatus. The apparatus comprises a plurality of clamps for holding the work piece, a plurality of mechanisms for elevating and lowering the clamps individually, and turning a rotary frame carrying said plurality of clamps.