Patents by Inventor Kazuo Kai

Kazuo Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6433695
    Abstract: A body fluid leak sensing device adapted for correctly informing only a caretaker of a leak of body fluid. The sensing device is miniaturized so as to properly operate in any worn state. A liquid sensor applicable to the body fluid leak sensing device is disposable and highly sensitive to even a small amount of body fluid. A sensor (1) comprises a water absorber (11) formed of a porous material with a high electrical resistance and an insulating coating film (14) on which the ends (12a, 13a) of the electrodes (12, 13) are secured at its sides and spaced from each other in such a way that one end (11a) of the water absorber (11) is exposed. There are provided means for detecting leak of body fluid by measuring the resistance of the sensor (1) and means for informing according to the detection.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: August 13, 2002
    Assignees: Sanwa Newtech Co., Ltd., Nipro Corporation
    Inventors: Kazuo Kai, Shoichiro Fujino, Ritsuo Ando, Hiroshi Todoroki
  • Patent number: 6164833
    Abstract: A small cored motor has a ball bearing which is a relatively long life, the overall thin dimension, a low manufacturing cost, low-friction as well as substantially vibration-free rotation. The ball bearing includes a biased and movable portion for promoting low-friction and substantially vibration-free rotation as well as a ball retainer for separating balls apart at a predetermined distance.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: December 26, 2000
    Assignee: Tokyo Parts Industrial Co., Ltd.
    Inventors: Kazuo Kai, Tadashi Ishizuka, Nobuyuki Ayuba
  • Patent number: 4527041
    Abstract: A method for forming a wiring pattern on a wiring board includes the steps of forming an electric conductive pattern having a width approximately equal to the space between IC pin insertion holes by a printing process or photocopying process and then cutting the pattern by a laser or mechanical means to form a plurality of wiring lines.
    Type: Grant
    Filed: June 2, 1983
    Date of Patent: July 2, 1985
    Inventor: Kazuo Kai
  • Patent number: 4389278
    Abstract: A method for manufacturing a circuit board with through hole, by taking the processing steps of: forming a preferred wire distribution pattern by selectively etching the two-side copper-clad laminate; piercing holes to be used as the through holes at the specified locations; masking the surface of the board except the through hole portion by using the conductive ink and the pH-resistant ink; forming the conductive film over the through hole by the electroless plating; forming the metal foil with appropriate thickness over the conductive film by the electroplating, by using the conductive ink layer as the electrode at one end; and finally, removing the conductive ink and the pH-resistant ink.
    Type: Grant
    Filed: July 2, 1982
    Date of Patent: June 21, 1983
    Inventor: Kazuo Kai