Abstract: A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.

Abstract: A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.

Abstract: A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.

Abstract: A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.

Abstract: An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

Abstract: An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

Abstract: A sintered body of a material for thermoelectric element having excellent thermoelectric performance and mechanical strength can be produced by the following method. A block of the material for thermoelectric element is provided. The block has an electric-current passing direction, in which electricity is supplied to obtain a desired thermoelectric performance of the thermoelectric element. The block is encased in an elongate capsule such that the electric-current passing direction of the block is substantially agreement with an axial direction of the capsule. After degassing the capsule, a forming operation for reducing a cross section perpendicular to the axial direction of the capsule is performed to obtain a formed capsule having a green compact of the block crushed by the forming operation therein. A heat treatment is then performed to sinter the green compact in the formed capsule. Finally, the resultant sintered body is removed from the formed capsule.

Abstract: A thermoelectric chip with exposed surfaces of N-type and P-type semiconductor elements on its top and bottom surfaces is prepared by arranging the semiconductor elements in a matrix manner such that each of the N-type semiconductor elements is disposed adjacent to the P-type semiconductor element through a space, and filling the space with a first resin material having electrical insulation. A metal layer is formed on each of the exposed surfaces of the semiconductor elements. Then, first electrodes are formed on the top surface according to a first circuit pattern. Similarly, second electrodes are formed on the bottom surface according to a second circuit pattern different from the first circuit pattern. An electrical insulation sheet of a second resin material containing a ceramic powder with high thermal conductivity is bonded to the top and bottom surfaces to obtain the thermoelectric module.

Abstract: A thermoelectric module 1 comprising p-type thermoelectric elements 3a and n-type thermoelectric elements 3b which are alternately arranged and electrically connected by electrodes 4 provided on the top side and the bottom side of each thermoelectric element 3 and a heat exchanger plate 5 which is fixed on the electrodes on each side, in which each thermoelectric element 3 has a coating film 2 of an insulating material on the sides thereof except the sides joined to the electrodes 4, and the thermoelectric elements 3 are spaced apart. The coating film 2 improves the strength and moisture resistance of the thermoelectric elements 3 to prevent thermoelectric elements from cracking or breaking even in cases where a load, a shock, or a thermal stress is imposed thereon and to protect the thermoelectric elements against corrosion in a high humidity atmosphere, providing a thermoelectric module 1 with improved operational reliability.

Abstract: A thermoelectric piece has an increased adhesive strength between a semiconductor matrix of Bi--Sb--Te or Bi--Te--Se and a diffusion barrier layer deposited thereon for blocking diffusion of a soldering material into the semiconductor matrix. An Sn-alloy layer is provided between the semiconductor matrix and the diffusion barrier layer of Mo, W, Nb and Ni to give the enhanced adhesive strength. The Sn-alloy is formed at the interface with the semiconductor matrix by interdiffusion of Sn with at least one element of the semiconductor. It is found that Sn will not lower the thermoelectric characteristics when diffusing into the semiconductor matrix and provides an sufficient adhesive strength to the metal elements of the diffusion barrier layer.

Abstract: A circuit board has holes extending therethrough, and a solder layer disposed on a first side of the board. Terminals have been pushed through respective holes and into contact with the solder layer. The terminals have been welded to the first side of the circuit board in a fluxless manner by an irradiated energy beam.

Abstract: Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting portions of the solder layers are irradiated with an energy beam, to produce sufficient heat for welding in a fluxless manner each lead terminal to the inner wall surface of its respective hole.

Abstract: A method for manufacturing a printed circuit board is to form on a top surface of an insulating substrate a layer of such plating ground as a metal film, to irradiate such electromagetic wave as a laser to a boundary edge zone of non-circuit parts with respect to circuit-printing parts on the insulating substrate in correspondence to a pattern of the non-circuit parts to remove the plating ground layer at the part irradiate by the electromagnetic wave with the plating ground layer at the non-irradiated part left as formed, and thereafter to form a plating on the surface of the plating ground layer at the non-irradiated parts, whereby it is enabled to allow the laser irradiation to be carried out only with respect to the boundary edge zone of the non-circuit parts, without irradiating all over the non-circuit parts.