Abstract: A radiographic image analysis apparatus includes a hardware processor that calculates an area of a lung field from a chest image obtained by radiation imaging of a chest in one direction, and estimates a residual volume, a functional residual capacity, a total lung capacity or a residual volume ratio of the lung field, based on the calculated lung field area.

Abstract: A radiographic image analysis apparatus includes a hardware processor that calculates an area of a lung field from a chest image obtained by radiation imaging of a chest in one direction, and estimates a residual volume, a functional residual capacity, a total lung capacity or a residual volume ratio of the lung field, based on the calculated lung field area.

Abstract: The invention provides a method of detecting ErbB receptor mutations comprising the steps of providing a bio-fluid sample from a patient; extracting DNA from said sample; and screening said DNA for the presence of one or more mutations that alter tyrosine kinase activity in the receptor.

Abstract: An image exposing apparatus for exposing an image onto a light sensitive material, is provided with a plurality of light beam emitting element arrays, each light beam emitting element array emitting aligned-light beams which are aligned in at least a single line; a light mixing device for mixing a plurality of aligned-light beams emitted from the plurality of light beam emitting element arrays and for emitting mixed-aligned-light beams which are aligned in the same line; a light receiving device located so as to receive the mixed-aligned-light beams at a position where the light sensitive material is exposed; and an adjusting device for adjusting a position of each of the plurality of light beam emitting element arrays based on a light receiving result by the light receiving means.

Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Abstract: A chip-type common mode choke coil having protrusions extending in an axial direction of a winding core portion and being formed in areas between a plurality of electrodes (four electrodes), at the inside surfaces of two flanges, that is, at opposing surfaces of the two flanges, one being disposed on each end of the winding core portion, in order to increase the stroke distances between the corresponding electrodes. In the choke coil, the protrusions separate the corresponding electrodes in order to prevent the occurrence of a short circuit caused by two wires also coming into contact with the electrodes adjacent to the electrodes to which they are primarily to be connected. For the protrusions, protrusions having at least one of a triangular shape, a square shape, a rectangular shape, a trapezoidal shape, and a substantially semicircular shape in plan view are disposed.

Abstract: A chip-type common mode choke coil having protrusions extending in an axial direction of a winding core portion and being formed in areas between a plurality of electrodes (four electrodes), at the inside surfaces of two flanges, that is, at opposing surfaces of the two flanges, one being disposed on each end of the winding core portion, in order to increase the stroke distances between the corresponding electrodes. In the choke coil, the protrusions separate the corresponding electrodes in order to prevent the occurrence of a short circuit caused by two wires also coming into contact with the electrodes adjacent to the electrodes to which they are primarily to be connected. For the protrusions, protrusions having at least one of a triangular shape, a square shape, a rectangular shape, a trapezoidal shape, and a substantially semicircular shape in plan view are disposed.

Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.