Patents by Inventor Kazuo Kasue

Kazuo Kasue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating circuit module
    Patent number: 7022554
    Abstract: A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: April 4, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuo Kasue, Takehisa Kajikawa, Satoru Hachinohe
  • Method for fabricating circuit module
    Publication number: 20040097095
    Abstract: A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
    Type: Application
    Filed: November 13, 2003
    Publication date: May 20, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kazuo Kasue, Takehisa Kajikawa, Satoru Hachinohe