Patents by Inventor Kazuo Kijima

Kazuo Kijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Road structure, corrosion-resistant conductive sheet used for the road structure, and method for peeling off asphalt layer
    Patent number: 10494777
    Abstract: A road structure, an asphalt layer of which is peeled off by electromagnetic induction heating, includes a non-thermoplastic base layer, an asphalt layer located above the base layer, a conductive sheet between the base layer and the asphalt layer, a first bonding layer that bonds the conductive sheet and the base layer; and a second bonding layer that bonds the conductive sheet and the asphalt layer. The conductive sheet is configured to generate heat based on electromagnetic induction. At least the first bonding layer is a thermoplastic bonding layer configured to be softened by the heat.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: December 3, 2019
    Assignees: GREEN ARM CO., LTD., TOYO ALMINIUM K.K.
    Inventors: Yasushi Kanzaki, Kazuo Kijima, Atsuki Gomi, Kenji Kihara, Toshio Kunimatsu, Yuya Terasawa, Tomonobu Sekiguchi, Kazunori Yamada, Hiroyuki Nishikawa, Hiroshi Oe, Kouichi Sugimoto, Mayo Watanabe
  • ROAD STRUCTURE, CORROSION-RESISTANT CONDUCTIVE SHEET USED FOR THE ROAD STRUCTURE, AND METHOD FOR PEELING OFF ASPHALT LAYER
    Publication number: 20180282953
    Abstract: A road structure, an asphalt layer of which is peeled off by electromagnetic induction heating, includes a non-thermoplastic base layer, an asphalt layer located above the base layer, a conductive sheet between the base layer and the asphalt layer, a first bonding layer that bonds the conductive sheet and the base layer; and a second bonding layer that bonds the conductive sheet and the asphalt layer. The conductive sheet is configured to generate heat based on electromagnetic induction. At least the first bonding layer is a thermoplastic bonding layer configured to be softened by the heat.
    Type: Application
    Filed: May 3, 2018
    Publication date: October 4, 2018
    Inventors: Yasushi Kanzaki, Kazuo Kijima, Atsuki Gomi, Kenji Kihara, Toshio Kunimatsu, Yuya Terasawa, Tomonobu Sekiguchi, Kazunori Yamada, Hiroyuki Nishikawa, Hiroshi Oe, Kouichi Sugimoto, Mayo Watanabe