Abstract: A multi-layer electronic components aggregate board according to the present invention is a multi-layer electronic components aggregate board which enables extracting plural multi-layer electronic components by cutting and includes a trimming pattern 122b formed on a predetermined insulation layer out of plural insulation layers and recognition marks formed on the same insulation layer, the recognition marks indicating the relative positional relationship with respect to the trimming pattern 122b. This enables specifying the trimming position with an extremely simple process, even in the case of specifying the trimming position through image recognition. Furthermore, since the recognition marks and the trimming pattern are formed on the same layer, it is possible to prevent the occurrence of pattern deviation among layers, thus enabling specifying the trimming position with high accuracy.

Abstract: A method for adjusting the characteristics of multi-layer electronic components according to the present invention includes a determination process S21 for determining the characteristics of a multi-layer electronic component, a calculation process S22 for calculating the required amount of trimming on the basis of the result of determination obtained in the determination process S21, and a trimming process S23 for applying trimming to a trimming pattern provided in the multi-layer electronic component, in accordance with the amount of trimming obtained in the calculation process. The present invention enables performing the determination process S21 and the trimming process S23 in parallel for different multi-layer electronic components instead of performing trimming concurrently with real time determination of characteristics, thus enabling efficiently adjusting the characteristics of plural multi-layer electronic components on aggregate boards.

Abstract: The present invention is to provide a surface mounting part, capable of corresponding to high density mounting of a mother board and capable of achieving a small size, to be mounted on a mother board by reflow. Electronic parts are mounted on both sides of a printed board. Terminal electrodes of the electronic parts mounted on the rear side are provided as terminals for connecting with the mother board.

Abstract: A shredded tobacco supplying apparatus for a cigarette manufacturing machine has a supply passage extending toward a conveyor belt, the supply passage is provided with a plurality of air blowing openings arranged at intervals in the direction perpendicular to the longitudinal axis of the conveyor, and a straightening plate having a plurality of straightening fins is mounted at the air blowing opening. The straightening fin extends at a predetermined angle toward the front side of the conveyor with respect-to the axis perpendicular to the longitudinal axis of the conveyor. The air injected from the air blowing opening is blown into the supply passage at a predetermined angle with respect to the aforementioned axis. The shredded tobacco reaching the supply passage is discharged toward the belt surface of conveyor belt by using an air flow produced by the air blown from the air blowing openings.