Abstract: To provide information useful to a variety of users engaged in real estate transactions. Provided is an information processing device including a graph rendering unit that renders a graph expressing an anticipated transaction price of a second real estate property, based on actual transaction prices and required transaction times of a first real estate property already bought or sold, and a display control unit that causes the graph to be displayed on a client device, wherein the graph includes an element expressing a probability distribution of the anticipated transaction price, and an element expressing an anticipated required transaction time corresponding to the anticipated transaction price.

Abstract: To provide information useful to a variety of users engaged in real estate transactions. Provided is an information processing device including a graph rendering unit that renders a graph expressing an anticipated transaction price of a second real estate property, based on actual transaction prices and required transaction times of a first real estate property already bought or sold, and a display control unit that causes the graph to be displayed on a client device, wherein the graph includes an element expressing a probability distribution of the anticipated transaction price, and an element expressing an anticipated required transaction time corresponding to the anticipated transaction price.

Abstract: To provide information useful to a variety of users engaged in real estate transactions. Provided is an information processing device, including an appraisal value calculation unit that calculates an appraisal value of a real estate property by using a function which includes appraisal factors of the real estate property as variables and which is different depending on a location of the real estate property, an appropriate price calculation unit that calculates an appropriate price of the real estate property based on the appraisal value, an assessment creation unit that creates an assessment of the real estate property that includes the appropriate price, and a display control unit that causes the assessment to be displayed on a client device.

Abstract: An information processing device includes an operation input unit which inputs a user operation, a U/I screen generation unit which generates a U/I screen where a row of a plurality of category options for selecting a category and a row of a plurality of icons which is an option belonging to what is selected among the plurality of category options are orthogonally disposed, and when a selection of the option in the row of the plurality of category options is changed by the input user operation, an icon rotator which changes the plurality of icons from icons corresponding to those before a change of the category to icons corresponding to those after the change of the category by an animation display which causes the icon to rotate around the rotation axis in the same direction as a direction of the row of icons.

Abstract: A Web-screen sharing system including a first and a second terminals, and a mediation server. The system includes: the terminals exchanging addresses through the mediation server; connecting the terminals using the addresses; when the first terminal is connected to any Web server, detecting whether a content in the Web server is security-protected; if protected, performing predetermined authentication processing with the Web server; when the authentication is successful, the Web server transmitting a content following the authentication processing to the first terminal; the first terminal displaying the content as a Web screen, and capturing the Web screen; transmitting an image file of the Web screen to the second terminal to display the screen on the second terminal, if not protected, the first terminal receiving the content from the Web server, and transmitting a URL at that time to the second terminal to display the Web screen.

Abstract: Disclosed herein is an echo removing apparatus including: a sound input terminal configured to input an external sound signal from external equipment; a first echo removing device configured to, after admitting as input signals the external sound signal coming from the external equipment and input through the sound input terminal and a receiver sound signal transmitted from a calling party, estimate a first pseudo echo component from the external sound signal in order to remove the first pseudo echo component from the receiver sound signal; and a second echo removing device configured to, after admitting as input signals the external sound signal coming from the external equipment and input through the sound input terminal and a transmitter sound signal input from a microphone, estimate a second pseudo echo component from the external sound signal in order to remove the second pseudo echo component from the transmitter sound signal.

Abstract: A Web-screen sharing system including a first and a second terminals, and a mediation server. The system includes: the terminals exchanging addresses through the mediation server; connecting the terminals using the addresses; when the first terminal is connected to any Web server, detecting whether a content in the Web server is security-protected; if protected, performing predetermined authentication processing with the Web server; when the authentication is successful, the Web server transmitting a content following the authentication processing to the first terminal; the first terminal displaying the content as a Web screen, and capturing the Web screen; transmitting an image file of the Web screen to the second terminal to display the screen on the second terminal, if not protected, the first terminal receiving the content from the Web server, and transmitting a URL at that time to the second terminal to display the Web screen.

Abstract: There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.

Abstract: There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.

Abstract: There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.

Abstract: There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.

Abstract: A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips.

Abstract: A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side.

Abstract: A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side.

Abstract: In order to have a thin type semiconductor chips featuring a high yield and a low cost in production, an excellent packaging reliability, and a robust structure against damages, there is provided a method of manufacturing LSI chips, comprising the steps of: pasting on a substrate an adhesive sheet which retains its adhesive strength prior to a processing, then loses it after the processing; bonding non-defective LSI chips on the adhesive sheet, with their device surfaces facing downward; uniformly coating an insulating film on the non-defective LSI chips; uniformly grinding the insulating film to a level of the bottom surfaces of these LSI chips; applying a predetermined process to the adhesive sheet to weaken its adhesive strength thereof so as to peel off a pseudo wafer on which the non-defective LSI chips are bonded; and dicing the LSI chips into a discrete non-defective electronic component by cutting the pseudo wafer.

Abstract: A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips.

Abstract: A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side.

Abstract: A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side.

Abstract: In order to have a thin type semiconductor chips featuring a high yield and a low cost in production, an excellent packaging reliability, and a robust structure against damages, there is provided a method of manufacturing LSI chips, comprising the steps of: pasting on a substrate an adhesive sheet which retains its adhesive strength prior to a processing, then loses it after the processing; bonding non-defective LSI chips on the adhesive sheet, with their device surfaces facing downward; uniformly coating an insulating film on the non-defective LSI chips; uniformly grinding the insulating film to a level of the bottom surfaces of these LSI chips; applying a predetermined process to the adhesive sheet to weaken its adhesive strength thereof so as to peel off a pseudo wafer on which the non-defective LSI chips are bonded; and dicing the LSI chips into a discrete non-defective electronic component by cutting the pseudo wafer.

Abstract: An electronic circuit device of a three-dimensional mounting mode capable of being produced by a simple method while suppressing the production costs and of a structure resistant to external stress, including first-mounting-board wiring portions formed on a first mounting board, first mounting parts mounted on the first mounting board, bumps formed on the first mounting board connecting to the first-mounting-board wiring portion, a protective layer formed covering the first mounting parts so that at least the portions near the tops of the bumps are exposed, a second mounting board stacked as an upper layer of the protective layer, second-mounting-board wiring portions formed on the second mounting board in order to connect to the bumps, and second mounting parts mounted connecting to the second-mounting-board wiring portions on the second mounting board at the surface of the second mounting board opposite to the protective layer side, and a method of production of the same.