Abstract: A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

Abstract: A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 ?m and not more than 100 ?m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 ?m and not more than 200 ?m.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 &mgr;m and not more than 100 &mgr;m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 &mgr;m and not more than 200 &mgr;m.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 &mgr;m and not more than 100 &mgr;m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 &mgr;m and not more than 200 &mgr;m.

Abstract: A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 &mgr;m and not more than 100 &mgr;m, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 &mgr;m and not more than 200 &mgr;m.

Abstract: A curable composite material composition comprising (A) a polymerizable unsaturated compound, (B) a fiber reinforcing material and/or fiber, and (C) a polymerization initiator comprising an organic boron compound represented by the general formula (1)  wherein R1, R2, R3 and R4 each independently represent an alkyl, aryl, allyl, aralkyl, alkenyl, alkynyl, silyl or heterocyclic group, a halogen atom, or a substituted alkyl, substituted aryl, substituted allyl, substituted aralkyl, substituted alkenyl, substituted alkynyl or substituted silyl group, and Z+ represents a cation, and an acidic compound, as well as a curing process for the curable composite material composition which includes irradiating and/or heating the curable composite material composition.

Abstract: A photocurable prepreg sheet for waterproofing includes (1) a fiber-reinforced resin layer which comprises a sheet-shaped inorganic or organic fibrous reinforcing material impregnated with a resin composition comprising: (A) an unsaturated polyester resin and/or vinyl ester resin: 100 parts by weight, and (B) at least two photopolymerization initiators having photosensitivity in different wavelength ranges from ultraviolet range to near infrared range: 0.01 to 10 parts by weight, and which is treated with light of a specific wavelength to thereby undergo prepolymerization which causes at least one of the polymerization initiators and radical-polymerizable unsaturated groups to remain partially intact; and (2) film which covers an upper surface and a back surface of the fiber-reinforced resin layer.

Abstract: A photocurable prepreg composition which is characterized by easy control of a B stage state of a thermosetting resin such as an unsaturated polyester resin or an epoxy acrylate resin, excellent storage stability, and remarkable curability after being shaped; as well as a production method therefor. A photocurable prepreg composition which contains an unsaturated polyester resin and/or an epoxy acrylate resin; at least two photopolymerization initiators with photosensitivity in different wavelength ranges; and an inorganic or an organic fiber-reinforcing material and/or filler, and which composition is treated with light of a specific wavelength such that at least one photopolymerization initiator and radical-polymerizable unsaturated groups remain partially in said resin; a production method therefor; and formed articles produced therefrom.

Abstract: A curable composite material composition comprising (A) a polymerizable unsaturated compound, (B) a fiber reinforcing material and/or fiber, and (C) a polymerization initiator comprising an organic boron compound represented by the general formula (1) wherein R1, R2, R3 and R4 each independently represent an alkyl, aryl, allyl, aralkyl, alkenyl, alkynyl, silyl or heterocyclic group, a halogen atom, or a substituted alkyl, substituted aryl, substituted allyl, substituted aralkyl, substituted alkenyl, substituted alkynyl or substituted silyl group, and Z+ represents a cation, and an acidic compound, as well as a curing process for the curable composite material composition which includes irradiating and/or heating the curable composite material composition.

Abstract: An image filing apparatus includes a read unit to read an image of an original, a judgment unit to judge whether the original read by the read unit is a specific original or not, an extraction unit to extract the image of a specific area of the original which was judged as a specific original by the judgment unit, a setting unit to set the image extracted by the extraction unit as a title of the original which is not judged as a specific original by the judgment unit, a storage unit to store the image which is not judged as a specific original in a memory medium, and a forming unit to form a management table in which the title set by the setting unit and the storing address of the image to be stored in the memory medium are made to correspond to each other.

Abstract: A bar code written on a original is read by a bar code reader during the feed of the original and decoded, and an image of the document sheet is read by a CCD, and the decoded bar code is stored in a magneto-optical disk as index information. When a reading error of the bar code occurs, the image of the bar code included in the reading image of the original is displayed on a display unit. An operator watches the displayed image of the bar code and inputs code information corresponding to the bar code from a keyboard.

Abstract: There is disclosed an image searching apparatus capable of searching an image stored in a memory medium, corresponding to a search image, selected from the plural search images registered in advance. The apparatus can generate a synthesized image, including the registered search images, together with marking areas, to be marked by the operator for selecting the search image, and prints the synthesized as a marking sheet which is to be marked by the operator and then read by the apparatus again, whereby the apparatus effects the image search, based on the marking provided on the marking sheet.

Abstract: An image reading apparatus includes an image sensing unit for photoelectrically reading an original image, and outputting an image signal, a converter unit for converting the image signal from the image sensing unit into density data representing density levels of a plurality of steps, a detection unit for detecting frequencies of appearance in units of density levels of the density data from the converter unit, and a correction unit for correcting the density levels expressed by the density data from the converter unit on the basis of the frequencies of appearance detected by the detection unit.

Abstract: An image recording apparatus provided with a reader for reading information for identifying an original document; a recording unit for recording the image of the original document on a recording medium; a selector for selecting a first mode or a second mode; and a controller for causing the recording unit to record the image only when the identifying information is read by the reading means if the first mode is selected, or causing the recording unit to record the image regardless of the reading of the identifying information if the second mode is selected.

Abstract: An image processing apparatus includes a sensor for sensing image density of an original, a determining unit for determining an image processing condition corresponding to image density sensed by the sensor, based on a parameter, a setting unit for setting a desired image processing condition, a processor for processing an original image under an image processing condition determined by the determining unit or under an image processing condition set by the setting unit, and a modifying unit for modifying the parameter in accordance with the image density sensed by the sensor means and image processing condition set by the setting means.

Abstract: A pattern recognition method and apparatus wherein an optical correlator and a feedback light path are provided. In the optical correlator, an input pattern whose image is formed on a first spatial light modulator (valve) is read by the irradiation of coherent light, and an image of a correlation peak image of this reading light is formed by the use of a correlation filter on which a plurality of reference patterns are recorded in the form of modified patterns. In the feedback light path, the correlation peak image is formed on a second spatial light modulator (valve), the correlation peak image is read out by the irradiation of coherent light, and the light having read the correlation image is made to pass a display filter on which display reference patterns are recorded.

Abstract: An image recording apparatus provided with a reader for reading information for identifying an original document; a recording unit for recording the image of the original document on a recording medium; a selector for selecting a first mode or a second mode; and a controller for causing the recording unit to record the image only when the identifying information is read by the reading means if the first mode is selected, or causing the recording unit to record the image regardless of the reading of the identifying information if the second mode is selected.

Abstract: Curable resin composition comprising a compound (A) having one or more maleimide groups within the molecule thereof, and vinlbenzyl compound (B) obtained by reacting amines with halomethylstyrene in the presence of alkali.The composition exhibits excellent low-temperature curability, heat resistance and mechanical strength.

Abstract: A thermoset resin composition comprises a compound (A) having one or more maleimido groups in its molecule and at least one vinylbenzyl ether compound (B) selected from the group consisting of compounds (B.sub.1) having at least two vinylbenzyl ether groups bonded to a naphthalene nucleus in its molecule and compounds (B.sub.2) having at least two vinylbenzyl ether groups bonded to a benzene nucleus having at least one substituent selected from the group consisting of hydroxyl groups, alkyl groups and alkoxy groups in its molecule.The composition exhibits excellent low-temperature curing properties, heat resistance and mechanical strength.