Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: A simulated moving-bed type chromatographic separation method separating a weakly adsorptive component, a strongly adsorptive component, and an intermediately adsorptive component, with eluents by using a circulation system in which a plurality of unit packed columns packed with an adsorbent are connected in series and in an endless form via pipes in which a feed solution supply port F, two or more eluent supply ports D corresponding to the eluents, an extraction port A of a fraction containing the weakly adsorptive component, an extraction port B of a fraction containing the intermediately adsorptive component, and an extraction port C of a fraction containing the strongly adsorptive component are provided in the pipes of the circulation system, and positions of the ports F, A, B, and C are set to have a specified relationship.

Abstract: A simulated moving-bed type chromatographic separation method including separating a weakly adsorptive component, a strongly adsorptive component, and an intermediately adsorptive component that has adsorptive property intermediate between the two components, with respect to an adsorbent, with two or more kinds of eluents by using a circulation system in which a plurality of unit packed columns each packed with an adsorbent are connected in series and in an endless form via pipes, the weakly adsorptive component, the strongly adsorptive component, and the intermediately adsorptive component being contained in a feed solution, wherein a feed solution supply port, eluent suply ports and a plurality of extraction ports are provided on the pipes of the circulation system, and positions of the feed solution supply port and the plurality of extraction ports are set to have a specified relationship; and a chromatographic separation system suitable for implementing the chromatographic separation method.

Abstract: A method for making an integrated passive device (IPD) die includes grinding a backside of a semiconductor substrate to reduce a thickness of a central portion of the semiconductor substrate while leaving a mechanical support ring on an outer portion of the substrate, and forming a through-substrate via (TSV) from the backside of the substrate. The TSV defines interconnect access to at least one passive component embedded in an insulator material disposed on a front surface of the semiconductor substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: According to an aspect, a semiconductor device for integrating multiple transistors includes a wafer substrate including a first region and a second region. The first region defines at least a portion of at least one first transistor. The second region defines at least a portion of at least one second transistor. The semiconductor device includes an isolation area located between the first region and the second region, at least one terminal of the at least one first transistor contacting the first region of the wafer substrate, at least one terminal of the at least one second transistor contacting the second region of the wafer substrate, and an encapsulation material, where the encapsulation material includes a portion located within the isolation area.

Abstract: According to an aspect, a semiconductor device for integrating multiple transistors includes a wafer substrate including a first region and a second region. The first region defines at least a portion of at least one first transistor. The second region defines at least a portion of at least one second transistor. The semiconductor device includes an isolation area located between the first region and the second region, at least one terminal of the at least one first transistor contacting the first region of the wafer substrate, at least one terminal of the at least one second transistor contacting the second region of the wafer substrate, and an encapsulation material, where the encapsulation material includes a portion located within the isolation area.

Abstract: A simulated moving-bed type chromatographic separation method separating a weakly adsorptive component, a strongly adsorptive component, and an intermediately adsorptive component, with eluents by using a circulation system in which a plurality of unit packed columns packed with an adsorbent are connected in series and in an endless form via pipes in which a feed solution supply port F, two or more eluent supply ports D corresponding to the eluents, an extraction port A of a fraction containing the weakly adsorptive component, an extraction port B of a fraction containing the intermediately adsorptive component, and an extraction port C of a fraction containing the strongly adsorptive component are provided in the pipes of the circulation system, and positions of the ports F, A, B, and C are set to have a specified relationship.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: A gaming machine having a display that displays a determined screen including a character, during execution of a game, a touch panel sensor, disposed above the display, that is capable of detecting the contact position, the position of the character contacted by a player, and a CPU that determines the contact position of the character as well as the contact mode, and that displays an image on the display, that is changed based on the result of this determination.

Abstract: A method for making an integrated passive device (IPD) die includes grinding a backside of a semiconductor substrate to reduce a thickness of a central portion of the semiconductor substrate while leaving a mechanical support ring on an outer portion of the substrate, and forming a through-substrate via (TSV) from the backside of the substrate. The TSV defines interconnect access to at least one passive component embedded in an insulator material disposed on a front surface of the semiconductor substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die includes a through-substrate via (TSV) extending from the backside of the substrate toward the front surface of the substrate. The TSV defines interconnect access to at least one passive component embedded in the insulator material disposed on the front surface of the substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: A gaming machine having a display that displays a determined screen including a character, during execution of a game, a touch panel sensor, disposed above the display, that is capable of detecting the contact position, the position of the character contacted by a player, and a CPU that determines the contact position of the character as well as the contact mode, and that displays an image on the display, that is changed based on the result of this determination.

Abstract: A gaming machine having a display that displays a determined screen including a character, during execution of a game, a touch panel sensor, disposed above the display, that is capable of detecting the contact position, the position of the character contacted by a player, and a CPU that determines the contact position of the character as well as the contact mode, and that displays an image on the display, that is changed based on the result of this determination.

Abstract: In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die includes a through-substrate via (TSV) extending from the backside of the substrate toward the front surface of the substrate. The TSV defines interconnect access to at least one passive component embedded in the insulator material disposed on the front surface of the substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: The present application provides a game playing information integration system which is capable of objectively performing selection and/or settings according to preference of a player, particularly fixed customers, and thereby capable of effectively introducing a gaming machine to invoke demands of players as users and managers of gaming facilities in a well-balanced manner from a result obtained by logically analyzing the gaming machine. (a) Game playing period at one time of each player in gaming machine unit, (b) change in balance over time of player in a game playing period, (c) operation time of the gaming machine unit, and (d) data relating to profit of a shop side by the gaming machine are generated, the degree of satisfaction of player is computed based on (a) and (b), and the degree of satisfaction of a shop side is computed based on (c) and (d).

Abstract: The present application provides a game playing information integration system which is capable of objectively performing selection and/or settings according to preference of a player, particularly fixed customers, and thereby capable of effectively introducing a gaming machine to invoke demands of players as users and managers of gaming facilities in a well-balanced manner from a result obtained by logically analyzing the gaming machine. (a) Game playing period at one time of each player in gaming machine unit, (b) change in balance over time of player in a game playing period, (c) operation time of the gaming machine unit, and (d) data relating to profit of a shop side by the gaming machine are generated, the degree of satisfaction of player is computed based on (a) and (b), and the degree of satisfaction of a shop side is computed based on (c) and (d).

Abstract: Provided is a gaming machine which does not bore the player through reel actions until completion of rearrangement of symbols. Under the condition where predetermined symbols are aligned on a payline when the symbols of a first scroll line of at least one of a plurality of scroll lines are being scrolled and symbols on the remaining second scroll lines are stopped, the gaming machine changes scrolling motion of symbols of the first scroll line.

Abstract: Provided is a gaming machine that can offer various play patterns and payout patterns without giving the player distrust or uncomfortableness. Upon establishment of a bonus trigger, a main CPU conducts a jackpot challenge lottery; if a jackpot is drawn, conducts another lottery to select either one of the prizes, Credit or Jackpot+Credit; if the prize Credit is drawn, pays out a determined amount to be credited; if the prize Jackpot+Credit is drawn, conducts another lottery for a jackpot prize, and pays out the amount corresponding to the drawn prize and the amount to be credited.