Abstract: A video confirmation computer for confirming video related to robot operation includes a storage unit and a processor. The storage unit stores information on the position of the electric motor that drives a link body of the robot received from the controller of the robot and information on the video obtained by a camera attached to the robot. The processor makes at least one of the video confirmation computer itself and a computer connected to the video confirmation computer display a model area and a video area side by side. In the model area, a two-dimensional or three-dimensional model reproducing the posture of the robot is displayed by computer graphics. In the video area, the video is displayed.

Abstract: A method of manufacturing a semiconductor device includes: planarizing a surface of a substrate having a conductive material embedded in a first hole so as to expose the conductive material embedded in the first hole, wherein the first hole is formed in a region which is on an insulating film laminated on the substrate and is surrounded by a spacer film; laminating a mask film on the surface of the substrate; forming a second hole in the mask film such that at least a portion of an upper surface of the conductive material embedded in the first hole is exposed; embedding the conductive material in the second hole; and removing the mask film.

Abstract: A video confirmation computer for confirming video related to robot operation includes a storage unit and a processor. The storage unit stores information on the position of the electric motor that drives a link body of the robot received from the controller of the robot and information on the video obtained by a camera attached to the robot. The processor makes at least one of the video confirmation computer itself and a computer connected to the video confirmation computer display a model area and a video area side by side. In the model area, a two-dimensional or three-dimensional model reproducing the posture of the robot is displayed by computer graphics. In the video area, the video is displayed.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: A simulated moving-bed type chromatographic separation method separating a weakly adsorptive component, a strongly adsorptive component, and an intermediately adsorptive component, with eluents by using a circulation system in which a plurality of unit packed columns packed with an adsorbent are connected in series and in an endless form via pipes in which a feed solution supply port F, two or more eluent supply ports D corresponding to the eluents, an extraction port A of a fraction containing the weakly adsorptive component, an extraction port B of a fraction containing the intermediately adsorptive component, and an extraction port C of a fraction containing the strongly adsorptive component are provided in the pipes of the circulation system, and positions of the ports F, A, B, and C are set to have a specified relationship.

Abstract: A simulated moving-bed type chromatographic separation method including separating a weakly adsorptive component, a strongly adsorptive component, and an intermediately adsorptive component that has adsorptive property intermediate between the two components, with respect to an adsorbent, with two or more kinds of eluents by using a circulation system in which a plurality of unit packed columns each packed with an adsorbent are connected in series and in an endless form via pipes, the weakly adsorptive component, the strongly adsorptive component, and the intermediately adsorptive component being contained in a feed solution, wherein a feed solution supply port, eluent suply ports and a plurality of extraction ports are provided on the pipes of the circulation system, and positions of the feed solution supply port and the plurality of extraction ports are set to have a specified relationship; and a chromatographic separation system suitable for implementing the chromatographic separation method.

Abstract: A method for making an integrated passive device (IPD) die includes grinding a backside of a semiconductor substrate to reduce a thickness of a central portion of the semiconductor substrate while leaving a mechanical support ring on an outer portion of the substrate, and forming a through-substrate via (TSV) from the backside of the substrate. The TSV defines interconnect access to at least one passive component embedded in an insulator material disposed on a front surface of the semiconductor substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: According to an aspect, a semiconductor device for integrating multiple transistors includes a wafer substrate including a first region and a second region. The first region defines at least a portion of at least one first transistor. The second region defines at least a portion of at least one second transistor. The semiconductor device includes an isolation area located between the first region and the second region, at least one terminal of the at least one first transistor contacting the first region of the wafer substrate, at least one terminal of the at least one second transistor contacting the second region of the wafer substrate, and an encapsulation material, where the encapsulation material includes a portion located within the isolation area.

Abstract: According to an aspect, a semiconductor device for integrating multiple transistors includes a wafer substrate including a first region and a second region. The first region defines at least a portion of at least one first transistor. The second region defines at least a portion of at least one second transistor. The semiconductor device includes an isolation area located between the first region and the second region, at least one terminal of the at least one first transistor contacting the first region of the wafer substrate, at least one terminal of the at least one second transistor contacting the second region of the wafer substrate, and an encapsulation material, where the encapsulation material includes a portion located within the isolation area.

Abstract: A simulated moving-bed type chromatographic separation method separating a weakly adsorptive component, a strongly adsorptive component, and an intermediately adsorptive component, with eluents by using a circulation system in which a plurality of unit packed columns packed with an adsorbent are connected in series and in an endless form via pipes in which a feed solution supply port F, two or more eluent supply ports D corresponding to the eluents, an extraction port A of a fraction containing the weakly adsorptive component, an extraction port B of a fraction containing the intermediately adsorptive component, and an extraction port C of a fraction containing the strongly adsorptive component are provided in the pipes of the circulation system, and positions of the ports F, A, B, and C are set to have a specified relationship.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: A gaming machine having a display that displays a determined screen including a character, during execution of a game, a touch panel sensor, disposed above the display, that is capable of detecting the contact position, the position of the character contacted by a player, and a CPU that determines the contact position of the character as well as the contact mode, and that displays an image on the display, that is changed based on the result of this determination.

Abstract: A method for making an integrated passive device (IPD) die includes grinding a backside of a semiconductor substrate to reduce a thickness of a central portion of the semiconductor substrate while leaving a mechanical support ring on an outer portion of the substrate, and forming a through-substrate via (TSV) from the backside of the substrate. The TSV defines interconnect access to at least one passive component embedded in an insulator material disposed on a front surface of the semiconductor substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die includes a through-substrate via (TSV) extending from the backside of the substrate toward the front surface of the substrate. The TSV defines interconnect access to at least one passive component embedded in the insulator material disposed on the front surface of the substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.

Abstract: A gaming machine having a display that displays a determined screen including a character, during execution of a game, a touch panel sensor, disposed above the display, that is capable of detecting the contact position, the position of the character contacted by a player, and a CPU that determines the contact position of the character as well as the contact mode, and that displays an image on the display, that is changed based on the result of this determination.

Abstract: A gaming machine having a display that displays a determined screen including a character, during execution of a game, a touch panel sensor, disposed above the display, that is capable of detecting the contact position, the position of the character contacted by a player, and a CPU that determines the contact position of the character as well as the contact mode, and that displays an image on the display, that is changed based on the result of this determination.

Abstract: In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die includes a through-substrate via (TSV) extending from the backside of the substrate toward the front surface of the substrate. The TSV defines interconnect access to at least one passive component embedded in the insulator material disposed on the front surface of the substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: The present application provides a game playing information integration system which is capable of objectively performing selection and/or settings according to preference of a player, particularly fixed customers, and thereby capable of effectively introducing a gaming machine to invoke demands of players as users and managers of gaming facilities in a well-balanced manner from a result obtained by logically analyzing the gaming machine. (a) Game playing period at one time of each player in gaming machine unit, (b) change in balance over time of player in a game playing period, (c) operation time of the gaming machine unit, and (d) data relating to profit of a shop side by the gaming machine are generated, the degree of satisfaction of player is computed based on (a) and (b), and the degree of satisfaction of a shop side is computed based on (c) and (d).