Abstract: A method for recycling in place an asphalt mixture layer of a paved road continuously, while moving a self-propelled vehicle system, which comprises a step of heating and softening the asphalt mixture layer, a step of scraping and breaking said hot and softened asphalt mixture layer and keeping the softened mixture at a temperature sufficient not to form an aggregate, to prepare an asphalt mixture having a single-grained structure, a sieving step of classifying said asphalt mixture having a single-grained structure into a plurality of grain size groups, a step of designing mix proportions for converting said asphalt mixture to a recycled asphalt mixture by the use of said plurality of grain size groups classified, a step of mixing uniformly said recycled asphalt mixtures having designed mix proportions, and a step of spreading and compacting said recycled asphalt mixtures having been mixed uniformly, to thereby form a recycled asphalt mixtures layer.

Abstract: A method for recycling in place an asphalt mixture layer of a paved road continuously, while moving a self-propelled vehicle system, which comprises a step of heating and softening the asphalt mixture layer, a step of scraping and breaking said hot and softened asphalt mixture layer and keeping the softened mixture at a temperature sufficient not to form an aggregate, to prepare an asphalt mixture having a single-grained structure, a sieving step of classifying said asphalt mixture having a single-grained structure into a plurality of grain size groups, a step of designing mix proportions for converting said asphalt mixture to a recycled asphalt mixture by the use of said plurality of grain size groups classified, a step of mixing uniformly said recycled asphalt mixtures having designed mix proportions, and a step of spreading and compacting said recycled asphalt mixtures having been mixed uniformly, to thereby form a recycled asphalt mixtures layer.

Abstract: A double-ended miniature lamp comprises a filament enclosed in a hollow bulb. Lamp lead wires are connected with both the ends of the filament and emerge from closed ends of the bulb. Square-shaped supporting portions of a lamp base consisting of a heat resistant plastic material shape-matingly support at least those closed ends.

Abstract: An elongated lamp unit in which electrically conductive connecting terminals provided at both ends of the lamp are electrically connected by force fitting into metal contact clamps arranged opposite each other. The electrically conductive connecting terminals extend endwise beyond flat portions formed on each end of an elongated lamp bulb and are electrically connected with a filament disposed in the bulb, and have surface-to-surface contact with the metal contact clamps. The metal contact clamps which receive the electrically conductive connecting terminals are connected with a power supply and comprise a pair of electrically conductive metal pieces opposite each other, these metal pieces having upper ends defining an insertion opening portion which receives the electrically conductive connecting terminal and limits at an inner portion of the electrically conductive contact the inserted position of the electrically conductive connecting terminal.

Abstract: A heat source unit for concentrating radiant rays from a heat source lamp onto the processing site of the material to be processed by, for example, soldering, so as to bring this site to a requisite high temperature, comprises a mirror assembly composed of a pair of symmetrical half bodies, which have each an arcuate reflecting surface and together form a concave mirror. A pair of reflective side plates are mounted detachably on the opposite sides of the mirror assembly. The mirror assembly has cooling channels permitting circulation of cooling water therethrough. A heat resistant and light-transmissive shield plate is disposed over an irradiation opening of the unit and is supported by and between a pair of adjustable masking elements at opposite ends of the mirror assembly thereby defining a heat outlet opening of adjustable width. Housing shells are fixed detachably on each of the side plates. Pipe connections are provided for connecting the cooling channels and for feeding and discharging cooling water.

Abstract: An apparatus for the automatic soldering of lead pins distributed on a packaged IC chip in bilateral or quadrilateral parallel rows, to corresponding contact pins which are distributed on a substrate printed circuit board in rows corresponding to said rows of lead pins and have preliminarily been pasted with solder. The packaged IC chip is placed on the substrate board, and the packaged IC chip is positioned to align each lead pin in the rows on the packaged IC chip with a corresponding contact pin in the rows on the substrate board. The lead pin together with the contact pin aligned therewith is then exposed to iradiation by a heat ray emitted from a heat ray soldering head and focussed thereon as a line of focus in the form of a segment of a line corresponding to the soldering line.

Abstract: An apparatus for the continuous processing of a work piece, such as an IC-chip or an LSI-chip, in the directions of the x- and y-coordinates, which comprises a pair of heat ray sources arranged on a heat ray source assembly for irradiating a corresponding pair of parallel processing lines extending in the direction of the x-coordinate, by focussing heat rays onto each of the processing lines in the shape of a straight line. A cylinder/piston arrangement effects vertical positioning of the pair of heat ray sources for adjusting the focussing of heat rays onto the processing line. A turning mechanism turns the heat ray source assembly through 90.degree. so as to align the pair of line foci with a pair of parallel processing lines extending in the direction of the y-coordinate. There is a distance adjustment for adjusting the distance between the pair of parallel line foci by effecting a parallel relative shifting of the pair of heat ray sources.

Abstract: Soldering apparatus for effecting, for example, a firm connection of the lead pins on IC-packages to a printed circuit board bearing corresponding lead lines. The workpiece such as an IC-package is placed at a predetermined position on the printed circuit board such that the lead pins on the IC-package and the corresponding lead lines on the circuit board, on which the solder has been applied, are in contact with each other. These sites of contact are subjected to radiant heating to cause soldering of them, by the use of apparatus which comprises a mounting base provided with a pair of diagonally disposed arms together with, if necessary, another pair of arms disposed also diagonally but rectangularly to the first pair of arms. Heat sources such as lamp units produce the radiant heat rays and focus them onto the sites of contact of the lead pins with the lead lines to be soldered.