Abstract: Provided is a method for easily manufacturing a metal-polyolefin bonded body having high bonding strength. This method for manufacturing a metallic member-resin member bonded body comprises: preparing a film that includes at least one modified polyolefin layer selected from the group consisting of a layer containing a reaction product 1 of a maleic anhydride-modified polyolefin, a bifunctional epoxy resin, and a bifunctional phenol compound, a layer containing a reaction product 2 of a maleic anhydride-modified polyolefin and a thermoplastic epoxy resin, and a layer containing a mixture of a polyolefin and a thermoplastic epoxy resin; disposing the film on at least a part of the surface of a metallic substrate so as to expose the modified polyolefin layer, thereby forming a metallic member in which a resin coating layer is laminated on the metallic substrate; and bonding a resin member onto the resin coating layer of the metallic member.

Abstract: Provided are: a lightweight bumper reinforcement which, with respect to the load during a collision, exhibits high rigidity against a light load and, against a heavy load, is capable of plastic deformation to absorb collision energy while effectively transferring unabsorbed energy to a crash box; a method for manufacturing the same; and a resin reinforcement member for a bumper reinforcement. The bumper reinforcement of the present disclosure comprises a body portion extending along a vehicle width direction, and a resin reinforcement portion extending along the vehicle width direction and disposed on the vehicle body side relative to the body portion. The body portion has at least one first joint portion on the vehicle body side. The resin reinforcement portion has at least one second joint portion joined to the first joint portion, and one or more reinforcement ribs projecting on the vehicle body side and extending along the vehicle width direction.

Abstract: The present invention relates to a method for bonding a metal and a resin, including bonding a metal and a resin by high-frequency induction welding via an intermediate resin layer which causes a chemical reaction.

Abstract: To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.

Abstract: To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.

Abstract: An electrode body having an electrode, and a primer layer or a plurality of primer layers laminated on the electrode, wherein the at least one primer layer is an in-situ polymerizable composition layer formed from a polymerization product of an in-situ polymerizable composition, a method for producing an electrode body, and an electrochemical element.

Abstract: A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is an in-situ polymerizable composition layer of an in-situ polymerizable composition polymerized on the thermoplastic resin material.

Abstract: A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.

Abstract: A metal-resin bonded article includes a composite laminate including a metal base material having laminated thereon one layer or plural layers of a resin coating layer, and a resin material bonded and integrated thereto, the resin coating layer being laminated on a surface-treated surface of the metal base material, at least one layer of the resin coating layer containing a resin composition containing a linear chain polymer having a linear polymer structure polymerized on the metal base material, a bonding strength between the composite laminate and the resin material and an adhesion force between the metal base material and the resin coating layer satisfying particular conditions.

Abstract: A structure repairing method applied to concrete structures ensures a short construction period and high reliability in a wide temperature range. The method includes a first repairing layer forming step of applying a radical-polymerizable resin composition (A) to a structure to form a first repairing layer, a second repairing layer forming step of applying a repairing material (X) containing a radical-polymerizable resin composition (Ax) and a filler (B) to the first repairing layer before the first repairing layer is cured, thereby forming a second repairing layer, and a repairing layer curing step of curing the radical-polymerizable resin composition (A) and the radical-polymerizable resin composition (Ax), wherein (A) and (Ax) each contain a radical-polymerizable resin (a1), a radical-polymerizable unsaturated monomer (a2), a hydroxy group-containing aromatic tertiary amine (a3), and an organic peroxide (a4), and (a1) and (a2) in each of (A) and (Ax) total 75% by mass or more.

Abstract: To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.

Abstract: Provided is a method for treating a surface of an aluminum article capable of imparting an effective anchoring effect to a surface of the aluminum article and enabling a strong chemical bond between the surface of the aluminum article and an organic material layer such as a coated resin layer or a laminated FRP applied to the surface without using a chemical solution that is not easy to treat. In the method for treating a surface of an aluminum article according to the present invention, the surface of the aluminum article is subjected to at least one of an etching treatment, a boehmite treatment, and a zirconium treatment, and then further subjected to at least one of a silane coupling agent treatment, an isocyanate compound treatment, and a thiol compound treatment.

Abstract: Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

Abstract: By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.

Abstract: A scanner is provided with an image memory for storing therein image data read from an original by an image sensor, an image processing portion for effecting image processing on the image data, and a sending portion for sending the image data to an external equipment. The image processing portion is disposed in a route along which the image data is forwarded from the image memory to the sending portion, and the contents of the image processing by the image processing portion is made changeable over. The external equipment is provided with an image analyzing portion for obtaining first image data image-processed in a first image mode from the scanner and analyzing it, and detecting the state of the original (such as whether the original is a white sheet) from which the first image data has been read. On the basis of the result of the detection by the image analyzing portion, second image data image-processed in a second image mode is obtained from the scanner.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

Abstract: A scanner is provided with an image memory for storing therein image data read from an original by an image sensor, an image processing portion for effecting image processing on the image data, and a sending portion for sending the image data to an external equipment. The image processing portion is disposed in a route along which the image data is forwarded from the image memory to the sending portion, and the contents of the image processing by the image processing portion is made changeable over. The external equipment is provided with an image analyzing portion for obtaining first image data image-processed in a first image mode from the scanner and analyzing it, and detecting the state of the original (such as whether the original is a white sheet) from which the first image data has been read. On the basis of the result of the detection by the image analyzing portion, second image data image-processed in a second image mode is obtained from the scanner.