Abstract: A sunshade of a sunroof for a motor vehicle includes superposing resin impregnated glass fiber mat layers (2,3) on both surfaces of a semi-rigid layer (1) made of an urethane foam and having a uniform thickness, superposing a skin material layer (5) on a surface of one of the resin impregnated glass fiber mat layers (2) via an adhesive film layer (4), superposing a back material layer (7) on the surface of the other resin impregnated glass fiber mat layer (3) via an adhesive film layer (6), and fusion bonding the layers by clamping the layers (8) by a press mold (9, 10) and heating and pressurizing the layers (8) so as to form a predetermined three-dimensional shape.

Abstract: So as to form pin-form wires or bumps in wire bonding for, for instance, semiconductor devices, the length of a wire (or the tail length) extending from the lower end of a capillary is set longer than the wire length required for forming the ball that is formed in the next step, then the ball is formed on the tip end of the wire, notches are formed in the wire located between the ball and the capillary by a pair of cutters, the ball is bonded to, for instance, an electrode pad, and then the wire is pulled away from the electrode pad so as to cut the wire from the area where the notches are formed.

Abstract: A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.

Abstract: In a single-point bonding apparatus that connects the end portions of leads or the cut end portions of leads to pads respectively by pressing such end portions of leads or cut end portions of leads with a tool, a cleaning stage that is used to clean the tool is additionally provided, and a cleaning chip is disposed on the surface of the cleaning stage.

Abstract: In a single-point bonding apparatus that connects the end portions of leads or the cut end portions of leads to pads respectively by pressing such end portions of leads or cut end portions of leads with a tool, a cleaning stage that is used to clean the tool is additionally provided, and a cleaning chip is disposed on the surface of the cleaning stage.

Abstract: A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.

Abstract: In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed.

Abstract: A substrate transporting device used in the process of manufacturing, for instance, semiconductor chips including a substrate guide comprised of a substrate guide rail which guides one side of each substrate and a substrate supporting plate which supports another side of the substrate, feeding claws for feeding a substrate to, for instance, a bonding position, the feeding claws being provided on a feeding claw holder and extending in the direction perpendicular to the substrate supporting plate, a claw X-direction feeder which moves the feeding claw holder in a direction in which the substrate is conveyed along the substrate guide, and a claw Y-direction feeder which moves the feeding claw holder in a direction perpendicular to the direction in which the substrate is conveyed along the substrate guide; thus, the substrates are conveyed one pitch at a time by means of a rectangular motion of the feeding claws on a horizontal plane effected by the claw X-direction feeder and the claw Y-direction feeder.

Abstract: A pellet conveying device used with a bonding machine for, for example, semiconductor devices, including a conveying arm that has a collet for holding pellets. The conveying arm can move vertically and pivot horizontally by two different driving sources so that the collet can be moved between predetermined two positions such as a pellet pick-up position and a pellet releasing position.

Abstract: In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second bonding point. Such a movement of the opposite direction can occur 10-20 ms after the application of the ultrasonic vibration at the second bonding point.

Abstract: A bonding apparatus including a motor, a cam, a capillary, and a biasing means. The motor rotates both ways, the cam on the output shaft of the motor is rotated by the motor, and the capillary is moved downwardly when the motor and cam rotate forward. The biasing means urges the cam to rotate in a reverse direction in order to prevent the capillary from moving downwardly when the power of the bonding apparatus is turned off for some reason.

Abstract: In a pushing device used for, for example, lead frame bonding machines, a pusher which feeds out plate-form parts stacked in a storage magazine one by one is belt-driven by a motor so that the moving amount of the pusher (that is, a feed out distance of the plate-form part) can be adjusted as desired, making changeovers of the plate-form parts easy.

Abstract: In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.

Abstract: In wire bonding performed in assembling, for example, semiconductor devices, the joining or bonding strength between a ball formed at an end of bonding wire and a bonding point is brought to a satisfactory level because of the use of small diameter balls with a little variation in diameter, and the bonding is performed by setting a load, that is applied on the ball when the ball contacts the bonding point, is set larger than when the ultrasonic waves are applied onto the ball.

Abstract: An apparatus for feeding plate-form parts such as lead frames used in, for example, semiconductor assembling machines including a plurality of frame feeder which have upper and lower claws for feeding the plate-form parts, a slider to which the frame feeder is mounted, a moving piece connected to the slider, a drive shaft screw-engaged with the moving piece, and a claw moving motor which rotates the drive shaft and therefore moves the moving piece. The feeding apparatus of this invention allows the drive shaft which moves the frame feeder to be shorter than in conventional apparatus so that each frame feeder can be fed with high precision.

Abstract: A wafer supplying apparatus including a supply ring to which a wafer sheet having semiconductor pellets adhered thereto is attached, a ring holder provided on an X-Y table of a pellet pick-up device, the ring holder supporting and placing the wafer sheet onto the upper surface of a cylindrical portion of the ring holder having an external diameter smaller than the internal diameter of the supply ring, a pressing ring provided above the supply ring, a pusher which pushes down the supply ring around the cylindrical portion of the ring holder through the pressing ring, and a fastener which fastens the pressing ring to the ring holder after the supply ring has been pushed down by the pusher.

Abstract: An apparatus for lifting a pellet which is on a wafer sheet including a pin holder having a plurality of peripheral pin insertion holes formed in an X pattern. The pin holder also has V-shaped cut-out areas in the left and right sides surrounded by the X pattern, and the pin holder is driven up and down by a vertical drive. The pellet-lifting apparatus further includes peripheral lifting pins inserted into the peripheral pin insertion holes, and V-shaped bridges fastened to the pin holder so that the peripheral lifting pins are held between inner surfaces of the cut-out areas in the pin holder. With such a structure, peripheral lifting pins are set in the peripheral pin insertion holes of the pin holder so that the pins meet different sizes of pellets and lift them in a stable manner.

Abstract: A vulcanizable silicone elastomer composition which has novel crosslinking points comprises (A) 100 parts by weight of a polyorganosiloxane having a polymerization degree of at least 100, wherein the organic groups are selected from monovalent substituted and unsubstituted hydrocarbon groups and are attached to silicon atoms at a rate, on average, in the range of 1.98 to 2.02 per silicon atom and at least two of the organic groups are monovalent hydrocarbon groups possessing at least five carbon atoms and a carbon-carbon double bond issuing from a silicon atom through at least one carbon atom, (B) 5 to 200 parts by weight of an inorganic filler having a specific surface area of at least 50 m.sup.2 /g, and (C) 0.05 to 15 parts by weight of an organic peroxide.

Abstract: Rubber compounds comprising a specific type of polyorganosiloxane of the following formula ##STR1## in which R and R' independently represent a hydrocarbon substituent and n is an integer of not smaller than 3 provided that at least 6 mole % of the substituents R and R' consists of a hydrocarbon group having Small's molecular attraction constant not smaller than 350. Carbon black is added to the polyorganosiloxane whereby various physical properties are improved including breaking strength, water and hot water resistances. The rubber compound may further comprise at least one organic rubber other than the above polyorganosiloxane.

Abstract: A silicone elastomer composition which has novel crosslinking points comprises (A) 100 parts by weight of a polyorganosiloxane of a polymerization degree of at least 20, wherein the organic groups are selected from monovalent substituted and unsubstituted hydrocarbon groups and are attached to silicon atom, and at least two of the organic groups are monovalent hydrocarbon groups possessing at least five carbon astoms and a carbon-carbon double bond bonded to a silicon atom via at least one carbon atom, (B) 5 to 200 parts by weight of an inorganic filler having a specific surface area of at least 50 m.sup.2 /g, and (C) 0.1 to 25 parts by weight of a vulcanizer selected from the group consisting of sulfur, sulfur donor, substituted or unsubstituted alkylphenol resins, and quinoids.