Abstract: A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.

Abstract: A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.

Abstract: In a semiconductor device, each of a first connection metal member, a second connection metal member, a third connection metal member, and a fourth connection metal member electrically connects a corresponding line to a corresponding one of main electrodes formed on lower surfaces and upper surfaces of first and second semiconductor elements. A cross-sectional area of each of the first connection metal member, the second connection metal member, the third connection metal member, and the fourth connection metal member is larger than a cross-sectional area of a fifth connection metal member that is disposed at a region located outside regions of the first and second semiconductor elements in a plan view.

Abstract: In a semiconductor device, each of a first connection metal member, a second connection metal member, a third connection metal member, and a fourth connection metal member electrically connects a corresponding line to a corresponding one of main electrodes formed on lower surfaces and upper surfaces of first and second semiconductor elements. A cross-sectional area of each of the first connection metal member, the second connection metal member, the third connection metal member, and the fourth connection metal member is larger than a cross-sectional area of a fifth connection metal member that is disposed at a region located outside regions of the first and second semiconductor elements in a plan view.

Abstract: In a method of producing an electronic device, a thermoplastic resin film is sandwiched between an electronic component having electrodes and a mounting member having a substrate to produce a lamination assembly. Via holes are formed in the thermoplastic resin film and filled with conductive paste. Through holes as depressed sections are formed in at least one of an area in the substrate, which faces the thermoplastic resin film, and an area in a connecting section formed on the substrate and which is not contact with the conductive paste in the via holes. The lamination assembly is heated and pressed in a lamination direction, thereof, simultaneously in order to sinter the conductive paste in the via holes. This produces an interlayer connection member in each via hole and the electronic device.

Abstract: A multilayer board includes a thermoplastic resin film layer, a pattern layer layered on the thermoplastic resin film layer, and a conductor pattern. The thermoplastic resin film layer is made of a plurality of thermoplastic resin films layered with each other, and has two adhesive layers and an interlayer located between the two adhesive layers. Each of the adhesive layers has an interlayer connector passing through the adhesive layer in a thickness direction. The conductor pattern is located on at least one of the pattern layer and the interlayer at a position opposing to the interlayer connector.

Abstract: In order to fill conductive paste including metal particles in a via hole formed in a film having a surface made of thermoplastic resin, mirror finish is performed with respect to the surface of the film so that surface roughness of the film becomes smaller than a minimum particle diameter of the metal particles included in the conductive paste. Thus, even when the conductive paste is directly put on the surface of the film and is moved on the surface of the film by using a squeegee, most of the metal particles do not remain on the surface of the film.

Abstract: A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.

Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Abstract: A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.

Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.