Abstract: An electronic device cooling apparatus including a cooling device including a heat conductive plate formed with a flow path, a circulating pump, a liquid storage tank upper chamber and lower chamber provided on the upper and lower side of the heat conductive plate, and a bypass provided with the heat conductive plate so as to allow the cooling medium to pass through the liquid storage tank upper chamber and the liquid storage tank lower chamber.

Abstract: An expansion tank device 14 comprises a tank installation base 16 having a cooling liquid channel 17 and an expansion tank 18 provided on the upper surface of the installation base 16. The base 16 has a communication hole 19 for holding space above the upper surface thereof in communication with the cooling liquid channel 17. The expansion tank 18 has a tank main body 21 including an upwardly bulging portion 22 having an opening at its lower end, and a bottom plate 23 joined to the lower end of the tank main body 21 for closing the lower-end opening of the bulging portion 22 and joined to the upper surface of the tank installation base 16. The bottom plate 23 is provided at a portion thereof corresponding to the communication hole 19 with a through hole 25 communicating with the communication hole 19.

Abstract: An expansion tank device 14 comprises a tank installation base 16 having a cooling liquid channel 17 and an expansion tank 18 provided on the upper surface of the installation base 16. The base 16 has a communication hole 19 for holding space above the upper surface thereof in communication with the cooling liquid channel 17. The expansion tank 18 has a tank main body 21 including an upwardly bulging portion 22 having an opening at its lower end, and a bottom plate 23 joined to the lower end of the tank main body 21 for closing the lower-end opening of the bulging portion 22 and joined to the upper surface of the tank installation base 16. The bottom plate 23 is provided at a portion thereof corresponding to the communication hole 19 with a through hole 25 communicating with the communication hole 19.

Abstract: A liquid storage tank 4 of an electronic device cooling apparatus that diffuses heat generated from a heat generating component by circulation of a cooling medium to carry out cooling has cooling means, an upper cover 6a, and a lower cover 6b. An upper space 7a formed by the cooling means and the upper cover 6a is spatially connected to a flow path 2 through a branch hole 8. Further, the upper space 7a is spatially connected to a lower space 7b formed by the lower cover 6b and the cooling means through a bypass 9.