Abstract: An image pickup device provided on a base board, comprises an image pickup element provided on the base board and including a photoelectrically converting section in which pixels are arranged, a peripheral surface formed around the photoelectrically converting section and a side surface crossing the peripheral surface; an optical member including a lens section to form an image of an object onto the photoelectrically converting section of the image pickup element, a leg section to support the lens section and a contact surface to be brought in contact with the image pickup element, wherein the lens section, the leg section and the contact surface are made in a single body. The optical member is mounted on the image pickup element such that the contact surface is brought in contact with the peripheral surface or with a surface member when the surface member is provided on the peripheral surface.

Abstract: A solid image pickup device includes an image pickup unit on which image pickup elements are arranged in a two dimensional form, a print on which the image pickup unit is mounted, and protrusions formed in a pattern form of a conductive material on a floor area, of the print board, covered by the image pickup unit such that the protrusions surround a central part of the floor area, wherein the image pickup unit is fixed with an adhesive on the protrusions and the floor area of the print board.

Abstract: An image pickup device provided on a base board, comprises an image pickup element provided on the base board and including a photoelectrically converting section in which pixels are arranged, a peripheral surface formed around the photoelectrically converting section and a side surface crossing the peripheral surface; an optical member including a lens section to form an image of an object onto the photoelectrically converting section of the image pickup element, a leg section to support the lens section and a contact surface to be brought in contact with the image pickup element, wherein the lens section, the leg section and the contact surface are made in a single body. The optical member is mounted on the image pickup element such that the contact surface is brought in contact with the peripheral surface or with a surface member when the surface member is provided on the peripheral surface.

Abstract: An image pickup device provided on a base board, comprises an image pickup element provided on the base board and including a photoelectrically converting section in which pixels are arranged, a peripheral surface formed around the photoelectrically converting section and a side surface crossing the peripheral surface; an optical member including a lens section to form an image of an object onto the photoelectrically converting section of the image pickup element, a leg section to support the lens section and a contact surface to be brought in contact with the image pickup element, wherein the lens section, the leg section and the contact surface are made in a single body. The optical member is mounted on the image pickup element such that the contact surface is brought in contact with the peripheral surface or with a surface member when the surface member is provided on the peripheral surface.

Abstract: An image pickup device includes an optical member; a semiconductor image pickup element having a photoelectric converter for photoelectrically converting a light flux converged by the optical member into electric signal and for storing the electric signal thereon, and an analog circuit being adjacent to the photoelectric converter for outputting the stored electric signal in the photoelectrical converter; and an incident light preventing portion for preventing a light flux from a space between a wiring layer provided on the analog circuit and a wiring layer provided on the photoelectric converter.

Abstract: A capsule type medical device to conduct an operation in an internal organic portion of a body, is provided with a capsule body to move in the internal organic portion; and an operating member incorporated in the capsule body and to conduct the operation in the internal organic portion. The capsule body includes a bellow section formed on a peripheral surface of the capsule body such that the bellow section stretches or contracts in a longitudinal direction of the capsule body.

Abstract: A solid image pickup device includes an image pickup unit on which image pickup elements are arranged in a two dimensional form, a print on which the image pickup unit is mounted, and protrusions formed in a pattern form of a conductive material on a floor area, of the print board, covered by the image pickup unit such that the protrusions surround a central part of the floor area, wherein the image pickup unit is fixed with an adhesive on the protrusions and the floor area of the print board.

Abstract: An imaging unit mounted on a compact portable terminal equipment such as a cellular phone set, etc. On a side of a flexible printed circuit board (FPC) having an opening (20) at a predetermined position thereof, an imaging element (2) is provided such that at least a part of the opening is closed and an imaging area is exposed. The imaging element is connected by a flip-chip package. On the other side of the flexible printed circuit board, a reinforcing plate (10) made of a material of a liner expansion coefficient of less than 1×10?5 (cm/cm/° C.) is attached to reinforce the flexible printed circuit board. Thus, it becomes possible to provide an imaging unit (100) having superior resistance against the heat shock when the imaging element is connected the imaging unit and the heat shock when the portable terminal equipment in which the imaging unit is arranged is used.

Abstract: An image pickup device includes an optical member; a semiconductor image pickup element having a photoelectric converter for photoelectrically converting a light flux converged by the optical member into electric signal and for storing the electric signal thereon, and an analog circuit being adjacent to the photoelectric converter for outputting the stored electric signal in the photoelectrical converter; and an incident light preventing portion for preventing a light flux from a space between a wiring layer provided on the analog circuit and a wiring layer provided on the photoelectric converter.

Abstract: A producing method for an image pickup device in which an image pickup optical unit that picks up an image of an object is provided on a base board, wherein there are provided a first process for mounting an image sensor and other electric parts on the base board and a second process for assembling the image pickup optical unit on the base board from one direction, and the first process and the second process are independent from each other.

Abstract: A CMOS image sensor comprising: a light receiving unit as a photoelectric conversion portion; a signal processing circuit unit; a first color filter layer array and a first microlens array layer, which are provided on an upper surface of the light receiving portion; and a second layer comprising at least one of a color filter layer and a microlens array layer, provided on a region of at least a portion of an upper surface of the signal processing circuit portion.

Abstract: An image pickup device having therein a base board on which an opening portion is formed, an image pickup element that is attached on the reverse side of the base board so that at least a part of the opening portion may be covered, an optical member that is attached to be in contact with the surface of the image pickup element, from the surface side of the base board through the opening portion, and converges incident light on the image pickup element, and an outer frame member that is mounted on the base board to cover the optical member and the opening portion.

Abstract: A producing method for an image pickup device in which an image pickup optical unit that picks up an image of an object is provided on a base board, wherein there are provided a first process for mounting an image sensor and other electric parts on the base board and a second process for assembling the image pickup optical unit on the base board from one direction, and the first process and the second process are independent from each other.

Abstract: A CMOS image sensor comprising: a light receiving unit as a photoelectric conversion portion; a signal processing circuit unit; a first color filter layer array and a first microlens array layer, which are provided on an upper surface of the light receiving portion; and a second layer comprising at least one of a color filter layer and a microlens array layer, provided on a region of at least a portion of an upper surface of the signal processing circuit portion.

Abstract: An image pickup device provided on a base board, comprises an image pickup element provided on the base board and including a photoelectrically converting section in which pixels are arranged, a peripheral surface formed around the photoelectrically converting section and a side surface crossing the peripheral surface; an optical member including a lens section to form an image of an object onto the photoelectrically converting section of the image pickup element, a leg section to support the lens section and a contact surface to be brought in contact with the image pickup element, wherein the lens section, the leg section and the contact surface are made in a single body. The optical member is mounted on the image pickup element such that the contact surface is brought in contact with the peripheral surface or with a surface member when the surface member is provided on the peripheral surface.